Hanyi Ding

Person

Colchester, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure with optical absorber layer over optic...
- Patent number 11,536,900
- Issue date Dec 27, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Benjamin V. Fasano
- G02 - OPTICS
Information Patent Grant
Microstrip line structures having multiple wiring layers and includ...
- Patent number 11,532,864
- Issue date Dec 20, 2022
- GLOBALFOUNDRIES U.S. INC.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with optical absorber layer over optic...
- Patent number 11,204,463
- Issue date Dec 21, 2021
- GLOBALFOUNDRIES U.S. INC.
- Benjamin V. Fasano
- G02 - OPTICS
Information Patent Grant
Probe for pic die with related test assembly and method
- Patent number 11,002,763
- Issue date May 11, 2021
- GLOBALFOUNDRIES U.S. INC.
- Ye Wang
- G01 - MEASURING TESTING
Information Patent Grant
Optical on-wafer probing with v-groove couplers
- Patent number 10,914,897
- Issue date Feb 9, 2021
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- G02 - OPTICS
Information Patent Grant
Device structures for a silicon-on-insulator substrate with a high-...
- Patent number 10,446,644
- Issue date Oct 15, 2019
- GLOBALFOUNDRIES Inc.
- Renata Camillo-Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for vector s-parameter measurements
- Patent number 10,379,191
- Issue date Aug 13, 2019
- GLOBALGOUNDRIES INC.
- Adem G. Aydin
- G01 - MEASURING TESTING
Information Patent Grant
Separation of integrated circuit structure from adjacent chip
- Patent number 10,256,204
- Issue date Apr 9, 2019
- GLOBALFOUNDRIES Inc.
- Glen E Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for vector s-parameter measurements
- Patent number 9,910,124
- Issue date Mar 6, 2018
- GLOBALFOUNDRIES Inc.
- Adem G. Aydin
- G01 - MEASURING TESTING
Information Patent Grant
Inline measurement of through-silicon via depth
- Patent number 9,865,514
- Issue date Jan 9, 2018
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter wave phase shifters using tunable transmission lines
- Patent number 9,813,264
- Issue date Nov 7, 2017
- International Business Machines Corporation
- Hanyi Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Millimeter wave phase shifters using tunable transmission lines
- Patent number 9,800,434
- Issue date Oct 24, 2017
- International Business Machines Corporation
- Hanyi Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bipolar junction transistors with double-tapered emitter fingers
- Patent number 9,728,603
- Issue date Aug 8, 2017
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On chip antenna with opening
- Patent number 9,728,838
- Issue date Aug 8, 2017
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for in-line defect non-contact tests
- Patent number 9,721,854
- Issue date Aug 1, 2017
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power radio frequency (RF) in-line wafer testing
- Patent number 9,599,657
- Issue date Mar 21, 2017
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- G01 - MEASURING TESTING
Information Patent Grant
Reconfigurable bandstop filter
- Patent number 9,595,936
- Issue date Mar 14, 2017
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bipolar junction transistor with multiple emitter fingers
- Patent number 9,543,403
- Issue date Jan 10, 2017
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frequency-locked voltage regulated loop
- Patent number 9,503,106
- Issue date Nov 22, 2016
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Reconfigurable branch line coupler
- Patent number 9,466,868
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconfigurable rat race coupler
- Patent number 9,461,612
- Issue date Oct 4, 2016
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Through printed circuit board (PCB) vias
- Patent number 9,408,304
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Inc.
- Dana H. Brown
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
On chip bias temperature instability characterization of a semicond...
- Patent number 9,404,960
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- G01 - MEASURING TESTING
Information Patent Grant
Wafer thinning endpoint detection for TSV technology
- Patent number 9,349,661
- Issue date May 24, 2016
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Notch filter structure with open stubs in semiconductor substrate a...
- Patent number 9,263,782
- Issue date Feb 16, 2016
- GLOBALFOUNDRIES Inc.
- Renata Camillo-Castillo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Millimeter wave wafer level chip scale packaging (WLCSP) device
- Patent number 9,236,361
- Issue date Jan 12, 2016
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ring oscillator testing with power sensing resistor
- Patent number 9,217,769
- Issue date Dec 22, 2015
- International Business Machines Corporation
- Hanyi Ding
- G01 - MEASURING TESTING
Information Patent Grant
High frequency phase shifter array testing
- Patent number 9,214,726
- Issue date Dec 15, 2015
- International Business Machines Corporation
- Adem G. Aydin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor structure having embedded airgap
- Patent number 9,208,938
- Issue date Dec 8, 2015
- GLOBALFOUNDRIES Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, structure, and design structure for a through-silicon-via W...
- Patent number 9,171,121
- Issue date Oct 27, 2015
- GlobalFoundries U.S. 2 LLC
- Hanyi Ding
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL RECEIVER PHOTODIODE TESTING USING TEST OPTICAL TERMINAL AT...
- Publication number 20230314274
- Publication date Oct 5, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Hanyi Ding
- G02 - OPTICS
Information Patent Application
MICROSTRIP TRANSMISSION LINES WITH INDUCTIVE AND CAPACITIVE SECTIONS
- Publication number 20220311116
- Publication date Sep 29, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH OPTICAL ABSORBER LAYER OVER OPTIC...
- Publication number 20220057575
- Publication date Feb 24, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Benjamin V. Fasano
- G02 - OPTICS
Information Patent Application
OPTICAL ON-WAFER PROBING WITH V-GROOVE COUPLERS
- Publication number 20200192033
- Publication date Jun 18, 2020
- GLOBALFOUNDRIES INC.
- Hanyi Ding
- G01 - MEASURING TESTING
Information Patent Application
PROBE FOR PIC DIE WITH RELATED TEST ASSEMBLY AND METHOD
- Publication number 20200049737
- Publication date Feb 13, 2020
- GLOBALFOUNDRIES INC.
- Ye Wang
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGES WITH REDUCED TEMPERATURE VARIATION
- Publication number 20190267304
- Publication date Aug 29, 2019
- GLOBALFOUNDRIES INC.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR VECTOR S-PARAMETER MEASUREMENTS
- Publication number 20180136304
- Publication date May 17, 2018
- GLOBALFOUNDRIES INC.
- Adem G. AYDIN
- G01 - MEASURING TESTING
Information Patent Application
SEPARATION OF INTEGRATED CIRCUIT STRUCTURE FROM ADJACENT CHIP
- Publication number 20180130733
- Publication date May 10, 2018
- GLOBALFOUNDRIES INC.
- Glen E. Richard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND RESISTOR STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20180102318
- Publication date Apr 12, 2018
- GLOBALFOUNDRIES INC.
- Cathryn J. Christiansen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION STRUCTURES FOR CIRCUITS SHARING A SUBSTRATE
- Publication number 20170317166
- Publication date Nov 2, 2017
- GLOBALFOUNDRIES INC.
- Chengwen Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR VECTOR S-PARAMETER MEASUREMENTS
- Publication number 20170227622
- Publication date Aug 10, 2017
- GLOBALFOUNDRIES INC.
- Adem G. AYDIN
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGES WITH REDUCED TEMPERATURE VARIATION
- Publication number 20160372396
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES INC.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR JUNCTION TRANSISTORS WITH DOUBLE-TAPERED EMITTER FINGERS
- Publication number 20160372548
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES INC.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE STRUCTURES FOR A SILICON-ON-INSULATOR SUBSTRATE WITH A HIGH-...
- Publication number 20160372582
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES INC.
- Renata Camillo-Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON CHIP ANTENNA WITH OPENING
- Publication number 20160308270
- Publication date Oct 20, 2016
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR JUNCTION TRANSISTOR WITH MULTIPLE EMITTER FINGERS
- Publication number 20160211345
- Publication date Jul 21, 2016
- GLOBALFOUNDRIES INC.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP
- Publication number 20160012952
- Publication date Jan 14, 2016
- GLOBALFOUNDRIES INC.
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE PHASE SHIFTERS USING TUNABLE TRANSMISSION LINES
- Publication number 20150365259
- Publication date Dec 17, 2015
- International Business Machines Corporation
- HANYI DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE BANDSTOP FILTER
- Publication number 20150341009
- Publication date Nov 26, 2015
- International Business Machines Corporation
- HANYI DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE RAT RACE COUPLER
- Publication number 20150341011
- Publication date Nov 26, 2015
- International Business Machines Corporation
- HANYI DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE BRANCH LINE COUPLER
- Publication number 20150303548
- Publication date Oct 22, 2015
- International Business Machines Corporation
- HANYI DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH PRINTED CIRCUIT BOARD (PCB) VIAS
- Publication number 20150208502
- Publication date Jul 23, 2015
- International Business Machines Corporation
- Dana H. BROWN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER THINNING ENDPOINT DETECTION FOR TSV TECHNOLOGY
- Publication number 20150206809
- Publication date Jul 23, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE MEASUREMENT OF THROUGH-SILICON VIA DEPTH
- Publication number 20150187667
- Publication date Jul 2, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON CHIP BIAS TEMPERATURE INSTABILITY CHARACTERIZATION OF A SEMICOND...
- Publication number 20150091601
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Hanyi Ding
- G01 - MEASURING TESTING
Information Patent Application
INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP
- Publication number 20150091686
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...
- Publication number 20150037913
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE
- Publication number 20150035145
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE, SYSTEM AND METHOD FOR DEVICE RADIO FREQUENCY (RF) RELIAB...
- Publication number 20150024693
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Donald J. Cook
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INLINE MEASUREMENT OF THROUGH-SILICON VIA DEPTH
- Publication number 20140332973
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Hanyi Ding
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit structure with optical absorber layer over optic...

Microstrip line structures having multiple wiring layers and includ...

Integrated circuit structure with optical absorber layer over optic...

Probe for pic die with related test assembly and method

Optical on-wafer probing with v-groove couplers

Device structures for a silicon-on-insulator substrate with a high-...

Apparatus and method for vector s-parameter measurements

Separation of integrated circuit structure from adjacent chip

Apparatus and method for vector s-parameter measurements

Inline measurement of through-silicon via depth

Millimeter wave phase shifters using tunable transmission lines

Millimeter wave phase shifters using tunable transmission lines

Bipolar junction transistors with double-tapered emitter fingers

On chip antenna with opening

Structure and method for in-line defect non-contact tests

High power radio frequency (RF) in-line wafer testing

Reconfigurable bandstop filter

Bipolar junction transistor with multiple emitter fingers

Frequency-locked voltage regulated loop

Reconfigurable branch line coupler

Reconfigurable rat race coupler

Through printed circuit board (PCB) vias

On chip bias temperature instability characterization of a semicond...

Wafer thinning endpoint detection for TSV technology

Notch filter structure with open stubs in semiconductor substrate a...

Millimeter wave wafer level chip scale packaging (WLCSP) device

Ring oscillator testing with power sensing resistor

High frequency phase shifter array testing

Inductor structure having embedded airgap

Method, structure, and design structure for a through-silicon-via W...

Patents Applicationslast 30 patents

OPTICAL RECEIVER PHOTODIODE TESTING USING TEST OPTICAL TERMINAL AT...

MICROSTRIP TRANSMISSION LINES WITH INDUCTIVE AND CAPACITIVE SECTIONS

INTEGRATED CIRCUIT STRUCTURE WITH OPTICAL ABSORBER LAYER OVER OPTIC...

OPTICAL ON-WAFER PROBING WITH V-GROOVE COUPLERS

PROBE FOR PIC DIE WITH RELATED TEST ASSEMBLY AND METHOD

CHIP PACKAGES WITH REDUCED TEMPERATURE VARIATION

APPARATUS AND METHOD FOR VECTOR S-PARAMETER MEASUREMENTS

SEPARATION OF INTEGRATED CIRCUIT STRUCTURE FROM ADJACENT CHIP

COMPOUND RESISTOR STRUCTURE FOR SEMICONDUCTOR DEVICE

ISOLATION STRUCTURES FOR CIRCUITS SHARING A SUBSTRATE

APPARATUS AND METHOD FOR VECTOR S-PARAMETER MEASUREMENTS

CHIP PACKAGES WITH REDUCED TEMPERATURE VARIATION

BIPOLAR JUNCTION TRANSISTORS WITH DOUBLE-TAPERED EMITTER FINGERS

DEVICE STRUCTURES FOR A SILICON-ON-INSULATOR SUBSTRATE WITH A HIGH-...

ON CHIP ANTENNA WITH OPENING

BIPOLAR JUNCTION TRANSISTOR WITH MULTIPLE EMITTER FINGERS

INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP

MILLIMETER WAVE PHASE SHIFTERS USING TUNABLE TRANSMISSION LINES

RECONFIGURABLE BANDSTOP FILTER

RECONFIGURABLE RAT RACE COUPLER

RECONFIGURABLE BRANCH LINE COUPLER

THROUGH PRINTED CIRCUIT BOARD (PCB) VIAS

WAFER THINNING ENDPOINT DETECTION FOR TSV TECHNOLOGY

INLINE MEASUREMENT OF THROUGH-SILICON VIA DEPTH

ON CHIP BIAS TEMPERATURE INSTABILITY CHARACTERIZATION OF A SEMICOND...

INDUCTOR STRUCTURE HAVING EMBEDDED AIRGAP

MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE AND...

MILLIMETER WAVE WAFER LEVEL CHIP SCALE PACKAGING (WLCSP) DEVICE

STRUCTURE, SYSTEM AND METHOD FOR DEVICE RADIO FREQUENCY (RF) RELIAB...

INLINE MEASUREMENT OF THROUGH-SILICON VIA DEPTH