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Patents Grants
last 30 patents
Information
Patent Grant
Method of producing a semiconductor package
Patent number
9,842,792
Issue date
Dec 12, 2017
UTAC HEADQUARTERS PTE. LTD.
Danny Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of producing a semiconductor package
Patent number
9,281,218
Issue date
Mar 8, 2016
United Test & Assembly Center Ltd.
Danny Retuta
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
High density chip scale leadframe package and method of manufacturi...
Patent number
8,129,222
Issue date
Mar 6, 2012
United Test and Assembly Test Center Ltd.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced semiconductor package and method of producing th...
Patent number
8,039,951
Issue date
Oct 18, 2011
United Test & Assembly Center Ltd.
Kolan Ravi Kanth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with under bump metallization aligned with op...
Patent number
8,030,768
Issue date
Oct 4, 2011
United Test & Assembly Center Ltd.
Roel Robles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structurally-enhanced integrated circuit package and method of manu...
Patent number
7,830,006
Issue date
Nov 9, 2010
United Test and Assembly Center, Ltd.
Ravi Kanth Kolan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die IC package and manufacturing method
Patent number
7,816,775
Issue date
Oct 19, 2010
United Test & Assembly Center Limited
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die packages
Patent number
7,723,833
Issue date
May 25, 2010
United Test & Assembly Center Ltd.
Gaurav Mehta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package and method of manufacture
Patent number
7,678,610
Issue date
Mar 16, 2010
UTAC - United Test and Assembly Test Center Ltd.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe enhancement and method of producing a multi-row semicondu...
Patent number
7,476,569
Issue date
Jan 13, 2009
United Test & Assembly Center Ltd.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe enhancement and method of producing a multi-row semicondu...
Patent number
7,375,416
Issue date
May 20, 2008
United Test & Assembly Center Ltd.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density chip scale leadframe package and method of manufacturi...
Patent number
7,345,357
Issue date
Mar 18, 2008
United Test & Assembly Center Ltd.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cavity chip package
Patent number
7,339,278
Issue date
Mar 4, 2008
United Test & Assembly Center Ltd.
Henry Iksan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance chip scale leadframe package with thermal dissipat...
Patent number
7,323,769
Issue date
Jan 29, 2008
United Test & Assembly Center Ltd.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with leadframe enhancement and method of...
Patent number
7,109,570
Issue date
Sep 19, 2006
United Test and Assembly Test Center Ltd.
Rodel Manalac
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground plane for exposed package
Patent number
6,876,069
Issue date
Apr 5, 2005
ST Assembly Test Services PTE LTD
Jefferey D. Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ground plane for exposed package
Patent number
6,630,373
Issue date
Oct 7, 2003
ST Assembly Test Service Ltd.
Jeffrey D. Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe based chip scale package and method of producing the same
Patent number
6,420,779
Issue date
Jul 16, 2002
ST Assembly Test Services Ltd.
Nirmal K. Sharma
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR PACKAGE
Publication number
20160211196
Publication date
Jul 21, 2016
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE
Publication number
20090236726
Publication date
Sep 24, 2009
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structurally-enhanced integrated circuit package and method of manu...
Publication number
20090072391
Publication date
Mar 19, 2009
Ravi Kanth Kolan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Scale Package and Method of Assembling the Same
Publication number
20080290509
Publication date
Nov 27, 2008
UNITED TEST AND ASSEMBLY CENTER
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP ON VIA-PACKAGING AND METHODOLOGIES
Publication number
20080284015
Publication date
Nov 20, 2008
United Test and Assembly Center, Ltd.
Roel Robles
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
Publication number
20080251938
Publication date
Oct 16, 2008
UTAC - United Test and Assembly Center LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDU...
Publication number
20080199985
Publication date
Aug 21, 2008
UNITED TEST AND ASSEMBLY CENTER LTD.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Die Ic Package and Manufacturing Method
Publication number
20080150103
Publication date
Jun 26, 2008
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Producing a Semiconductor Package
Publication number
20080061414
Publication date
Mar 13, 2008
United Test & Assembly Center Ltd.
Danny RETUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Die Packages
Publication number
20080054435
Publication date
Mar 6, 2008
United Test and Assembly Center, Ltd.
Gaurav MEHTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe enhancement and method of producing a multi-row semicondu...
Publication number
20070246810
Publication date
Oct 25, 2007
UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Danny Vallejo Retuta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally enhanced semiconductor package and method of producing th...
Publication number
20070164425
Publication date
Jul 19, 2007
UNITED TEST AND ASSEMBLY CENTER LTD.
Ravi Kanth Kolan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multiple stacked die window csp package and method of manufacture
Publication number
20070132081
Publication date
Jun 14, 2007
United Test & Assembly Center Limited
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAVITY CHIP PACKAGE
Publication number
20070069371
Publication date
Mar 29, 2007
United Test & Assembly Center Ltd.
Henry IKSAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High performance chip scale leadframe with t-shape die pad and meth...
Publication number
20060202313
Publication date
Sep 14, 2006
UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip package and method of manufacture
Publication number
20060192292
Publication date
Aug 31, 2006
UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Chuen Khiang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package with leadframe enhancement and method of...
Publication number
20050051876
Publication date
Mar 10, 2005
UNITED TEST AND ASSEMBLY TEST CENTER, LTD.
Rodel Manalac
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High density chip scale leadframe package and method of manufacturi...
Publication number
20040104457
Publication date
Jun 3, 2004
UNITED TEST AND ASSEMBLY TEST CENTER LTD.
Hien Boon Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ground plane for exposed package
Publication number
20040070055
Publication date
Apr 15, 2004
ST ASSEMBLY TEST SERVICES PTE LTD
Jeffrey D. Punzalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GROUND PLANE FOR EXPOSED PACKAGE
Publication number
20030160309
Publication date
Aug 28, 2003
ST ASSEMBLY TEST SERVICES PTE LTD
Jeffrey D. Punzalan
H01 - BASIC ELECTRIC ELEMENTS