Hideki Higashitani

Person

Mie, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board, method for manufacturing same and semiconductor device
- Patent number 8,071,881
- Issue date Dec 6, 2011
- Panasonic Corporation
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, wiring material, copper-clad laminate, and method...
- Patent number 7,968,803
- Issue date Jun 28, 2011
- Panasonic Corporation
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 7,291,915
- Issue date Nov 6, 2007
- Matsushita Electric Industrial Co., Ltd.
- Toshio Sugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring transfer sheet and method for producing the same, and wiring...
- Patent number 7,252,891
- Issue date Aug 7, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with intermediate connector
- Patent number 7,247,508
- Issue date Jul 24, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a wiring transfer sheet
- Patent number 7,200,927
- Issue date Apr 10, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 7,132,029
- Issue date Nov 7, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 7,018,705
- Issue date Mar 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring transfer sheet and method for producing the same, and wiring...
- Patent number 6,946,205
- Issue date Sep 20, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring transfer sheet and method for producing the same, and wiring...
- Patent number 6,926,789
- Issue date Aug 9, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,748,652
- Issue date Jun 15, 2004
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable film, a substrate with film, a process for forming the re...
- Patent number 6,745,464
- Issue date Jun 8, 2004
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,565,954
- Issue date May 20, 2003
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removable film, a substrate with film, a process for forming the re...
- Patent number 6,546,624
- Issue date Apr 15, 2003
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,532,651
- Issue date Mar 18, 2003
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 6,197,407
- Issue date Mar 6, 2001
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20130168148
- Publication date Jul 4, 2013
- Toshinobu Kanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE, AND MANUFACTURING METHOD FOR MULTILAYE...
- Publication number 20130062101
- Publication date Mar 14, 2013
- PANASONIC CORPORATION
- Toshinobu Kanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD
- Publication number 20100224395
- Publication date Sep 9, 2010
- PANASONIC CORPORATION
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring substrate, wiring material, copper-clad laminate, and method...
- Publication number 20100032202
- Publication date Feb 11, 2010
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE
- Publication number 20090133915
- Publication date May 28, 2009
- Matsushita Electric Industrial Co., Ltd.
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method of manufacturing the same
- Publication number 20060054350
- Publication date Mar 16, 2006
- Toshio Sugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board and method for manufacturing the same
- Publication number 20060008628
- Publication date Jan 12, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with intermediate connector
- Publication number 20050142693
- Publication date Jun 30, 2005
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board and method for manufacturing the same
- Publication number 20040231151
- Publication date Nov 25, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring transfer sheet and method for producing the same, and wiring...
- Publication number 20040202781
- Publication date Oct 14, 2004
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package of electronic components and method for producing the same
- Publication number 20040156177
- Publication date Aug 12, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hideki Higashitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring transfer sheet and method for producing the same, and wiring...
- Publication number 20040151883
- Publication date Aug 5, 2004
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring transfer sheet and method for producing the same, and wiring...
- Publication number 20040151884
- Publication date Aug 5, 2004
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring transfer sheet and method for producing the same, and wiring...
- Publication number 20030203171
- Publication date Oct 30, 2003
- Hideki Higashitani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Removable film, a substrate with film, a process for forming the re...
- Publication number 20030188428
- Publication date Oct 9, 2003
- Matsushita Electric Industrial Co., Ltd.
- Fumio Echigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method of manufacturing the same
- Publication number 20030180512
- Publication date Sep 25, 2003
- Matsushita Electric Industrial Co., Ltd.
- Daizou Andou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with intermediate connector
- Publication number 20020180029
- Publication date Dec 5, 2002
- Hideki Higashitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removable film, a substrate with film, a process for forming the re...
- Publication number 20020029906
- Publication date Mar 14, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Fumio Echigo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit board and method of manufacturing the same
- Publication number 20010005545
- Publication date Jun 28, 2001
- Daizou Andou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Hideki Higashitani

Person

Patents Grantslast 30 patents

Wiring board, method for manufacturing same and semiconductor device

Wiring substrate, wiring material, copper-clad laminate, and method...

Circuit board and method of manufacturing the same

Wiring transfer sheet and method for producing the same, and wiring...

Semiconductor device with intermediate connector

Method for producing a wiring transfer sheet

Multilayer circuit board and method for manufacturing the same

Multilayer circuit board and method for manufacturing the same

Wiring transfer sheet and method for producing the same, and wiring...

Wiring transfer sheet and method for producing the same, and wiring...

Circuit board and method of manufacturing the same

Removable film, a substrate with film, a process for forming the re...

Circuit board and method of manufacturing the same

Removable film, a substrate with film, a process for forming the re...

Circuit board and method of manufacturing the same

Circuit board and method of manufacturing the same

Patents Applicationslast 30 patents

MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING SAME

MULTILAYER WIRING SUBSTRATE, AND MANUFACTURING METHOD FOR MULTILAYE...

MULTILAYER WIRING BOARD AND ITS MANUFACTURING METHOD

Wiring substrate, wiring material, copper-clad laminate, and method...

WIRING BOARD, METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE

Circuit board and method of manufacturing the same

Multilayer circuit board and method for manufacturing the same

Semiconductor device with intermediate connector

Multilayer circuit board and method for manufacturing the same

Wiring transfer sheet and method for producing the same, and wiring...

Package of electronic components and method for producing the same

Wiring transfer sheet and method for producing the same, and wiring...

Wiring transfer sheet and method for producing the same, and wiring...

Wiring transfer sheet and method for producing the same, and wiring...

Removable film, a substrate with film, a process for forming the re...

Circuit board and method of manufacturing the same

Semiconductor device with intermediate connector

Removable film, a substrate with film, a process for forming the re...

Circuit board and method of manufacturing the same