Hazara Singh Rathore

Person

Stormville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 9,443,776
- Issue date Sep 13, 2016
- GLOBALFOUNDRIES, INC.
- Ronald G. Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 9,287,186
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Inc.
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metal interconnect structures in ultra low-k diel...
- Patent number 8,466,056
- Issue date Jun 18, 2013
- International Business Machines Corporation
- Birendra Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for prediction of premature dielectric breakdown in a semico...
- Patent number 8,053,257
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Structure for modeling stress-induced degradation of conductive int...
- Patent number 7,692,439
- Issue date Apr 6, 2010
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Structure for monitoring stress-induced degradation of conductive i...
- Patent number 7,639,032
- Issue date Dec 29, 2009
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Dual damascene multi-level metallization
- Patent number 7,470,613
- Issue date Dec 30, 2008
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for monitoring stress-induced degradation of c...
- Patent number 7,397,260
- Issue date Jul 8, 2008
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Grant
Structure for determining thermal cycle reliability
- Patent number 7,388,224
- Issue date Jun 17, 2008
- International Business Machines Corporation
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of liner thickness for improving thermal cycle reliability
- Patent number 7,345,305
- Issue date Mar 18, 2008
- International Business Machines Corporation
- Ronald Gene Filippi
- G01 - MEASURING TESTING
Information Patent Grant
Process for forming a redundant structure
- Patent number 7,279,411
- Issue date Oct 9, 2007
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-damascene metallization interconnection
- Patent number 7,224,063
- Issue date May 29, 2007
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge seal for a semiconductor device
- Patent number 7,163,883
- Issue date Jan 16, 2007
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via barrier layers continuous with metal line barrier layers at not...
- Patent number 7,138,714
- Issue date Nov 21, 2006
- International Business Machines Corporation
- Du B. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for determining thermal cycle reliability
- Patent number 7,098,054
- Issue date Aug 29, 2006
- International Business Machines Corporation
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control of liner thickness for improving thermal cycle reliability
- Patent number 6,989,282
- Issue date Jan 24, 2006
- International Business Machines Corporation
- Ronald Gene Filippi
- G01 - MEASURING TESTING
Information Patent Grant
Stacked via-stud with improved reliability in copper metallurgy
- Patent number 6,972,209
- Issue date Dec 6, 2005
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for eliminating time dependent dielectric brea...
- Patent number 6,825,561
- Issue date Nov 30, 2004
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an edge seal for a semiconductor device
- Patent number 6,734,090
- Issue date May 11, 2004
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnections with enhanced electromigration resistance a...
- Patent number 6,348,731
- Issue date Feb 19, 2002
- International Business Machines Corporation
- Leon Ashley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned composite insulator with sub-half-micron multilevel hi...
- Patent number 6,294,835
- Issue date Sep 25, 2001
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnections with enhanced electromigr...
- Patent number 6,287,954
- Issue date Sep 11, 2001
- International Business Machines Corporation
- Leon Ashley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-quarter-micron copper interconnections with improved electromig...
- Patent number 6,258,710
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Hazara S. Rathore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned composite insulator with sub-half-micron multilevel hi...
- Patent number 6,133,139
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnections with enhanced electromigr...
- Patent number 6,130,161
- Issue date Oct 10, 2000
- International Business Machines Corporation
- Leon Ashley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-quarter-micron copper interconnections with improved electromig...
- Patent number 6,069,068
- Issue date May 30, 2000
- International Business Machines Corporation
- Hazara S. Rathore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing planar metal-to-metal capacitor for use in inte...
- Patent number 6,069,051
- Issue date May 30, 2000
- International Business Machines Corporation
- Du B. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing electrically fusible links in copper interconn...
- Patent number 6,033,939
- Issue date Mar 7, 2000
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-half-micron multi-level interconnection structure and process t...
- Patent number 5,981,374
- Issue date Nov 9, 1999
- International Business Machines Corporation
- Hormazdyar M. Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making and laterally filling key hole structure for ultra...
- Patent number 5,976,970
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Hormazdyar Minocher Dalal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
- Publication number 20150262899
- Publication date Sep 17, 2015
- International Business Machines Corporation
- RONALD G. FILIPPI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Metal Interconnect Structures in Ultra Low-K Diel...
- Publication number 20110117737
- Publication date May 19, 2011
- Birendra Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING METAL INTERCONNECT STRUCTURES IN UL...
- Publication number 20100176513
- Publication date Jul 15, 2010
- International Business Machines Corporation
- Birendra Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure for modeling stress-induced degradation of conductive int...
- Publication number 20080231312
- Publication date Sep 25, 2008
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY
- Publication number 20080224135
- Publication date Sep 18, 2008
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...
- Publication number 20080174334
- Publication date Jul 24, 2008
- International Business Machines Corporation
- Kaushik Chanda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for monitoring stress-induced degradation of conductive inte...
- Publication number 20080107149
- Publication date May 8, 2008
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
DEVICE HAVING A REDUNDANT STRUCTURE
- Publication number 20070205515
- Publication date Sep 6, 2007
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MONITORING STRESS-INDUCED DEGRADATION OF C...
- Publication number 20070115018
- Publication date May 24, 2007
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
PROCESS FOR FORMING A REDUNDANT STRUCTURE
- Publication number 20070111497
- Publication date May 17, 2007
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DAMASCENE MULTI-LEVEL METALLIZATION
- Publication number 20070111510
- Publication date May 17, 2007
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...
- Publication number 20060281338
- Publication date Dec 14, 2006
- International Business Machines Corporation
- Kaushik Chanda
- G01 - MEASURING TESTING
Information Patent Application
Method and structure for determining thermal cycle reliability
- Publication number 20060273460
- Publication date Dec 7, 2006
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RELIABILITY AND FUNCTIONALITY IMPROVEMENTS ON COPPER INTERCONNECTS...
- Publication number 20060180930
- Publication date Aug 17, 2006
- International Business Machines Corporation
- Du B. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control of liner thickness for improving thermal cycle reliability
- Publication number 20060027842
- Publication date Feb 9, 2006
- Ronald Gene Filippi
- G01 - MEASURING TESTING
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20060014376
- Publication date Jan 19, 2006
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Control of liner thickness for improving thermal cycle reliability
- Publication number 20050227380
- Publication date Oct 13, 2005
- Ronald Gene Filippi
- G01 - MEASURING TESTING
Information Patent Application
Method and structure for determining thermal cycle reliability
- Publication number 20050186689
- Publication date Aug 25, 2005
- Ronald Gene Filippi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR ELIMINATING TIME DEPENDENT DIELECTRIC BREA...
- Publication number 20040256729
- Publication date Dec 23, 2004
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked via-stud with improved reliability in copper metallurgy
- Publication number 20040101663
- Publication date May 27, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge seal for a semiconductor device
- Publication number 20040087078
- Publication date May 6, 2004
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge seal for a semiconductor device
- Publication number 20030157794
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual damascene multi-level metallization
- Publication number 20020182855
- Publication date Dec 5, 2002
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS

Hazara Singh Rathore

Person

Patents Grantslast 30 patents

Method and structure for determining thermal cycle reliability

Method and structure for determining thermal cycle reliability

Method of forming metal interconnect structures in ultra low-k diel...

Method for prediction of premature dielectric breakdown in a semico...

Structure for modeling stress-induced degradation of conductive int...

Structure for monitoring stress-induced degradation of conductive i...

Dual damascene multi-level metallization

Structure and method for monitoring stress-induced degradation of c...

Structure for determining thermal cycle reliability

Control of liner thickness for improving thermal cycle reliability

Process for forming a redundant structure

Dual-damascene metallization interconnection

Edge seal for a semiconductor device

Via barrier layers continuous with metal line barrier layers at not...

Method and structure for determining thermal cycle reliability

Control of liner thickness for improving thermal cycle reliability

Stacked via-stud with improved reliability in copper metallurgy

Structure and method for eliminating time dependent dielectric brea...

Method of making an edge seal for a semiconductor device

Copper interconnections with enhanced electromigration resistance a...

Self-aligned composite insulator with sub-half-micron multilevel hi...

Method of forming copper interconnections with enhanced electromigr...

Sub-quarter-micron copper interconnections with improved electromig...

Self-aligned composite insulator with sub-half-micron multilevel hi...

Method of forming copper interconnections with enhanced electromigr...

Sub-quarter-micron copper interconnections with improved electromig...

Method of producing planar metal-to-metal capacitor for use in inte...

Method for providing electrically fusible links in copper interconn...

Sub-half-micron multi-level interconnection structure and process t...

Method of making and laterally filling key hole structure for ultra...

Patents Applicationslast 30 patents

METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY

Method of Forming Metal Interconnect Structures in Ultra Low-K Diel...

STRUCTURE AND METHOD OF FORMING METAL INTERCONNECT STRUCTURES IN UL...

Structure for modeling stress-induced degradation of conductive int...

METHOD AND STRUCTURE FOR DETERMINING THERMAL CYCLE RELIABILITY

METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...

Method for monitoring stress-induced degradation of conductive inte...

DEVICE HAVING A REDUNDANT STRUCTURE

STRUCTURE AND METHOD FOR MONITORING STRESS-INDUCED DEGRADATION OF C...

PROCESS FOR FORMING A REDUNDANT STRUCTURE

DUAL DAMASCENE MULTI-LEVEL METALLIZATION

METHOD FOR PREDICTION OF PREMATURE DIELECTRIC BREAKDOWN IN A SEMICO...

Method and structure for determining thermal cycle reliability

RELIABILITY AND FUNCTIONALITY IMPROVEMENTS ON COPPER INTERCONNECTS...

Control of liner thickness for improving thermal cycle reliability

Stacked via-stud with improved reliability in copper metallurgy

Control of liner thickness for improving thermal cycle reliability

Method and structure for determining thermal cycle reliability

STRUCTURE AND METHOD FOR ELIMINATING TIME DEPENDENT DIELECTRIC BREA...

Stacked via-stud with improved reliability in copper metallurgy

Edge seal for a semiconductor device

Edge seal for a semiconductor device

Dual damascene multi-level metallization