Hayami Matsunaga

Person

Hirakata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Modulation/demodulation apparatus using matrix and anti-matrix
- Patent number 7,408,997
- Issue date Aug 5, 2008
- W.T. Device Company, Inc.
- Hayami Matsunaga
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit substrate and apparatus including the circuit substrate
- Patent number 7,358,445
- Issue date Apr 15, 2008
- Matsushita Electric Industrial Co., Ltd.
- Noboru Mohri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic substrate utilizing an intaglio plate with a plu...
- Patent number 6,861,744
- Issue date Mar 1, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masaaki Hayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a multilayer ceramic substrate
- Patent number 6,429,114
- Issue date Aug 6, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masaaki Hayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing ceramic substrate
- Patent number 6,374,733
- Issue date Apr 23, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masaaki Hayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device on metal board with CPU power converter
- Patent number 6,303,989
- Issue date Oct 16, 2001
- Matsushita Electric Industrial Co., Ltd.
- Takeo Yasuho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a packaging substrate
- Patent number 6,132,543
- Issue date Oct 17, 2000
- Matsushita Electric Industrial Co., Ltd.
- Noboru Mohri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic component
- Patent number 6,051,448
- Issue date Apr 18, 2000
- Matsushita Electric Industrial Co., Ltd.
- Masaaki Hayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel semiconductor integrated circuit device
- Patent number 5,742,097
- Issue date Apr 21, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hayami Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilevel semiconductor integrated circuit device
- Patent number 5,652,462
- Issue date Jul 29, 1997
- Matsushita Electric Industrial Co., Ltd.
- Hayami Matsunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit module and a semiconductor integra...
- Patent number 5,490,041
- Issue date Feb 6, 1996
- Matsushita Electric Industrial Co., Ltd.
- Hitonobu Furukawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Modulation/demodulation apparatus using matrix and anti-matrix
- Publication number 20040258169
- Publication date Dec 23, 2004
- Hayami Matsunaga
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for fabricating a multilayer ceramic substrate
- Publication number 20020100966
- Publication date Aug 1, 2002
- Masaaki Hayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a multilayer ceramic substrate
- Publication number 20020094604
- Publication date Jul 18, 2002
- Masaaki Hayama
- H01 - BASIC ELECTRIC ELEMENTS

Hayami Matsunaga

Person

Patents Grantslast 30 patents

Modulation/demodulation apparatus using matrix and anti-matrix

Circuit substrate and apparatus including the circuit substrate

Multilayer ceramic substrate utilizing an intaglio plate with a plu...

Method for fabricating a multilayer ceramic substrate

Method of manufacturing ceramic substrate

Integrated circuit device on metal board with CPU power converter

Method of manufacturing a packaging substrate

Method of manufacturing an electronic component

Multilevel semiconductor integrated circuit device

Multilevel semiconductor integrated circuit device

Semiconductor integrated circuit module and a semiconductor integra...

Patents Applicationslast 30 patents

Modulation/demodulation apparatus using matrix and anti-matrix

Method for fabricating a multilayer ceramic substrate

Method for fabricating a multilayer ceramic substrate