Henry G. Hughes

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level MEMS packaging
- Patent number 6,953,985
- Issue date Oct 11, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component and method for manufacture
- Patent number 6,514,789
- Issue date Feb 4, 2003
- Motorola, Inc.
- Heidi L. Denton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor wafer level package
- Patent number 6,465,281
- Issue date Oct 15, 2002
- Motorola, Inc.
- DaXue Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor and method of fabrication
- Patent number 6,326,228
- Issue date Dec 4, 2001
- Motorola, Inc.
- Henry G. Hughes
- G01 - MEASURING TESTING
Information Patent Grant
Spin-on dielectric formation process for use in manufacturing semic...
- Patent number 6,274,515
- Issue date Aug 14, 2001
- Motorola, Inc.
- Henry G. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having a monocrystalline member overlying a...
- Patent number 6,013,933
- Issue date Jan 11, 2000
- Motorola, Inc.
- Juergen August Foerstner
- G01 - MEASURING TESTING
Information Patent Grant
Chemical sensor and method of making same
- Patent number 5,948,361
- Issue date Sep 7, 1999
- Motorola, Inc.
- Frank T. Secco D'Aragona
- G01 - MEASURING TESTING
Information Patent Grant
Method of operating chemical sensors
- Patent number 5,898,101
- Issue date Apr 27, 1999
- Motorola, Inc.
- Robert P. Lyle
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming a multiple-sensor semiconductor chip
- Patent number 5,804,462
- Issue date Sep 8, 1998
- Motorola, Inc.
- Chung-Chiun Liu
- G01 - MEASURING TESTING
Information Patent Grant
Sensor and method of fabrication
- Patent number 5,798,556
- Issue date Aug 25, 1998
- Motorola, Inc.
- Henry G. Hughes
- G01 - MEASURING TESTING
Information Patent Grant
Method for forming a semiconductor sensor FET device
- Patent number 5,693,545
- Issue date Dec 2, 1997
- Motorola, Inc.
- Young Sir Chung
- G01 - MEASURING TESTING
Information Patent Grant
Method of making a semiconductor device having a low permittivity d...
- Patent number 5,591,676
- Issue date Jan 7, 1997
- Motorola, Inc.
- Henry G. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device enclosure including a conductive cap and substrate
- Patent number 5,545,912
- Issue date Aug 13, 1996
- Motorola, Inc.
- Ljubisa Ristic
- G01 - MEASURING TESTING
Information Patent Grant
Method of shaping inter-substrate plug and receptacles interconnects
- Patent number 5,457,879
- Issue date Oct 17, 1995
- Motorola, Inc.
- Richard W. Gurtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low permittivity dielectric
- Patent number 5,442,237
- Issue date Aug 15, 1995
- Motorola Inc.
- Henry G. Hughes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer level package
- Patent number 5,323,051
- Issue date Jun 21, 1994
- Motorola, Inc.
- Victor J. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon film with improved thickness control
- Patent number 5,256,581
- Issue date Oct 26, 1993
- Motorola, Inc.
- Juergen A. Foerstner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic single crystal silicon etching solution and method
- Patent number 5,207,866
- Issue date May 4, 1993
- Motorola, Inc.
- Ping-Chang Lue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing utilizing carbon containing thick film spi...
- Patent number 4,801,560
- Issue date Jan 31, 1989
- Motorola Inc.
- Thomas E. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spin-on glass for use in semiconductor processing
- Patent number 4,798,629
- Issue date Jan 17, 1989
- Motorola Inc.
- Thomas E. Wood
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for passivating a semiconductor junction
- Patent number 4,717,641
- Issue date Jan 5, 1988
- Motorola Inc.
- Emanuel Belmont
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma development process for photoresist
- Patent number 4,241,165
- Issue date Dec 23, 1980
- Motorola, Inc.
- Henry G. Hughes
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
MEMS control chip integration
- Publication number 20040016995
- Publication date Jan 29, 2004
- Shun Meen Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level MEMS packaging
- Publication number 20030230798
- Publication date Dec 18, 2003
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT AND METHOD FOR MANUFACTURE
- Publication number 20020171131
- Publication date Nov 21, 2002
- HEIDI L. DENTON
- H01 - BASIC ELECTRIC ELEMENTS

Henry G. Hughes

Person

Patents Grantslast 30 patents

Wafer level MEMS packaging

Component and method for manufacture

Method of manufacturing a semiconductor wafer level package

Sensor and method of fabrication

Spin-on dielectric formation process for use in manufacturing semic...

Semiconductor structure having a monocrystalline member overlying a...

Chemical sensor and method of making same

Method of operating chemical sensors

Method for forming a multiple-sensor semiconductor chip

Sensor and method of fabrication

Method for forming a semiconductor sensor FET device

Method of making a semiconductor device having a low permittivity d...

Electronic device enclosure including a conductive cap and substrate

Method of shaping inter-substrate plug and receptacles interconnects

Semiconductor device having a low permittivity dielectric

Semiconductor wafer level package

Silicon film with improved thickness control

Anisotropic single crystal silicon etching solution and method

Semiconductor processing utilizing carbon containing thick film spi...

Spin-on glass for use in semiconductor processing

Method for passivating a semiconductor junction

Plasma development process for photoresist

Patents Applicationslast 30 patents

MEMS control chip integration

Wafer level MEMS packaging

COMPONENT AND METHOD FOR MANUFACTURE