Hans J. Hacke

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a semiconductor device in chip format
- Patent number 6,973,717
- Issue date Dec 13, 2005
- Infineon Technologies AG
- Hans-Jürgen Hacke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic chip component with an integrated circuit and fabricatio...
- Patent number 6,969,917
- Issue date Nov 29, 2005
- Infineon Technologies AG
- Hans-Jürgen Hacke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device having microscopically small contact areas and me...
- Patent number 6,946,725
- Issue date Sep 20, 2005
- Infineon Technologies AG
- Hans-Jürgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including a housing and a substrate
- Patent number 6,930,383
- Issue date Aug 16, 2005
- Infineon Technologies AG
- Hans-Jürgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device in chip format and method for producing it
- Patent number 6,818,090
- Issue date Nov 16, 2004
- Infineon Technologies AG
- Hans-Jürgen Hacke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing integrated circuits and semiconductor wafe...
- Patent number 6,506,631
- Issue date Jan 14, 2003
- Infineon Technologies AG
- Hans-Jürgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible wiring for the transformation of a substrate with edge con...
- Patent number 6,504,104
- Issue date Jan 7, 2003
- Siemens Aktiengesellschaft
- Hans-Juergen Hacke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transforming a substrate with edge contacts into a ball...
- Patent number 6,256,877
- Issue date Jul 10, 2001
- Siemens Aktiengesellschaft
- Hans-Juergen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack arrangement for two semiconductor memory chips and printed bo...
- Patent number 6,157,541
- Issue date Dec 5, 2000
- Siemens Aktiengesellschaft
- Hans-Juergen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing LED rows using a temporary rigid auxiliary...
- Patent number 5,043,296
- Issue date Aug 27, 1991
- Siemens Aktiengesellschaft
- Hans-Jurgen Hacke
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Manufacture of fine structures for semiconductor contacting
- Patent number 4,795,694
- Issue date Jan 3, 1989
- Siemens Aktiengesellschaft
- Alfred Groeber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the production of printed circuits with solder rejectin...
- Patent number 4,268,349
- Issue date May 19, 1981
- Siemens Aktiengesellschaft
- Hans-Juergen Hacke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intermediate member for mounting and contacting a semiconductor body
- Patent number 4,210,926
- Issue date Jul 1, 1980
- Siemens Aktiengesellschaft
- Hans J. Hacke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods for producing an electronic device having microscopically s...
- Publication number 20050255633
- Publication date Nov 17, 2005
- Infineon Technologies AG
- Hans-Jurgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a semiconductor device in chip format
- Publication number 20050028362
- Publication date Feb 10, 2005
- Infineon Technologies AG
- Hans-Jurgen Hacke
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic chip component with an integrated circuit and fabricatio...
- Publication number 20030127750
- Publication date Jul 10, 2003
- Hans-Jurgen Hacke
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic component including a housing and a substrate
- Publication number 20030116840
- Publication date Jun 26, 2003
- Hans-Jurgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for transforming a substrate with edge contacts into a ball...
- Publication number 20020125042
- Publication date Sep 12, 2002
- Hans-Juergen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for transforming a substrate with edge contacts into a ball...
- Publication number 20020017398
- Publication date Feb 14, 2002
- Hans-Juergen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board for use in the testing of electrical componen...
- Publication number 20010050566
- Publication date Dec 13, 2001
- Hans-Jurgen Hacke
- G01 - MEASURING TESTING
Information Patent Application
Electronic component having microscopically small contact areas and...
- Publication number 20010028102
- Publication date Oct 11, 2001
- Hans-Jurgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing integrated circuits and semiconductor wafe...
- Publication number 20010019855
- Publication date Sep 6, 2001
- Hans-Jurgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device in chip format and method for producing it
- Publication number 20010011675
- Publication date Aug 9, 2001
- Hans-Jurgen Hacke
- H01 - BASIC ELECTRIC ELEMENTS

Hans J. Hacke

Person

Patents Grantslast 30 patents

Method for producing a semiconductor device in chip format

Electronic chip component with an integrated circuit and fabricatio...

Electronic device having microscopically small contact areas and me...

Electronic component including a housing and a substrate

Semiconductor device in chip format and method for producing it

Method for manufacturing integrated circuits and semiconductor wafe...

Flexible wiring for the transformation of a substrate with edge con...

Method for transforming a substrate with edge contacts into a ball...

Stack arrangement for two semiconductor memory chips and printed bo...

Method of manufacturing LED rows using a temporary rigid auxiliary...

Manufacture of fine structures for semiconductor contacting

Process for the production of printed circuits with solder rejectin...

Intermediate member for mounting and contacting a semiconductor body

Patents Applicationslast 30 patents

Methods for producing an electronic device having microscopically s...

Method for producing a semiconductor device in chip format

Electronic chip component with an integrated circuit and fabricatio...

Electronic component including a housing and a substrate

Method for transforming a substrate with edge contacts into a ball...

Method for transforming a substrate with edge contacts into a ball...

Printed circuit board for use in the testing of electrical componen...

Electronic component having microscopically small contact areas and...

Method for manufacturing integrated circuits and semiconductor wafe...

Semiconductor device in chip format and method for producing it