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SUBSTRATE CONTACT IN WAFER BACKSIDE
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Taiwan Semiconductor Manufacturing Company, Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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CRUCIFORM BONDING STRUCTURE FOR 3D-IC
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ANTENNA MODULE
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Publication date May 18, 2023
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PEGATRON CORPORATION
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Chien-Yi Wu
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ELECTRONIC DEVICE
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Publication date Feb 2, 2023
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PEGATRON CORPORATION
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Chien-Yi Wu
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H01 - BASIC ELECTRIC ELEMENTS
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HEAT-SINK CHAMBERS
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Hewlett-Packard Development Company, L.P.
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Hao-Wu Yang
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G06 - COMPUTING CALCULATING COUNTING
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DISPLAY APPARATUS
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Publication date Jul 28, 2022
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AU OPTRONICS CORPORATION
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Hao-Shiun Yang
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G02 - OPTICS
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CHASSIS COMPONENTS
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Publication number 20220221917
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Publication date Jul 14, 2022
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Hewlett-Packard Development Company, L.P.
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Hung-Wen Chang
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CONTROLLING SPEED OF COOLING ELEMENTS
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Publication number 20220187885
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Publication date Jun 16, 2022
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Hewlett-Packard Development Company, L.P.
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Hung-Wen Chang
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ELECTRONIC DEVICE
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Publication number 20220167494
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Publication date May 26, 2022
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PEGATRON CORPORATION
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Chien-Yi Wu
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE
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Publication number 20210286205
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Publication date Sep 16, 2021
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AU OPTRONICS CORPORATION
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Chien-Chi CHEN
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G02 - OPTICS
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