Heui-Seog Kim

Person

Chungcheongnam-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of molding semiconductor package
- Patent number 9,184,065
- Issue date Nov 10, 2015
- Samsung Electronics Co., Ltd.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of molding semiconductor package
- Patent number 8,956,921
- Issue date Feb 17, 2015
- Samsung Electronics Co., Ltd.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a substrate using a laser beam
- Patent number 8,466,074
- Issue date Jun 18, 2013
- Samsung Electronics Co., Ltd.
- Sung-il Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of molding semiconductor package
- Patent number 8,420,450
- Issue date Apr 16, 2013
- Samsung Electronics Co., Ltd.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 8,115,323
- Issue date Feb 14, 2012
- Samsung Electronics Co., Ltd.
- Wha-Su Sin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method thereof and a solder ball land and...
- Patent number 8,039,972
- Issue date Oct 18, 2011
- Samsung Electronics Co., Ltd.
- Ky-hyun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,906,423
- Issue date Mar 15, 2011
- Samsung Electronics Co., Ltd.
- Hyo-Jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame unit, semiconductor package having a lead frame unit, st...
- Patent number 7,791,178
- Issue date Sep 7, 2010
- Samsung Electronics Co., Ltd.
- Hyo-Jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package, semiconductor package module including the s...
- Patent number 7,745,932
- Issue date Jun 29, 2010
- Samsung Electronics Co., Ltd.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package using redistribution...
- Patent number 7,713,788
- Issue date May 11, 2010
- Samsung Electronics Co., Ltd.
- Jun-Young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,663,219
- Issue date Feb 16, 2010
- Samsung Electronics Co., Ltd.
- Hyo-Jae Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method thereof and a solder ball land and...
- Patent number 7,576,438
- Issue date Aug 18, 2009
- Samsung Electronics Co., Ltd.
- Ky-hyun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing a semiconductor wafer for manufacture of semic...
- Patent number 7,452,753
- Issue date Nov 18, 2008
- Samsung Electronics Co., Ltd.
- Dae-Sang Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder ball, and fabricating method and structure...
- Patent number 7,427,558
- Issue date Sep 23, 2008
- Samsung Electronics Co., Ltd.
- Jae-Hong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package stack and manufacturing method thereof
- Patent number 7,420,814
- Issue date Sep 2, 2008
- Samsung Electronics Co., Ltd.
- Jae-Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
POGO pin and test socket including the same
- Patent number 7,245,138
- Issue date Jul 17, 2007
- Samsung Electronics Co., Ltd.
- Hyeck-Jin Jeong
- G01 - MEASURING TESTING
Information Patent Grant
Insert block with pusher to push semiconductor device under test
- Patent number 7,151,368
- Issue date Dec 19, 2006
- Samsung Electronics Co., Ltd.
- Hyeck-Jin Joung
- G01 - MEASURING TESTING
Information Patent Grant
Management system for automated wire bonding process
- Patent number 6,851,100
- Issue date Feb 1, 2005
- Samsung Electronics Co., Ltd.
- Yean-Sang You
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including a double-faced semiconductor chip h...
- Patent number 6,787,393
- Issue date Sep 7, 2004
- Samsung Electronics Co., Ltd.
- Ho-tae Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer table and semiconductor package manufacturing apparatus using...
- Patent number 6,780,734
- Issue date Aug 24, 2004
- Samsung Electronics Co., Ltd.
- Jae-Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip packaging system and a semiconductor chip packag...
- Patent number 6,392,286
- Issue date May 21, 2002
- Samsung Electronics Co., Ltd.
- Ho-Tae Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid crystal display
- Patent number 5,864,377
- Issue date Jan 26, 1999
- Samsung Electronics Co., Ltd.
- Heui-jong Kim
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MOLDING SEMICONDUCTOR PACKAGE
- Publication number 20150118798
- Publication date Apr 30, 2015
- Samsung Electronics Co., Ltd.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOLDING SEMICONDUCTOR PACKAGE
- Publication number 20130203220
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating Semiconductor Device
- Publication number 20120108035
- Publication date May 3, 2012
- Goon-Woo Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BE...
- Publication number 20120013007
- Publication date Jan 19, 2012
- Hyun-ik HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MOLDING SEMICONDUCTOR PACKAGE
- Publication number 20110318887
- Publication date Dec 29, 2011
- Samsung Electronics Co., Ltd.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SUBSTRATE USING A LASER BEAM
- Publication number 20110256736
- Publication date Oct 20, 2011
- Sung-il Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP
- Publication number 20110124273
- Publication date May 26, 2011
- Samsung Electronics Co., Ltd.
- Jung-Hyun Roh
- B24 - GRINDING POLISHING
Information Patent Application
Stack-type semiconductor device having chips having different backs...
- Publication number 20110110062
- Publication date May 12, 2011
- Samsung Electronics Co., Ltd.
- Jae-yong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100105201
- Publication date Apr 29, 2010
- SAMSUNG ELECTRONICS CORP., LTD.
- Hyo-Jae Bang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board and method thereof and a solder ball land and...
- Publication number 20090278249
- Publication date Nov 12, 2009
- Ky-hyun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20090200362
- Publication date Aug 13, 2009
- Ky-Hyun JUNG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090174078
- Publication date Jul 9, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Hyeck-Jin Jeong
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING REDISTRIBUTION...
- Publication number 20090053858
- Publication date Feb 26, 2009
- Samsung Electronics Co., Ltd.
- Jun-Young KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package, semiconductor package module including the s...
- Publication number 20080315408
- Publication date Dec 25, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Jun-young Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20080265431
- Publication date Oct 30, 2008
- Samsung Electronics Co., Ltd.
- Wha-Su Sin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding apparatus, molded semiconductor package using multi-layered...
- Publication number 20080251949
- Publication date Oct 16, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Wha-Su Sin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame unit, semiconductor package having a lead frame unit, st...
- Publication number 20080116546
- Publication date May 22, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Hyo-Jae Bang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080111235
- Publication date May 15, 2008
- Samsung Electronics Co., Ltd.
- Hyo-Jae Bang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING...
- Publication number 20080111230
- Publication date May 15, 2008
- Samsung Electronics Co., Ltd.
- Goon-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
- Publication number 20080061434
- Publication date Mar 13, 2008
- Samsung Electronics Co., Ltd.
- Ky-Hyun JUNG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME
- Publication number 20080012096
- Publication date Jan 17, 2008
- Samsung Electronics Co., Ltd.
- Wha-Su SIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer level chip package and method of manufacturing...
- Publication number 20070052094
- Publication date Mar 8, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Goon-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board and method thereof and a solder ball land and...
- Publication number 20070040282
- Publication date Feb 22, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Ky-hyun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus, customer tray, and method for testing semiconductor pack...
- Publication number 20070013404
- Publication date Jan 18, 2007
- SAMSUNG ELECTRONICS CO., LTD.
- Seok-young Yoon
- G01 - MEASURING TESTING
Information Patent Application
POGO pin and test socket including the same
- Publication number 20060145719
- Publication date Jul 6, 2006
- Hyeck-Jin Jeong
- G01 - MEASURING TESTING
Information Patent Application
Package stack and manufacturing method thereof
- Publication number 20060076665
- Publication date Apr 13, 2006
- Jae-Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insert block for testing semiconductor device
- Publication number 20060071656
- Publication date Apr 6, 2006
- Hyeck-Jin Joung
- G01 - MEASURING TESTING
Information Patent Application
Method of forming solder ball, and fabricating method and structure...
- Publication number 20060057833
- Publication date Mar 16, 2006
- Jae-Hong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of processing a semiconductor wafer for manufacture of semic...
- Publication number 20060008948
- Publication date Jan 12, 2006
- Dae-Sang Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for ejecting relatively thin IC chip from semiconductor w...
- Publication number 20060003491
- Publication date Jan 5, 2006
- Goon-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Heui-Seog Kim

Person

Patents Grantslast 30 patents

Method of molding semiconductor package

Method of molding semiconductor package

Method for processing a substrate using a laser beam

Method of molding semiconductor package

Semiconductor package and method of manufacturing the semiconductor...

Printed circuit board and method thereof and a solder ball land and...

Semiconductor device and method of manufacturing the same

Lead frame unit, semiconductor package having a lead frame unit, st...

Semiconductor package, semiconductor package module including the s...

Method of manufacturing semiconductor package using redistribution...

Semiconductor device and method of manufacturing the same

Printed circuit board and method thereof and a solder ball land and...

Method of processing a semiconductor wafer for manufacture of semic...

Method of forming solder ball, and fabricating method and structure...

Package stack and manufacturing method thereof

POGO pin and test socket including the same

Insert block with pusher to push semiconductor device under test

Management system for automated wire bonding process

Semiconductor package including a double-faced semiconductor chip h...

Wafer table and semiconductor package manufacturing apparatus using...

Semiconductor chip packaging system and a semiconductor chip packag...

Liquid crystal display

Patents Applicationslast 30 patents

METHOD OF MOLDING SEMICONDUCTOR PACKAGE

METHOD OF MOLDING SEMICONDUCTOR PACKAGE

Method of Fabricating Semiconductor Device

PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BE...

METHOD OF MOLDING SEMICONDUCTOR PACKAGE

METHOD FOR PROCESSING A SUBSTRATE USING A LASER BEAM

WAFER POLISHING APPARATUS FOR ADJUSTING HEIGHT OF WHEEL TIP

Stack-type semiconductor device having chips having different backs...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Printed circuit board and method thereof and a solder ball land and...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

Semiconductor device and method of manufacturing the same

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING REDISTRIBUTION...

Semiconductor package, semiconductor package module including the s...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

Molding apparatus, molded semiconductor package using multi-layered...

Lead frame unit, semiconductor package having a lead frame unit, st...

Semiconductor device and method of manufacturing the same

WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING...

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME

Semiconductor wafer level chip package and method of manufacturing...

Printed circuit board and method thereof and a solder ball land and...

Apparatus, customer tray, and method for testing semiconductor pack...

POGO pin and test socket including the same

Package stack and manufacturing method thereof

Insert block for testing semiconductor device

Method of forming solder ball, and fabricating method and structure...

Method of processing a semiconductor wafer for manufacture of semic...

Apparatus for ejecting relatively thin IC chip from semiconductor w...