Hermann Wendt

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Crack stop trenches
- Patent number 8,610,238
- Issue date Dec 17, 2013
- Infineon Technologies AG
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 8,148,235
- Issue date Apr 3, 2012
- Infineon Technologies AG
- Markus Naujok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual damascene process
- Patent number 8,062,971
- Issue date Nov 22, 2011
- Infineon Technologies AG
- Philipp Riess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of patterning insulating layers using etching techniques th...
- Patent number 8,058,176
- Issue date Nov 15, 2011
- Samsung Electronics Co., Ltd.
- Wan-jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and structures thereof
- Patent number 8,013,364
- Issue date Sep 6, 2011
- Infineon Technologies AG
- Markus Naujok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlled low-k via etch for Cu interconnections
- Patent number 7,906,426
- Issue date Mar 15, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 7,883,987
- Issue date Feb 8, 2011
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack stop trenches
- Patent number 7,871,902
- Issue date Jan 18, 2011
- Infineon Technologies AG
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a layer arrangement
- Patent number 7,795,135
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Stefan Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 7,723,818
- Issue date May 25, 2010
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices and structures thereof
- Patent number 7,629,225
- Issue date Dec 8, 2009
- Infineon Technologies AG
- Markus Naujok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect and method of making same
- Patent number 7,619,310
- Issue date Nov 17, 2009
- Infineon Technologies AG
- Frank Huebinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration scheme for fully silicided gate
- Patent number 7,544,553
- Issue date Jun 9, 2009
- Infineon Technologies AG
- Marcus Culmsee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single damascene with disposable stencil and method therefore
- Patent number 7,452,804
- Issue date Nov 18, 2008
- Infineon Technologies AG
- Michael Beck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Crack Stop Trenches
- Publication number 20110074033
- Publication date Mar 31, 2011
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20100197112
- Publication date Aug 5, 2010
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Manufacturing Semiconductor Devices
- Publication number 20100144112
- Publication date Jun 10, 2010
- Markus Naujok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Structures Thereof
- Publication number 20100032841
- Publication date Feb 11, 2010
- Markus Naujok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Damascene Process
- Publication number 20090239375
- Publication date Sep 24, 2009
- Philipp Riess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Crack Stop Trenches
- Publication number 20090203192
- Publication date Aug 13, 2009
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MINIMIZING VIA SIDEWALL DAMAGES DURING DUAL DAMASCENE TRE...
- Publication number 20090087992
- Publication date Apr 2, 2009
- Chartered Semiconductor Manufacturing LTD.
- Ravi Prakash SRIVASTAVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Patterning Insulating Layers Using Etching Techniques th...
- Publication number 20090081873
- Publication date Mar 26, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Wan-jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices and methods of manufacture thereof
- Publication number 20080290448
- Publication date Nov 27, 2008
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of controlled low-k via etch for Cu interconnections
- Publication number 20080258308
- Publication date Oct 23, 2008
- Wuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor interconnect and method of making same
- Publication number 20080108219
- Publication date May 8, 2008
- Frank Huebinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing a layer arrangement
- Publication number 20080102625
- Publication date May 1, 2008
- Stefan Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single damascene with disposable stencil and method therefore
- Publication number 20070042588
- Publication date Feb 22, 2007
- Michael Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of manufacturing semiconductor devices and structures thereof
- Publication number 20060281295
- Publication date Dec 14, 2006
- Markus Naujok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration scheme for fully silicided gate
- Publication number 20060228844
- Publication date Oct 12, 2006
- Marcus Culmsee
- H01 - BASIC ELECTRIC ELEMENTS

Hermann Wendt

Person

Patents Grantslast 30 patents

Crack stop trenches

Methods of manufacturing semiconductor devices

Dual damascene process

Methods of patterning insulating layers using etching techniques th...

Semiconductor devices and structures thereof

Method of controlled low-k via etch for Cu interconnections

Semiconductor devices and methods of manufacture thereof

Crack stop trenches

Method for producing a layer arrangement

Semiconductor devices and methods of manufacture thereof

Methods of manufacturing semiconductor devices and structures thereof

Semiconductor interconnect and method of making same

Integration scheme for fully silicided gate

Single damascene with disposable stencil and method therefore

Patents Applicationslast 30 patents

Crack Stop Trenches

Semiconductor Devices and Methods of Manufacture Thereof

Methods of Manufacturing Semiconductor Devices

Semiconductor Devices and Structures Thereof

Dual Damascene Process

Crack Stop Trenches

METHOD OF MINIMIZING VIA SIDEWALL DAMAGES DURING DUAL DAMASCENE TRE...

Methods of Patterning Insulating Layers Using Etching Techniques th...

Semiconductor devices and methods of manufacture thereof

Method of controlled low-k via etch for Cu interconnections

Semiconductor interconnect and method of making same

Method for producing a layer arrangement

Single damascene with disposable stencil and method therefore

Methods of manufacturing semiconductor devices and structures thereof

Integration scheme for fully silicided gate