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Hashii Tomohiro
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of lapping semiconductor wafer and semiconductor wafer
Patent number
11,456,168
Issue date
Sep 27, 2022
Sumco Corporation
Daisuke Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for processing semiconductor wafer
Patent number
9,881,783
Issue date
Jan 30, 2018
Sumco Corporation
Toshiyuki Tanaka
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Fixed abrasive-grain processing device, method of fixed abrasive-gr...
Patent number
9,550,264
Issue date
Jan 24, 2017
Sumco Corporation
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Grant
Machining process for semiconductor wafer
Patent number
9,324,558
Issue date
Apr 26, 2016
Sumco Corporation
Toshiyuki Tanaka
B24 - GRINDING POLISHING
Information
Patent Grant
Polishing solution distribution apparatus and polishing apparatus h...
Patent number
9,017,145
Issue date
Apr 28, 2015
Sumco Corporation
Yoshiaki Kurosawa
B24 - GRINDING POLISHING
Information
Patent Grant
Method for manufacturing epitaxial wafer
Patent number
8,759,229
Issue date
Jun 24, 2014
Sumco Corporation
Sakae Koyata
C30 - CRYSTAL GROWTH
Information
Patent Grant
Method for etching single wafer
Patent number
8,466,071
Issue date
Jun 18, 2013
Sumco Corporation
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of grinding semiconductor wafers, grinding surface plate, an...
Patent number
8,092,277
Issue date
Jan 10, 2012
Sumco Corporation
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Grant
Apparatus for etching wafer by single-wafer process and single wafe...
Patent number
8,066,896
Issue date
Nov 29, 2011
Sumco Corporation
Sakae Koyata
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Method for smoothing wafer surface and apparatus used therefor
Patent number
7,955,982
Issue date
Jun 7, 2011
Sumco Corporation
Takeo Katoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single wafer etching method
Patent number
7,906,438
Issue date
Mar 15, 2011
Sumco Corporation
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer polishing apparatus and method for polishing wafers
Patent number
7,717,768
Issue date
May 18, 2010
Sumco Corporation
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Grant
Process for producing silicon wafer
Patent number
7,648,890
Issue date
Jan 19, 2010
Sumco Corporation
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing silicon wafers
Patent number
7,601,644
Issue date
Oct 13, 2009
Sumco Corporation
Sakae Koyata
B24 - GRINDING POLISHING
Information
Patent Grant
Apparatus for etching wafer by single-wafer process
Patent number
7,488,400
Issue date
Feb 10, 2009
Sumco Corporation
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Etching liquid for controlling silicon wafer surface shape and meth...
Patent number
7,288,207
Issue date
Oct 30, 2007
Sumco Corporation
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer grinding method
Patent number
6,969,302
Issue date
Nov 29, 2005
Sumitomo Metal Industries, Ltd.
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Grant
Method of manufacturing semiconductor wafer
Patent number
6,753,256
Issue date
Jun 22, 2004
Sumitomo Metal Industries, Ltd.
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Grant
Semiconductor wafer manufacturing method
Patent number
6,465,328
Issue date
Oct 15, 2002
Sumitomo Metal Industries, Ltd.
Tomohiro Hashii
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
WAFER SEPARATION APPARATUS AND METHOD, AND METHOD FOR MANUFACTURING...
Publication number
20240213050
Publication date
Jun 27, 2024
SUMCO CORPORATION
Tomohiro HASHII
B32 - LAYERED PRODUCTS
Information
Patent Application
METHOD OF LAPPING SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER
Publication number
20190181001
Publication date
Jun 13, 2019
SUMCO CORPORATION
Daisuke HASHIMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PROCESSING SEMICONDUCTOR WAFER
Publication number
20150303049
Publication date
Oct 22, 2015
SUMCO CORPORATION
Toshiyuki TANAKA
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
MACHINING PROCESS FOR SEMICONDUCTOR WAFER
Publication number
20150004799
Publication date
Jan 1, 2015
SUMCO CORPORATION
Toshiyuki TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR WAFER
Publication number
20120315739
Publication date
Dec 13, 2012
SUMCO CORPORATION
Tomohiro Hashii
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
FIXED ABRASIVE-GRAIN PROCESSING DEVICE, METHOD OF FIXED ABRASIVE-GR...
Publication number
20120071064
Publication date
Mar 22, 2012
SUMCO CORPORATION
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Application
POLISHING SOLUTION DISTRIBUTION APPARATUS AND POLISHING APPARATUS H...
Publication number
20110263183
Publication date
Oct 27, 2011
SUMCO CORPORATION
Yoshiaki KUROSAWA
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR PRODUCING LASER-MARKED SEMICONDUCTOR WAFER
Publication number
20110021025
Publication date
Jan 27, 2011
SUMCO CORPORATION
Tomohiro Hashii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR SMOOTHING WAFER SURFACE AND APPARATUS USED THEREFOR
Publication number
20100151597
Publication date
Jun 17, 2010
SUMCO CORPORATION
Takeo Katoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER MANUFACTURING METHOD AND WAFER OBTAINED THROUGH THE METHOD
Publication number
20100021688
Publication date
Jan 28, 2010
SUMCO CORPORATION
Takeo Katoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PRODUCING SEMICONDUCTOR WAFER
Publication number
20100006982
Publication date
Jan 14, 2010
SUMCO CORPORATION
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Application
SEMICONDUCTOR WAFER AND PRODUCTION METHOD THEREOF
Publication number
20100009155
Publication date
Jan 14, 2010
SUMCO CORPORATION
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
Publication number
20090311808
Publication date
Dec 17, 2009
SUMCO CORPORATION
Tomohiro Hashii
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER
Publication number
20090311460
Publication date
Dec 17, 2009
SUMCO CORPORATION
Tomohiro HASHII
C30 - CRYSTAL GROWTH
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
Publication number
20090311948
Publication date
Dec 17, 2009
SUMCO CORPORATION
Tomohiro Hashii
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
Publication number
20090311863
Publication date
Dec 17, 2009
SUMCO CORPORATION
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFER
Publication number
20090311949
Publication date
Dec 17, 2009
SUMCO CORPORATION
Tomohiro Hashii
B24 - GRINDING POLISHING
Information
Patent Application
METHOD OF GRINDING SEMICONDUCTOR WAFERS, GRINDING SURFACE PLATE, AN...
Publication number
20090298396
Publication date
Dec 3, 2009
SUMCO CORPORATION
Tomohiro HASHII
B24 - GRINDING POLISHING
Information
Patent Application
SEMICONDUCTOR WAFER
Publication number
20090297755
Publication date
Dec 3, 2009
SUMCO CORPORATION
Sakae KOYATA
C30 - CRYSTAL GROWTH
Information
Patent Application
SEMICONDUCTOR WAFER
Publication number
20090289378
Publication date
Nov 26, 2009
SUMCO CORPORATION
Tomohiro HASHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER
Publication number
20090290158
Publication date
Nov 26, 2009
SUMCO CORPORATION
Tomohiro HASHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER
Publication number
20090289377
Publication date
Nov 26, 2009
SUMCO CORPORATION
Tomohiro HASHII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE WAFER ETCHING APPARATUS
Publication number
20090186488
Publication date
Jul 23, 2009
KATOH Takeo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof
Publication number
20090181546
Publication date
Jul 16, 2009
Takeo Katoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Etching Method of Single Wafer
Publication number
20090117749
Publication date
May 7, 2009
SUMCO CORPORATION
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Manufacturing Epitaxial Wafer
Publication number
20090053894
Publication date
Feb 26, 2009
Sakae Koyata
C30 - CRYSTAL GROWTH
Information
Patent Application
ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANU...
Publication number
20090042390
Publication date
Feb 12, 2009
Sakae Koyata
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Method for Etching Single Wafer
Publication number
20090004876
Publication date
Jan 1, 2009
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SILICON WAFER
Publication number
20080214094
Publication date
Sep 4, 2008
Takeo KATOH
B24 - GRINDING POLISHING
Information
Patent Application
Apparatus for etching wafer by single-wafer process and single wafe...
Publication number
20070298614
Publication date
Dec 27, 2007
SUMCO CORPORATION
Sakae Koyata
H01 - BASIC ELECTRIC ELEMENTS