Hidekazu Matsuura

Person

Oyama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,560,307
- Issue date Jul 14, 2009
- Hitachi Chemical Company, Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 7,479,412
- Issue date Jan 20, 2009
- Hitachi Chemical Company, Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, metal sheet with such adhesive fil...
- Patent number 7,449,367
- Issue date Nov 11, 2008
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 7,378,722
- Issue date May 27, 2008
- Hitachi Chemical Co., Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, heat-resistant resin paste and semiconductor dev...
- Patent number 7,061,081
- Issue date Jun 13, 2006
- Hitachi Chemical Co., Ltd.
- Yasuhiro Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 7,057,266
- Issue date Jun 6, 2006
- Hitachi Chemical Co., Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, process of forming patterns with...
- Patent number 6,849,385
- Issue date Feb 1, 2005
- Hitachi Chemical Co., Ltd.
- Tomohiro Nagoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 6,744,133
- Issue date Jun 1, 2004
- Hitachi Chemical Co., Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame with adhesive film for...
- Patent number 6,733,880
- Issue date May 11, 2004
- Hitachi Chemical Co., Ltd.
- Yoshiyuki Tanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 6,700,185
- Issue date Mar 2, 2004
- Hitachi Chemical Co., Ltd.
- Toshiyasu Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-resistant adhesive sheet
- Patent number 6,558,791
- Issue date May 6, 2003
- Hitachi Chemical Company
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a lead frame with composite film attached, and...
- Patent number 6,558,500
- Issue date May 6, 2003
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating adhesive for electronic parts, and lead frame and semico...
- Patent number 6,445,076
- Issue date Sep 3, 2002
- Hitachi Chemical Company, Ltd.
- Takehiro Shimizu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for fabricating a crack resistant resin encapsulated semico...
- Patent number 6,372,080
- Issue date Apr 16, 2002
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a lead frame with composite film attached, and...
- Patent number 6,302,991
- Issue date Oct 16, 2001
- Hitachi Chemical Co., Ltd.
- Hidekazu Matsuura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for fabricating a crack resistant resin encapsulated semico...
- Patent number 6,248,613
- Issue date Jun 19, 2001
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a crack resistant resin encapsulated semico...
- Patent number 6,046,072
- Issue date Apr 4, 2000
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite film and lead frame with composite film attached
- Patent number 5,998,020
- Issue date Dec 7, 1999
- Hitachi Chemical Co., Ltd.
- Hidekazu Matsuura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of forming resin film of desired pattern on semiconductor su...
- Patent number 5,958,653
- Issue date Sep 28, 1999
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming resin film of desired pattern on semiconductor su...
- Patent number 5,955,779
- Issue date Sep 21, 1999
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polyimides and thermosetting resin compositions containing the same
- Patent number 5,608,013
- Issue date Mar 4, 1997
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for surface treatment of polyimide resin molded articles
- Patent number 5,527,621
- Issue date Jun 18, 1996
- Hitachi Chemical Co., Ltd.
- Hidekazu Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Polyimides, thermosetting resin compositions containing the polyimi...
- Patent number 5,510,425
- Issue date Apr 23, 1996
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyimides, thermosetting resin compositions containing the polyimi...
- Patent number 5,508,357
- Issue date Apr 16, 1996
- Hitachi Chemical Company, Ltd.
- Hidekazu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADH...
- Publication number 20090053498
- Publication date Feb 26, 2009
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVIC...
- Publication number 20080194062
- Publication date Aug 14, 2008
- Toshiyasu Kawai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20060180908
- Publication date Aug 17, 2006
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Publication number 20060138616
- Publication date Jun 29, 2006
- Toshiyasu Kawai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive film for semiconductor, metal sheet with such adhesive fil...
- Publication number 20060043607
- Publication date Mar 2, 2006
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive film, lead frame with adhesive film, and semiconductor dev...
- Publication number 20050255278
- Publication date Nov 17, 2005
- Hidekazu Matsuura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Photosensitive resin composition, process of forming patterns with...
- Publication number 20040180286
- Publication date Sep 16, 2004
- Tomohiro Nagoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Publication number 20040124544
- Publication date Jul 1, 2004
- Toshiyasu Kawai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Publication number 20030102573
- Publication date Jun 5, 2003
- Yoshiyuki Tanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Resin composition, heat-resistant resin paste and semiconductor dev...
- Publication number 20030082925
- Publication date May 1, 2003
- Yasuhiro Yano
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method of producing a lead frame with composite film attached, and...
- Publication number 20020007905
- Publication date Jan 24, 2002
- Hidekazu Matsuura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Heat -resistant adhesive sheet
- Publication number 20010015484
- Publication date Aug 23, 2001
- Hidekazu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Hidekazu Matsuura

Person

Patents Grantslast 30 patents

Resin composition, heat-resistant resin paste and semiconductor dev...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, metal sheet with such adhesive fil...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Resin composition, heat-resistant resin paste and semiconductor dev...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Photosensitive resin composition, process of forming patterns with...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, lead frame with adhesive film for...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Heat-resistant adhesive sheet

Method of producing a lead frame with composite film attached, and...

Insulating adhesive for electronic parts, and lead frame and semico...

Process for fabricating a crack resistant resin encapsulated semico...

Method of producing a lead frame with composite film attached, and...

Process for fabricating a crack resistant resin encapsulated semico...

Process for fabricating a crack resistant resin encapsulated semico...

Composite film and lead frame with composite film attached

Method of forming resin film of desired pattern on semiconductor su...

Method of forming resin film of desired pattern on semiconductor su...

Polyimides and thermosetting resin compositions containing the same

Method for surface treatment of polyimide resin molded articles

Polyimides, thermosetting resin compositions containing the polyimi...

Polyimides, thermosetting resin compositions containing the polyimi...

Patents Applicationslast 30 patents

ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADH...

ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVIC...

Resin composition, heat-resistant resin paste and semiconductor dev...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, metal sheet with such adhesive fil...

Adhesive film, lead frame with adhesive film, and semiconductor dev...

Photosensitive resin composition, process of forming patterns with...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Resin composition, heat-resistant resin paste and semiconductor dev...

Method of producing a lead frame with composite film attached, and...

Heat -resistant adhesive sheet