Haobo CHEN

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lithographically defined vertical interconnect access (VIA) for a b...
- Patent number 12,334,447
- Issue date Jun 17, 2025
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap structures for high speed signal integrity
- Patent number 12,255,130
- Issue date Mar 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive route patterning for electronic substrates
- Patent number 12,027,466
- Issue date Jul 2, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with variable height conductive and dielectric elements
- Patent number 11,837,534
- Issue date Dec 5, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE
- Publication number 20250218957
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...
- Publication number 20250218999
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES
- Publication number 20250218926
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
- Publication number 20250192070
- Publication date Jun 12, 2025
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20250125307
- Publication date Apr 17, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES
- Publication number 20250112175
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...
- Publication number 20250112165
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...
- Publication number 20250113434
- Publication date Apr 3, 2025
- Intel Corporation
- Bai NIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105222
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Publication number 20250022786
- Publication date Jan 16, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
- Publication number 20250006645
- Publication date Jan 2, 2025
- Intel Corporation
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Lithographically defined vertical interconnect access (VIA) for a b...

Airgap structures for high speed signal integrity

Conductive route patterning for electronic substrates

Patternable die attach materials and processes for patterning

Substrate with variable height conductive and dielectric elements

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

MICROELECTRONIC ASSEMBLIES WITH EDGE STRESS REDUCTION IN GLASS CORES

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

ANISOTROPIC CONDUCTIVE CONNECTIONS FOR INTERCONNECT BRIDGES AND REL...

THROUGH GLASS VIA (TGV) WITH MODULATED PROFILE FOR CORE STRESS REDU...

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...