Claims
- 1. A fabrication process of a semiconductor package, comprising the steps of:(1) bonding a semiconductor chip to a lead frame with an adhesive member; and (2) molding a molding compound so that the molding compound covers at least said semiconductor chip and a bonded part between the semiconductor chip and said lead frame, wherein: said adhesive member is a composite adhesive sheet comprising a heat-resistant film and a coating layer of an adhesive applied on both major surfaces of the heat resistant film; and said adhesive is a heat-resistant adhesive having a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %.
- 2. A fabrication process of a semiconductor package as defined in claim 1, wherein the glass transition temperature of said heat-resistant adhesive is 200° C. or higher.
- 3. A fabrication process of a semiconductor package as defined in claim 1, wherein the adhesive applied in the form of the coating layer on one of said major surfaces of said heat-resistant film comprises a heat-resistant adhesive which is different from the adhesive applied in the form of the coating layer on the other of said major surfaces of the heat-resistant film.
- 4. A fabrication process of a semiconductor package as defined in claim 1, wherein the adhesive applied in the form of the coating layer on one of said major surfaces of said heat-resistant film comprises a heat-resistant adhesive which is the same as the adhesive applied in the form of the coating layer on the other of said major surfaces of the heat-resistant film.
- 5. A fabrication process of a semiconductor package as defined in claim 1, wherein the glass transition temperature of said heat-resistant film is higher than the glass transition temperature of said heat-resistant adhesive.
- 6. A fabrication process of a semiconductor package as defined in claim 1, wherein the glass transition temperature of said heat-resistant adhesive is 200° C. or higher.
- 7. A fabrication process of a semiconductor package as defined in claim 2, wherein the adhesive applied in the form of the coating layer on one of said major surfaces of the heat-resistant film comprises a heat-resistant adhesive which is different from the heat-resistant adhesive applied in the form of the coating layer on the other of said major surfaces of the heat-resistant film.
- 8. A fabrication process of a semiconductor package as defined in claim 7, wherein the glass transition temperature of said heat-resistant film is higher than the glass transition temperature of said heat-resistant adhesive.
- 9. A fabrication process of a semiconductor package as defined in claim 2, wherein the adhesive applied in the form of the coating layer on one of said major surfaces of said heat-resistant film comprises a heat-resistant adhesive which is the same as the adhesive applied in the form of the coating layer on the other of said major surfaces of the heat-resistant film.
- 10. A fabrication process of a semiconductor package as defined in claim 9, wherein the glass transition temperature of said heat-resistant film is higher than the glass transition temperature of said heat-resistant adhesive.
- 11. A fabrication process of a semiconductor package as defined in claim 3, wherein the glass transition temperature of said heat-resistant film is higher than the glass transition temperature of said heat-resistant adhesive.
- 12. A fabrication process of a semiconductor package as defined in claim 4, wherein the glass transition temperature of said heat-resistant film is higher than the glass transition temperature of said heat-resistant adhesive.
Priority Claims (3)
Number |
Date |
Country |
Kind |
5-91870 |
Mar 1993 |
JP |
|
5-91899 |
Mar 1993 |
JP |
|
6-25939 |
Jan 1994 |
JP |
|
Parent Case Info
This application is a continuation-in-part of U.S. application Ser. No. 08/514,353 filed on Jul. 27, 1995, now abandoned entitled “HEAT-RESISTANT ADHESIVE” which is a Continuation Application under C.F.R. §1.62 for U.S. application Ser. No. 08/218,544 filed on Mar. 28, 1994 now abandoned.
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Continuations (1)
|
Number |
Date |
Country |
Parent |
08/218544 |
Mar 1994 |
US |
Child |
08/514353 |
|
US |
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
08/514353 |
Jul 1995 |
US |
Child |
08/542576 |
|
US |