Haosheng Wu

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 12,214,468
- Issue date Feb 4, 2025
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Steam-assisted single substrate cleaning process and apparatus
- Patent number 12,106,976
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Jianshe Tang
- B08 - CLEANING
Information Patent Grant
Steam treatment stations for chemical mechanical polishing system
- Patent number 12,030,093
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B08 - CLEANING
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,986,926
- Issue date May 21, 2024
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature metal CMP for minimizing dishing and corrosion, and...
- Patent number 11,897,079
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature-based in-situ edge assymetry correction during CMP
- Patent number 11,865,671
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Control of steam generation for chemical mechanical polishing
- Patent number 11,833,637
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- F22 - STEAM GENERATION
Information Patent Grant
Temperature and slurry flow rate control in CMP
- Patent number 11,826,872
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,806,835
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of steam generation for chemical mechanical polishing
- Patent number 11,801,582
- Issue date Oct 31, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing temperature scanning apparatus for te...
- Patent number 11,752,589
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Grant
Steam-assisted single substrate cleaning process and apparatus
- Patent number 11,728,185
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Jianshe Tang
- B08 - CLEANING
Information Patent Grant
Temperature-based assymetry correction during CMP and nozzle for me...
- Patent number 11,697,187
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of steam for pre-heating of CMP components
- Patent number 11,633,833
- Issue date Apr 25, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Steam cleaning of CMP components
- Patent number 11,628,478
- Issue date Apr 18, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B08 - CLEANING
Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 11,597,052
- Issue date Mar 7, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Grant
Steam treatment stations for chemical mechanical polishing system
- Patent number 11,446,711
- Issue date Sep 20, 2022
- Applied Materials, Inc.
- Haosheng Wu
- B08 - CLEANING
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 11,077,536
- Issue date Aug 3, 2021
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry distribution device for chemical mechanical polishing
- Patent number 10,967,483
- Issue date Apr 6, 2021
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS TO CLEAN SUBSTRATE WITH ATOMIZING NOZZLE
- Publication number 20240408650
- Publication date Dec 12, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DETERMINING THE ORIENTATION OF A SUBSTRATE IN-SITU
- Publication number 20240359291
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Wei LU
- B24 - GRINDING POLISHING
Information Patent Application
STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20240342855
- Publication date Oct 17, 2024
- Applied Materials, Inc.
- Chad Pollard
- B24 - GRINDING POLISHING
Information Patent Application
COMPACT ADJUSTABLE SPRAY NOZZLE TO PRECISELY TARGET AREAS FOR RINSI...
- Publication number 20240326198
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Shaun VAN DER VEEN
- B24 - GRINDING POLISHING
Information Patent Application
STEAM TREATMENT STATIONS FOR CHEMICAL MECHANICAL POLISHING SYSTEM
- Publication number 20240307928
- Publication date Sep 19, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B08 - CLEANING
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY
- Publication number 20240253183
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Priscilla Michelle Diep LAROSA
- B24 - GRINDING POLISHING
Information Patent Application
ACOUSTIC CARRIER HEAD MONITORING
- Publication number 20240139900
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jeonghoon Oh
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20240109163
- Publication date Apr 4, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU...
- Publication number 20240066664
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Shou-Sung CHANG
- B08 - CLEANING
Information Patent Application
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...
- Publication number 20240066660
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING OF CMP TEMPERATURE CONTROL SYSTEM
- Publication number 20240042570
- Publication date Feb 8, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP
- Publication number 20240025006
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL
- Publication number 20230415296
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Shou-Sung Chang
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20230415297
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
IN-SITU CONDITIONER DISK CLEANING DURING CMP
- Publication number 20230390895
- Publication date Dec 7, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES
- Publication number 20230381922
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Chad Pollard
- B24 - GRINDING POLISHING
Information Patent Application
FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROC...
- Publication number 20230387625
- Publication date Nov 30, 2023
- Applied Materials, Inc.
- Chad Pollard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...
- Publication number 20230356351
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
STEAM-ASSISTED SINGLE SUBSTRATE CLEANING PROCESS AND APPARATUS
- Publication number 20230335418
- Publication date Oct 19, 2023
- Applied Materials, Inc.
- Jianshe TANG
- B08 - CLEANING
Information Patent Application
EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING
- Publication number 20230286107
- Publication date Sep 14, 2023
- Applied Materials, Inc.
- Kun Xu
- B24 - GRINDING POLISHING
Information Patent Application
USE OF STEAM FOR PRE-HEATING OF CMP COMPONENTS
- Publication number 20230256562
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
STEAM CLEANING OF CMP COMPONENTS
- Publication number 20230249225
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
POINT-OF-USE ULTRASONIC HOMOGENIZER FOR CMP SLURRY AGGLOMERATION RE...
- Publication number 20230054165
- Publication date Feb 23, 2023
- Applied Materials, Inc.
- Chih Chung Chou
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Publication number 20230029290
- Publication date Jan 26, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20220402096
- Publication date Dec 22, 2022
- Applied Materials, Inc.
- Yen-Chu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEAM TREATMENT STATIONS FOR CHEMICAL MECHANICAL POLISHING SYSTEM
- Publication number 20220388041
- Publication date Dec 8, 2022
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Application
HOT WATER GENERATION METHOD FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20220355440
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing With Die-Based Modification
- Publication number 20220359219
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED FLUID LINES IN CHEMICAL MECHANICAL POLISHING
- Publication number 20220282807
- Publication date Sep 8, 2022
- Applied Materials, Inc.
- Chad Pollard
- B24 - GRINDING POLISHING
Information Patent Application
STEAM-ASSISTED SINGLE SUBSTRATE CLEANING PROCESS AND APPARATUS
- Publication number 20220216074
- Publication date Jul 7, 2022
- Applied Materials, Inc.
- Jianshe TANG
- B08 - CLEANING

Haosheng Wu

Person

Patents Grantslast 30 patents

Temperature control of chemical mechanical polishing

Steam-assisted single substrate cleaning process and apparatus

Steam treatment stations for chemical mechanical polishing system

Slurry distribution device for chemical mechanical polishing

Low-temperature metal CMP for minimizing dishing and corrosion, and...

Temperature-based in-situ edge assymetry correction during CMP

Control of steam generation for chemical mechanical polishing

Temperature and slurry flow rate control in CMP

Slurry distribution device for chemical mechanical polishing

Control of steam generation for chemical mechanical polishing

Chemical mechanical polishing temperature scanning apparatus for te...

Steam-assisted single substrate cleaning process and apparatus

Temperature-based assymetry correction during CMP and nozzle for me...

Use of steam for pre-heating of CMP components

Steam cleaning of CMP components

Temperature control of chemical mechanical polishing

Steam treatment stations for chemical mechanical polishing system

Slurry distribution device for chemical mechanical polishing

Slurry distribution device for chemical mechanical polishing

Patents Applicationslast 30 patents

METHOD AND APPARATUS TO CLEAN SUBSTRATE WITH ATOMIZING NOZZLE

DETERMINING THE ORIENTATION OF A SUBSTRATE IN-SITU

STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING

COMPACT ADJUSTABLE SPRAY NOZZLE TO PRECISELY TARGET AREAS FOR RINSI...

STEAM TREATMENT STATIONS FOR CHEMICAL MECHANICAL POLISHING SYSTEM

APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE POLISH EDGE UNIFORMITY

ACOUSTIC CARRIER HEAD MONITORING

METHOD FOR CMP TEMPERATURE CONTROL

PAD SURFACE CLEANING DEVICE AROUND PAD CONDITIONER TO ENABLE INSITU...

LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...

CLEANING OF CMP TEMPERATURE CONTROL SYSTEM

TEMPERATURE AND SLURRY FLOW RATE CONTROL IN CMP

APPARATUS AND METHOD FOR CMP TEMPERATURE CONTROL

CONTROL OF STEAM GENERATION FOR CHEMICAL MECHANICAL POLISHING

IN-SITU CONDITIONER DISK CLEANING DURING CMP

GROUNDING TECHNIQUES FOR ESD POLYMERIC FLUID LINES

FLUID-TIGHT ELECTRICAL CONNECTION TECHNIQUES FOR SEMICONDUCTOR PROC...

CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...

STEAM-ASSISTED SINGLE SUBSTRATE CLEANING PROCESS AND APPARATUS

EDDY CURRENT MONITORING TO DETECT VIBRATION IN POLISHING

USE OF STEAM FOR PRE-HEATING OF CMP COMPONENTS

STEAM CLEANING OF CMP COMPONENTS

POINT-OF-USE ULTRASONIC HOMOGENIZER FOR CMP SLURRY AGGLOMERATION RE...

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

SLURRY DISTRIBUTION DEVICE FOR CHEMICAL MECHANICAL POLISHING

STEAM TREATMENT STATIONS FOR CHEMICAL MECHANICAL POLISHING SYSTEM

HOT WATER GENERATION METHOD FOR CHEMICAL MECHANICAL POLISHING

Chemical Mechanical Polishing With Die-Based Modification

INSULATED FLUID LINES IN CHEMICAL MECHANICAL POLISHING

STEAM-ASSISTED SINGLE SUBSTRATE CLEANING PROCESS AND APPARATUS