Hayato TAKAKURA

Person

Ibaraki-shi, Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring circuit board
- Patent number 12,035,484
- Issue date Jul 9, 2024
- Nitto Denko Corporation
- Kenya Takimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board, casing, and board containing set
- Patent number 11,910,526
- Issue date Feb 20, 2024
- Nitto Denko Corporation
- Hayato Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board and producing method thereof
- Patent number 11,825,598
- Issue date Nov 21, 2023
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging element-mounting board
- Patent number 11,647,269
- Issue date May 9, 2023
- Nitto Denko Corporation
- Shusaku Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wired circuit board and imaging device
- Patent number 11,627,661
- Issue date Apr 11, 2023
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board and producing method thereof
- Patent number 11,297,711
- Issue date Apr 5, 2022
- Nitto Denko Corporation
- Yoshihiro Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and production method thereof
- Patent number 11,266,024
- Issue date Mar 1, 2022
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board and imaging device
- Patent number 11,183,448
- Issue date Nov 23, 2021
- Nitto Denko Corporation
- Hayato Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible wiring circuit board and imaging device
- Patent number 11,122,676
- Issue date Sep 14, 2021
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging element mounting board, producing method of imaging element...
- Patent number 11,081,437
- Issue date Aug 3, 2021
- Nitto Denko Corporation
- Shusaku Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a wired circuit board
- Patent number 11,058,002
- Issue date Jul 6, 2021
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and production method thereof
- Patent number 11,032,913
- Issue date Jun 8, 2021
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible wiring circuit board, producing method thereof, and imagin...
- Patent number 10,813,221
- Issue date Oct 20, 2020
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing same
- Patent number 9,173,301
- Issue date Oct 27, 2015
- Nitto Denko Corporation
- Hayato Takakura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20240397609
- Publication date Nov 28, 2024
- Nitto Denko Corporation
- Tomoaki TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240284600
- Publication date Aug 22, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240260177
- Publication date Aug 1, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240244742
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240224435
- Publication date Jul 4, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD
- Publication number 20240114615
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240114628
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240107667
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240107664
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240107683
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230389179
- Publication date Nov 30, 2023
- Nitto Denko Corporation
- Kazutoshi KINOSHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY
- Publication number 20230254971
- Publication date Aug 10, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20230137656
- Publication date May 4, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCING METHOD OF WIRED CIRCUIT BOARD
- Publication number 20230073563
- Publication date Mar 9, 2023
- Nitto Denko Corporation
- Hayato TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20230009006
- Publication date Jan 12, 2023
- Nitto Denko Corporation
- Masaki ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230007783
- Publication date Jan 5, 2023
- Nitto Denko Corporation
- Masaki ITO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230007785
- Publication date Jan 5, 2023
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20220386459
- Publication date Dec 1, 2022
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD, CASING, AND BOARD CONTAINING SET
- Publication number 20220287177
- Publication date Sep 8, 2022
- Nitto Denko Corporation
- Hayato TAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220256712
- Publication date Aug 11, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20220201871
- Publication date Jun 23, 2022
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20220192010
- Publication date Jun 16, 2022
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20220007507
- Publication date Jan 6, 2022
- Nitto Denko Corporation
- Rihito FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE
- Publication number 20210298175
- Publication date Sep 23, 2021
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF
- Publication number 20210243900
- Publication date Aug 5, 2021
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGING ELEMENT-MOUNTING BOARD
- Publication number 20210195070
- Publication date Jun 24, 2021
- Nitto Denko Corporation
- Shusaku SHIBATA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20210084750
- Publication date Mar 18, 2021
- Nitto Denko Corporation
- Yoshihiro KAWAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF
- Publication number 20200344888
- Publication date Oct 29, 2020
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE
- Publication number 20200288575
- Publication date Sep 10, 2020
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE WIRING CIRCUIT BOARD AND IMAGING DEVICE
- Publication number 20200154016
- Publication date May 14, 2020
- Nitto Denko Corporation
- Hayato TAKAKURA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Hayato TAKAKURA

Person

Patents Grantslast 30 patents

Wiring circuit board

Wired circuit board, casing, and board containing set

Wiring circuit board and producing method thereof

Imaging element-mounting board

Wired circuit board and imaging device

Wiring circuit board and producing method thereof

Wired circuit board and production method thereof

Wiring circuit board and imaging device

Flexible wiring circuit board and imaging device

Imaging element mounting board, producing method of imaging element...

Method of producing a wired circuit board

Wired circuit board and production method thereof

Flexible wiring circuit board, producing method thereof, and imagin...

Printed circuit board and method of manufacturing same

Patents Applicationslast 30 patents

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD FOR MANUFACTURING WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY

WIRING CIRCUIT BOARD

PRODUCING METHOD OF WIRED CIRCUIT BOARD

WIRING CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

WIRED CIRCUIT BOARD, CASING, AND BOARD CONTAINING SET

WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE

WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF

IMAGING ELEMENT-MOUNTING BOARD

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

WIRED CIRCUIT BOARD AND PRODUCTION METHOD THEREOF

WIRED CIRCUIT BOARD, PRODUCING METHOD THEREOF, AND IMAGING DEVICE

FLEXIBLE WIRING CIRCUIT BOARD AND IMAGING DEVICE