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H. BERNHARD POGGE
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HOPEWELL JUNCTION, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Structure and method to improve current-carrying capabilities of C4...
Patent number
8,367,543
Issue date
Feb 5, 2013
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal filled through via structure for providing vertical wafer-to-...
Patent number
7,821,120
Issue date
Oct 26, 2010
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip and wafer integration process using vertical connections
Patent number
7,564,118
Issue date
Jul 21, 2009
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip and wafer integration process using vertical connections
Patent number
7,388,277
Issue date
Jun 17, 2008
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional device fabrication method
Patent number
7,354,798
Issue date
Apr 8, 2008
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal filled through via structure for providing vertical wafer-to-...
Patent number
7,344,959
Issue date
Mar 18, 2008
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional integrated CMOS-MEMS device and process for makin...
Patent number
7,071,031
Issue date
Jul 4, 2006
International Business Machines Corporation
H. Bernhard Pogge
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Process for making fine pitch connections between devices and struc...
Patent number
7,049,697
Issue date
May 23, 2006
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for heat dissipation in semiconductor modules
Patent number
7,049,695
Issue date
May 23, 2006
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating integrated electronic chip with an interconne...
Patent number
6,864,165
Issue date
Mar 8, 2005
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip and wafer integration process using vertical connections
Patent number
6,856,025
Issue date
Feb 15, 2005
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional integrated CMOS-MEMS device and process for makin...
Patent number
6,835,589
Issue date
Dec 28, 2004
International Business Machines Corporation
H. Bernhard Pogge
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Process for making fine pitch connections between devices and struc...
Patent number
6,737,297
Issue date
May 18, 2004
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for chip testing
Patent number
6,730,529
Issue date
May 4, 2004
International Business Machines Corporation
Howard L. Kalter
G01 - MEASURING TESTING
Information
Patent Grant
Fabrication of a hybrid integrated circuit device including an opto...
Patent number
6,640,021
Issue date
Oct 28, 2003
International Business Machines Corporation
H. Bernhard Pogge
G02 - OPTICS
Information
Patent Grant
Chip and wafer integration process using vertical connections
Patent number
6,599,778
Issue date
Jul 29, 2003
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer thickness compensation for interchip planarity
Patent number
6,548,325
Issue date
Apr 15, 2003
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Double-sided wafer exposure method and device
Patent number
6,460,265
Issue date
Oct 8, 2002
International Business Machines Corporation
H. Bernhard Pogge
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Process for making fine pitch connections between devices and struc...
Patent number
6,444,560
Issue date
Sep 3, 2002
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and process for multi-chip chip attach with reduced risk...
Patent number
6,429,045
Issue date
Aug 6, 2002
International Business Machines Corporation
Toshiharu Furukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional chip stacking assembly
Patent number
6,355,501
Issue date
Mar 12, 2002
International Business Machines Corporation
Ka Hing Fung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer thickness compensation for interchip planarity
Patent number
6,333,553
Issue date
Dec 25, 2001
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for precision alignment of chips for mounting on a substrate
Patent number
6,110,806
Issue date
Aug 29, 2000
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a very dense chip package
Patent number
6,087,199
Issue date
Jul 11, 2000
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for precise multichip integration and product thereof
Patent number
6,066,513
Issue date
May 23, 2000
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure for precision multichip assembly
Patent number
6,025,638
Issue date
Feb 15, 2000
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Very dense chip package
Patent number
5,998,868
Issue date
Dec 7, 1999
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for chip testing
Patent number
5,899,703
Issue date
May 4, 1999
International Business Machines Corporation
Howard L. Kalter
G01 - MEASURING TESTING
Information
Patent Grant
Very dense integrated circuit package and method for forming the same
Patent number
5,866,443
Issue date
Feb 2, 1999
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Very dense integrated circuit package
Patent number
5,814,885
Issue date
Sep 29, 1998
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS
Publication number
20080230891
Publication date
Sep 25, 2008
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL FILLED THROUGH VIA STRUCTURE FOR PROVIDING VERTICAL WAFER-TO-...
Publication number
20080105976
Publication date
May 8, 2008
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR...
Publication number
20070252287
Publication date
Nov 1, 2007
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD TO IMPROVE CURRENT-CARRYING CAPABILITIES OF C4...
Publication number
20070222073
Publication date
Sep 27, 2007
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated electronic chip and interconnect device and process for...
Publication number
20060278998
Publication date
Dec 14, 2006
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-dimensional device fabrication method
Publication number
20060121690
Publication date
Jun 8, 2006
H Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for making fine pitch connections between devices and struc...
Publication number
20050173800
Publication date
Aug 11, 2005
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip and wafer integration process using vertical connections
Publication number
20050121711
Publication date
Jun 9, 2005
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR...
Publication number
20050056943
Publication date
Mar 17, 2005
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING INTEGRATED ELECTRONIC CHIP WITH AN INTERCONNE...
Publication number
20050056942
Publication date
Mar 17, 2005
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three-dimensional integrated CMOS-MEMS device and process for makin...
Publication number
20040097002
Publication date
May 20, 2004
International Business Machines Corporation
H. Bernhard Pogge
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Three-dimensional integrated CMOS-MEMS device and process for makin...
Publication number
20040097004
Publication date
May 20, 2004
International Business Machine Corporation
H. Bernhard Pogge
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Chip and wafer integration process using vertical connections
Publication number
20030215984
Publication date
Nov 20, 2003
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS
Publication number
20030111733
Publication date
Jun 19, 2003
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fabrication of a hybrid integrated circuit device including an opto...
Publication number
20030108269
Publication date
Jun 12, 2003
International Business Machines Corporation
H. Bernhard Pogge
G02 - OPTICS
Information
Patent Application
Process for making fine pitch connections between devices and struc...
Publication number
20030015788
Publication date
Jan 23, 2003
International Business Machines Corporation
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND PROCESS FOR MULTI-CHIP CHIP ATTACH WITH REDUCED RISK...
Publication number
20020106893
Publication date
Aug 8, 2002
International Business Machines Corporation
Toshiharu Furukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer thickness compensation for interchip planarity
Publication number
20020011652
Publication date
Jan 31, 2002
H. Bernhard Pogge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-SIDED WAFER EXPOSURE METHOD AND DEVICE
Publication number
20010001900
Publication date
May 31, 2001
H. BERNHARD POGGE
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY