Han Chen

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package core assembly and fabrication methods
- Patent number 12,087,679
- Issue date Sep 10, 2024
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-block status dependent device operation
- Patent number 12,046,289
- Issue date Jul 23, 2024
- SanDisk Technologies LLC
- Han-Ping Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Planarization methods for packaging substrates
- Patent number 11,931,855
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Generation of dynamic design flows for integrated circuits
- Patent number 11,914,933
- Issue date Feb 27, 2024
- SiFive, Inc.
- Han Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,887,934
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 11,881,447
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 11,862,546
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Word line zoned adaptive initial program voltage for non-volatile m...
- Patent number 11,854,620
- Issue date Dec 26, 2023
- SanDisk Technologies LLC
- Erika Penzo
- G11 - INFORMATION STORAGE
Information Patent Grant
Substrate structuring methods
- Patent number 11,837,680
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for substrate registration and anchoring in inkjet printing
- Patent number 11,798,831
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High connectivity device stacking
- Patent number 11,742,330
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,715,700
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of micro-via formation for advanced packaging
- Patent number 11,705,365
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation system for package fabrication
- Patent number 11,676,832
- Issue date Jun 13, 2023
- Applied Materials, Inc.
- Kurtis Leschkies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Generation of dynamic design flows for integrated circuits
- Patent number 11,630,930
- Issue date Apr 18, 2023
- SiFive, Inc.
- Han Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Triggering next state verify in program loop for nonvolatile memory
- Patent number 11,521,691
- Issue date Dec 6, 2022
- SanDisk Technologies LLC
- Hua-Ling Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Package structures with built-in EMI shielding
- Patent number 11,521,937
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Steven Verhaverbeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,521,935
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,476,202
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drying process for high aspect ratio features
- Patent number 11,424,137
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Roman Gouk
- B08 - CLEANING
Information Patent Grant
Laser ablation for package fabrication
- Patent number 11,400,545
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Kurtis Leschkies
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,398,433
- Issue date Jul 26, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved polymer-copper adhesion
- Patent number 11,388,822
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for substrate registration and anchoring in inkjet printing
- Patent number 11,367,643
- Issue date Jun 21, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structuring methods
- Patent number 11,362,235
- Issue date Jun 14, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fine redistribution interconnect formation for advanced p...
- Patent number 11,342,256
- Issue date May 24, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchoring dies using 3D printing to form reconstructed wafer
- Patent number 11,329,003
- Issue date May 10, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for substrate registration and anchoring in inkjet printing
- Patent number 11,322,381
- Issue date May 3, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for via formation by micro-imprinting
- Patent number 11,281,094
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Roman Gouk
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
- Patent number 11,264,333
- Issue date Mar 1, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EFFICIENT AUTOCATALYTIC METALLIZATION OF POLYMERIC SURFACES
- Publication number 20240222142
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Tapash CHAKRABORTY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR LASER MACHINING OF A SUBSTRATE
- Publication number 20240123551
- Publication date Apr 18, 2024
- APPLIED MATERIALS ITALIA S.R.L.
- Jeffrey L. FRANKLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUB-BLOCK STATUS DEPENDENT DEVICE OPERATION
- Publication number 20240087650
- Publication date Mar 14, 2024
- SANDISK TECHNOLOGIES LLC
- Han-Ping Chen
- G11 - INFORMATION STORAGE
Information Patent Application
PRECHARGE SCHEME DURING PROGRAMMING OF A MEMORY DEVICE
- Publication number 20240079062
- Publication date Mar 7, 2024
- SANDISK TECHNOLOGIES LLC
- Jiacen Guo
- G11 - INFORMATION STORAGE
Information Patent Application
DYNAMIC WORD LINE BOOSTING DURING PROGRAMMING OF A MEMORY DEVICE
- Publication number 20240079063
- Publication date Mar 7, 2024
- SANDISK TECHNOLOGIES LLC
- Han-Ping Chen
- G11 - INFORMATION STORAGE
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20240021533
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20240021582
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
READ PASS VOLTAGE DEPENDENT RECOVERY VOLTAGE SETTING BETWEEN PROGRA...
- Publication number 20230410920
- Publication date Dec 21, 2023
- SANDISK TECHNOLOGIES LLC
- Han-Ping Chen
- G11 - INFORMATION STORAGE
Information Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
- Publication number 20230282498
- Publication date Sep 7, 2023
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF DYNAMIC DESIGN FLOWS FOR INTEGRATED CIRCUITS
- Publication number 20230222263
- Publication date Jul 13, 2023
- SiFive, Inc.
- Han Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20230187370
- Publication date Jun 15, 2023
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20230148220
- Publication date May 11, 2023
- Applied Materials, Inc.
- Steven VERHAVERBEKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER FRAME FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20230070053
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORD LINE ZONED ADAPTIVE INITIAL PROGRAM VOLTAGE FOR NON-VOLATILE M...
- Publication number 20220406380
- Publication date Dec 22, 2022
- SANDISK TECHNOLOGIES LLC
- Erika Penzo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIGGERING NEXT STATE VERIFY IN PROGRAM LOOP FOR NONVOLATILE MEMORY
- Publication number 20220392551
- Publication date Dec 8, 2022
- SANDISK TECHNOLOGIES LLC
- Hua-Ling Hsu
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING
- Publication number 20220375787
- Publication date Nov 24, 2022
- Applied Materials, Inc.
- Wei-Sheng LEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
- Publication number 20220336246
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING
- Publication number 20220328336
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Daihua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURING METHODS
- Publication number 20220278248
- Publication date Sep 1, 2022
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
- Publication number 20220171281
- Publication date Jun 2, 2022
- Applied Materials, Inc.
- Roman GOUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH BUILT-IN EMI SHIELDING
- Publication number 20220157740
- Publication date May 19, 2022
- Applied Materials, Inc.
- Steven VERHAVERBEKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20220139884
- Publication date May 5, 2022
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Improved Polymer-Copper Adhesion
- Publication number 20220071023
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Application
LASER ABLATION SYSTEM FOR PACKAGE FABRICATION
- Publication number 20220028709
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ABLATION FOR PACKAGE FABRICATION
- Publication number 20210346983
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Kurtis LESCHKIES
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF DYNAMIC DESIGN FLOWS FOR INTEGRATED CIRCUITS
- Publication number 20210326500
- Publication date Oct 21, 2021
- SiFive, Inc.
- Han Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH CONNECTIVITY DEVICE STACKING
- Publication number 20210288027
- Publication date Sep 16, 2021
- Applied Materials, Inc.
- Kurtis LESCHKIES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210257289
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
- Publication number 20210257306
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
- Publication number 20210257307
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package core assembly and fabrication methods

Sub-block status dependent device operation

Planarization methods for packaging substrates

Generation of dynamic design flows for integrated circuits

Package structure and fabrication methods

Package core assembly and fabrication methods

Package core assembly and fabrication methods

Word line zoned adaptive initial program voltage for non-volatile m...

Substrate structuring methods

Method for substrate registration and anchoring in inkjet printing

High connectivity device stacking

Reconstituted substrate structure and fabrication methods for heter...

Methods of micro-via formation for advanced packaging

Laser ablation system for package fabrication

Generation of dynamic design flows for integrated circuits

Triggering next state verify in program loop for nonvolatile memory

Package structures with built-in EMI shielding

Package structure and fabrication methods

Reconstituted substrate structure and fabrication methods for heter...

Drying process for high aspect ratio features

Laser ablation for package fabrication

Reconstituted substrate structure and fabrication methods for heter...

Methods for improved polymer-copper adhesion

Method for substrate registration and anchoring in inkjet printing

Substrate structuring methods

Method of fine redistribution interconnect formation for advanced p...

Anchoring dies using 3D printing to form reconstructed wafer

Method for substrate registration and anchoring in inkjet printing

Method for via formation by micro-imprinting

Reconstituted substrate structure and fabrication methods for heter...

Patents Applicationslast 30 patents

EFFICIENT AUTOCATALYTIC METALLIZATION OF POLYMERIC SURFACES

APPARATUS AND METHOD FOR LASER MACHINING OF A SUBSTRATE

SUB-BLOCK STATUS DEPENDENT DEVICE OPERATION

PRECHARGE SCHEME DURING PROGRAMMING OF A MEMORY DEVICE

DYNAMIC WORD LINE BOOSTING DURING PROGRAMMING OF A MEMORY DEVICE

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...

HIGH CONNECTIVITY DEVICE STACKING

READ PASS VOLTAGE DEPENDENT RECOVERY VOLTAGE SETTING BETWEEN PROGRA...

LASER ABLATION SYSTEM FOR PACKAGE FABRICATION

GENERATION OF DYNAMIC DESIGN FLOWS FOR INTEGRATED CIRCUITS

PACKAGE STRUCTURE AND FABRICATION METHODS

SEMICONDUCTOR DEVICE PACKAGES

STIFFENER FRAME FOR SEMICONDUCTOR DEVICE PACKAGES

WORD LINE ZONED ADAPTIVE INITIAL PROGRAM VOLTAGE FOR NON-VOLATILE M...

TRIGGERING NEXT STATE VERIFY IN PROGRAM LOOP FOR NONVOLATILE MEMORY

METHODS OF MICRO-VIA FORMATION FOR ADVANCED PACKAGING

METHOD FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING

APPARATUS FOR SUBSTRATE REGISTRATION AND ANCHORING IN INKJET PRINTING

SUBSTRATE STRUCTURING METHODS

METHOD FOR VIA FORMATION BY MICRO-IMPRINTING

PACKAGE STRUCTURES WITH BUILT-IN EMI SHIELDING

HIGH CONNECTIVITY DEVICE STACKING

Methods for Improved Polymer-Copper Adhesion

LASER ABLATION SYSTEM FOR PACKAGE FABRICATION

LASER ABLATION FOR PACKAGE FABRICATION

GENERATION OF DYNAMIC DESIGN FLOWS FOR INTEGRATED CIRCUITS

HIGH CONNECTIVITY DEVICE STACKING

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

PACKAGE STRUCTURE AND FABRICATION METHODS

RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...