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Hakeem Yusuff
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Hopewell Junction, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Three dimensional integration and methods of through silicon via cr...
Patent number
8,586,431
Issue date
Nov 19, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional integration and methods of through silicon via cr...
Patent number
8,569,154
Issue date
Oct 29, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional integration and methods of through silicon via cr...
Patent number
8,492,252
Issue date
Jul 23, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional integration and methods of through silicon via cr...
Patent number
8,415,238
Issue date
Apr 9, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional integration with through silicon vias having mult...
Patent number
8,399,180
Issue date
Mar 19, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
THREE DIMENSIONAL INTEGRATION AND METHODS OF THROUGH SILICON VIA CR...
Publication number
20130237054
Publication date
Sep 12, 2013
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three Dimensional Integration and Methods of Through Silicon Via Cr...
Publication number
20120190196
Publication date
Jul 26, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three Dimensional Integration and Methods of Through Silicon Via Cr...
Publication number
20120190189
Publication date
Jul 26, 2012
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three Dimensional Integration With Through Silicon Vias Having Mult...
Publication number
20110171582
Publication date
Jul 14, 2011
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Three Dimensional Integration and Methods of Through Silicon Via Cr...
Publication number
20110171827
Publication date
Jul 14, 2011
International Business Machines Corporation
Mukta G. Farooq
H01 - BASIC ELECTRIC ELEMENTS