Hideo Numata

Person

Oita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of electronic device and manufacturing method...
- Patent number 9,893,116
- Issue date Feb 13, 2018
- TOSHIBA MEMORY CORPORATION
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 9,024,424
- Issue date May 5, 2015
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 8,980,671
- Issue date Mar 17, 2015
- Kabushiki Kaisha Toshiba
- Satoshi Hongo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 8,822,307
- Issue date Sep 2, 2014
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, semiconductor substra...
- Patent number 8,778,778
- Issue date Jul 15, 2014
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 8,748,316
- Issue date Jun 10, 2014
- Kabushiki Kaisha Toshiba
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,704,337
- Issue date Apr 22, 2014
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,338,904
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 8,309,430
- Issue date Nov 13, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 8,268,673
- Issue date Sep 18, 2012
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 8,008,763
- Issue date Aug 30, 2011
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module and manufacturing method of the same
- Patent number 7,775,727
- Issue date Aug 17, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing optical fiber positioning component, and optica...
- Patent number 7,771,130
- Issue date Aug 10, 2010
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- G02 - OPTICS
Information Patent Grant
Stacked electronic component and manufacturing method thereof
- Patent number 7,629,695
- Issue date Dec 8, 2009
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 7,531,876
- Issue date May 12, 2009
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor module and semiconductor device including the...
- Patent number 7,438,481
- Issue date Oct 21, 2008
- Kabushiki Kaisha Toshiba
- Hideo Numata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing optical coupling part and optical coupling...
- Patent number 7,401,983
- Issue date Jul 22, 2008
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- G02 - OPTICS
Information Patent Grant
Lead frame, optical coupling part using lead frame, and manufacturi...
- Patent number 7,364,369
- Issue date Apr 29, 2008
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor module and its manufacturing method
- Patent number 7,255,493
- Issue date Aug 14, 2007
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Grant
Semiconductor device and fabrication method for the same
- Patent number 7,235,425
- Issue date Jun 26, 2007
- Kabushiki Kaisha Toshiba
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor module and its manufacturing method
- Patent number 7,118,294
- Issue date Oct 10, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Grant
Chip pickup device and method of manufacturing semiconductor device
- Patent number 6,774,011
- Issue date Aug 10, 2004
- Kabushiki Kaisha Toshiba
- Takahito Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing equipment
- Patent number 6,739,326
- Issue date May 25, 2004
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Semiconductor manufacturing equipment
- Patent number 6,352,073
- Issue date Mar 5, 2002
- Kabushiki Kaisha Toshiba
- Tetsuya Kurosawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer transfer apparatus
- Patent number 6,238,515
- Issue date May 29, 2001
- Lintec Corporation
- Masaki Tsujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for automatically mounting a plurality of semiconductor c...
- Patent number 5,871,610
- Issue date Feb 16, 1999
- Kabushiki Kaisha Toshiba
- Tomio Minohoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vortex flow meter
- Patent number 4,627,295
- Issue date Dec 9, 1986
- Oval Engineering Co., Ltd.
- Naoki Matsubara
- G01 - MEASURING TESTING
Information Patent Grant
Electrode connections for a piezoelectric sensor
- Patent number 4,511,819
- Issue date Apr 16, 1985
- Oval Engineering Co., Ltd.
- Naoki Matsubara
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD...
- Publication number 20160079303
- Publication date Mar 17, 2016
- KABUSHIKI KAISHA TOSHIBA
- Shinya Takyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR DEVICES, METHOD OF MANUFACTURING SUBSTR...
- Publication number 20150263212
- Publication date Sep 17, 2015
- KABUSHIKI KAISHA TOSHIBA
- Shinji UYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20150214193
- Publication date Jul 30, 2015
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...
- Publication number 20120329241
- Publication date Dec 27, 2012
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20120306103
- Publication date Dec 6, 2012
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120217600
- Publication date Aug 30, 2012
- Kabushiki Kaisha Toshiba
- Satoshi HONGO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE B...
- Publication number 20120190138
- Publication date Jul 26, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa TANIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRA...
- Publication number 20120049312
- Publication date Mar 1, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa TANIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...
- Publication number 20110317050
- Publication date Dec 29, 2011
- Takashi Shirono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CAMERA MODULE, AND MANUFACTURING METHOD OF SE...
- Publication number 20110304003
- Publication date Dec 15, 2011
- Kazumasa Tanida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Stacked electronic component and manufacturing method thereof
- Publication number 20110281396
- Publication date Nov 17, 2011
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...
- Publication number 20110217795
- Publication date Sep 8, 2011
- Kazumasa TANIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110073983
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110073974
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Eiji Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100213564
- Publication date Aug 26, 2010
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20080298745
- Publication date Dec 4, 2008
- Kabushiki Kaisha Toshiba
- Hiroshi HAMASAKI
- G02 - OPTICS
Information Patent Application
Stacked electronic component and manufacturing method thereof
- Publication number 20080197470
- Publication date Aug 21, 2008
- Kabushiki Kaisha Toshiba
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing optical fiber positioning component, and optica...
- Publication number 20080138027
- Publication date Jun 12, 2008
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20070235882
- Publication date Oct 11, 2007
- Kabushiki Kaisha Toshiba
- Masahiro Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, optical coupling part using lead frame, and manufacturi...
- Publication number 20070212001
- Publication date Sep 13, 2007
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
Method for manufacturing optical coupling part and optical coupling...
- Publication number 20070165986
- Publication date Jul 19, 2007
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
Optical semiconductor module and its manufacturing method
- Publication number 20060215969
- Publication date Sep 28, 2006
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Application
Stacked electronic component and manufacturing method thereof
- Publication number 20060139893
- Publication date Jun 29, 2006
- Atsushi Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer support plate, holding method of thin wafer, and manufacturin...
- Publication number 20060102290
- Publication date May 18, 2006
- Susumu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20060071271
- Publication date Apr 6, 2006
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060055050
- Publication date Mar 16, 2006
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LSI package with interface module, transmission line package, and r...
- Publication number 20060050493
- Publication date Mar 9, 2006
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Application
Optical semiconductor module and semiconductor device including the...
- Publication number 20060045434
- Publication date Mar 2, 2006
- Hideo Numata
- G02 - OPTICS
Information Patent Application
LSI package having interface function with exterior, circuit device...
- Publication number 20060035510
- Publication date Feb 16, 2006
- Hideo Numata
- G02 - OPTICS
Information Patent Application
Semiconductor device and fabrication method for the same
- Publication number 20050184373
- Publication date Aug 25, 2005
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS

Hideo Numata

Person

Patents Grantslast 30 patents

Manufacturing method of electronic device and manufacturing method...

Stacked electronic component and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Manufacturing method of semiconductor device, semiconductor substra...

Method of manufacturing semiconductor device, semiconductor device,...

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Stacked electronic component and manufacturing method thereof

Stacked electronic component and manufacturing method thereof

Optical module and manufacturing method of the same

Method of producing optical fiber positioning component, and optica...

Stacked electronic component and manufacturing method thereof

Semiconductor device having power semiconductor elements

Optical semiconductor module and semiconductor device including the...

Method for manufacturing optical coupling part and optical coupling...

Lead frame, optical coupling part using lead frame, and manufacturi...

Optical semiconductor module and its manufacturing method

Semiconductor device and fabrication method for the same

Optical semiconductor module and its manufacturing method

Chip pickup device and method of manufacturing semiconductor device

Semiconductor manufacturing equipment

Semiconductor manufacturing equipment

Wafer transfer apparatus

Apparatus for automatically mounting a plurality of semiconductor c...

Vortex flow meter

Electrode connections for a piezoelectric sensor

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF ELECTRONIC DEVICE AND MANUFACTURING METHOD...

SUBSTRATE FOR SEMICONDUCTOR DEVICES, METHOD OF MANUFACTURING SUBSTR...

STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...

STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR SUBSTRATE B...

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE, CAMERA MODULE, AND MANUFACTURING METHOD OF SE...

Stacked electronic component and manufacturing method thereof

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE AND MANUFACTURING METHOD OF THE SAME

Stacked electronic component and manufacturing method thereof

Method of producing optical fiber positioning component, and optica...

Semiconductor device and method for fabricating the same

Lead frame, optical coupling part using lead frame, and manufacturi...

Method for manufacturing optical coupling part and optical coupling...

Optical semiconductor module and its manufacturing method

Stacked electronic component and manufacturing method thereof

Wafer support plate, holding method of thin wafer, and manufacturin...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

LSI package with interface module, transmission line package, and r...

Optical semiconductor module and semiconductor device including the...

LSI package having interface function with exterior, circuit device...

Semiconductor device and fabrication method for the same