Heng Chieh Chien

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous integration semiconductor package structure
- Patent number 11,942,396
- Issue date Mar 26, 2024
- Industrial Technology Research Institute
- Heng-Chieh Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ear tag module
- Patent number 11,602,128
- Issue date Mar 14, 2023
- Industrial Technology Research Institute
- Shu-Jung Yang
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING
Information Patent Grant
Chip temperature computation method and chip temperature computatio...
- Patent number 10,540,474
- Issue date Jan 21, 2020
- Industrial Technology Research Institute
- Heng-Chieh Chien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rail-type OLED lamp assembly
- Patent number 10,197,255
- Issue date Feb 5, 2019
- Industrial Technology Research Institute
- Heng-Chieh Chien
- F21 - LIGHTING
Information Patent Grant
Power module and manufacturing method thereof
- Patent number 10,051,742
- Issue date Aug 14, 2018
- Industrial Technology Research Institute
- Shu-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement method, measurement apparatus, and computer program pro...
- Patent number 9,448,121
- Issue date Sep 20, 2016
- Industrial Technology Research Institute
- Heng-Chieh Chien
- G01 - MEASURING TESTING
Information Patent Grant
Power module
- Patent number 9,418,921
- Issue date Aug 16, 2016
- Industrial Technology Research Institute
- Shu-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned integrated circuit device and manufacturing process for the...
- Patent number 9,252,054
- Issue date Feb 2, 2016
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-assembly apparatus, device self-assembling method, and method...
- Patent number 8,609,454
- Issue date Dec 17, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Chip stacking structure and fabricating method of the chip stacking...
- Patent number 8,519,524
- Issue date Aug 27, 2013
- Industrial Technology Research Institute
- Sheng-Tsai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filled through-silicon via with conductive composite material
- Patent number 8,456,017
- Issue date Jun 4, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for measuring characteristic and chip temperat...
- Patent number 8,075,182
- Issue date Dec 13, 2011
- Industrial Technology Research Institute
- Ming-Ji Dai
- G01 - MEASURING TESTING
Information Patent Grant
Method for determining the thermal performance of a heat sink
- Patent number 6,663,278
- Issue date Dec 16, 2003
- Industrial Technologies Research Institute
- Heng Chieh Chien
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
DATA CENTER AND PHASE CHANGE COOLANT DISTRIBUTION UNIT THEREOF
- Publication number 20240365517
- Publication date Oct 31, 2024
- Industrial Technology Research Institute
- Heng-Chieh CHIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HETEROGENEOUS INTEGRATION SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230170279
- Publication date Jun 1, 2023
- Industrial Technology Research Institute
- Heng-Chieh Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EAR TAG MODULE
- Publication number 20200383298
- Publication date Dec 10, 2020
- Industrial Technology Research Institute
- Shu-Jung Yang
- G01 - MEASURING TESTING
Information Patent Application
CHIP TEMPERATURE COMPUTATION METHOD AND CHIP TEMPERATURE COMPUTATIO...
- Publication number 20190188357
- Publication date Jun 20, 2019
- Industrial Technology Research Institute
- Heng-Chieh Chien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RAIL-TYPE OLED LAMP ASSEMBLY
- Publication number 20180128468
- Publication date May 10, 2018
- Industrial Technology Research Institute
- Heng-Chieh Chien
- F21 - LIGHTING
Information Patent Application
POWER MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20170171978
- Publication date Jun 15, 2017
- Industrial Technology Research Institute
- Shu-Jung Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20160172285
- Publication date Jun 16, 2016
- Industrial Technology Research Institute
- Shu-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED INTEGRATED CIRCUIT DEVICE AND MANUFACTURING PROCESS FOR THE...
- Publication number 20150076682
- Publication date Mar 19, 2015
- Industrial Technology Research Institute
- Sheng-Tsai WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLY APPARATUS, DEVICE SELF-ASSEMBLING METHOD, AND METHOD...
- Publication number 20130302935
- Publication date Nov 14, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT METHOD, MEASUREMENT APPARATUS, AND COMPUTER PROGRAM PRO...
- Publication number 20130276464
- Publication date Oct 24, 2013
- Heng-Chieh Chien
- G01 - MEASURING TESTING
Information Patent Application
FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF
- Publication number 20130234325
- Publication date Sep 12, 2013
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF
- Publication number 20120273939
- Publication date Nov 1, 2012
- Industrial Technology Research Institute
- Ming-Ji Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE AND MEASUREMENT METHOD THEREOF
- Publication number 20120249176
- Publication date Oct 4, 2012
- Industrial Technology Research Institute
- Heng-Chieh Chien
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR MEASURING CHARACTERISTIC AND CHIP TEMPERAT...
- Publication number 20090154525
- Publication date Jun 18, 2009
- Industrial Technology Research Institute
- Ming-Ji Dai
- G01 - MEASURING TESTING
Information Patent Application
Closed-loop latent heat cooling method and capillary force or non-n...
- Publication number 20070163756
- Publication date Jul 19, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chih-Yao Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal module with heat reservoir and method of applying the same...
- Publication number 20050207120
- Publication date Sep 22, 2005
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ming-Hsi Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Heng Chieh Chien

Person

Patents Grantslast 30 patents

Heterogeneous integration semiconductor package structure

Ear tag module

Chip temperature computation method and chip temperature computatio...

Rail-type OLED lamp assembly

Power module and manufacturing method thereof

Measurement method, measurement apparatus, and computer program pro...

Power module

Thinned integrated circuit device and manufacturing process for the...

Self-assembly apparatus, device self-assembling method, and method...

Chip stacking structure and fabricating method of the chip stacking...

Filled through-silicon via with conductive composite material

Apparatus and method for measuring characteristic and chip temperat...

Method for determining the thermal performance of a heat sink

Patents Applicationslast 30 patents

DATA CENTER AND PHASE CHANGE COOLANT DISTRIBUTION UNIT THEREOF

HETEROGENEOUS INTEGRATION SEMICONDUCTOR PACKAGE STRUCTURE

EAR TAG MODULE

CHIP TEMPERATURE COMPUTATION METHOD AND CHIP TEMPERATURE COMPUTATIO...

RAIL-TYPE OLED LAMP ASSEMBLY

POWER MODULE AND MANUFACTURING METHOD THEREOF

POWER MODULE

THINNED INTEGRATED CIRCUIT DEVICE AND MANUFACTURING PROCESS FOR THE...

SELF-ASSEMBLY APPARATUS, DEVICE SELF-ASSEMBLING METHOD, AND METHOD...

MEASUREMENT METHOD, MEASUREMENT APPARATUS, AND COMPUTER PROGRAM PRO...

FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF

FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF

TEST STRUCTURE AND MEASUREMENT METHOD THEREOF

APPARATUS AND METHOD FOR MEASURING CHARACTERISTIC AND CHIP TEMPERAT...

Closed-loop latent heat cooling method and capillary force or non-n...

Thermal module with heat reservoir and method of applying the same...