Hiroaki Fujimoto

Person

Hirakata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded structure and bonding method
- Patent number 8,012,869
- Issue date Sep 6, 2011
- Panasonic Corporation
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,868,336
- Issue date Jan 11, 2011
- Panasonic Corporation
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and bonding method
- Patent number 7,629,688
- Issue date Dec 8, 2009
- Panasonic Corporation
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and lead frame, and method...
- Patent number 7,495,319
- Issue date Feb 24, 2009
- Panasonic Corporation
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and method for fabricating the same
- Patent number 7,495,339
- Issue date Feb 24, 2009
- Panasonic Corporation
- Masanori Minamio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for the fabrication thereof includi...
- Patent number 7,309,624
- Issue date Dec 18, 2007
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device cavity structure, optical device, and method for man...
- Patent number 7,286,729
- Issue date Oct 23, 2007
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof grindin...
- Patent number 7,125,751
- Issue date Oct 24, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 7,087,455
- Issue date Aug 8, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,078,818
- Issue date Jul 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,924,173
- Issue date Aug 2, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,815,255
- Issue date Nov 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor chips on a wiring board
- Patent number 6,777,796
- Issue date Aug 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, semiconductor device, and method for manufactu...
- Patent number 6,764,879
- Issue date Jul 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Koichi Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same, and method...
- Patent number 6,713,880
- Issue date Mar 30, 2004
- Matsushita Electric Industrial Co., Ltd.
- Ryuichi Sahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor chips attached to a wiring board
- Patent number 6,707,143
- Issue date Mar 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,693,347
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding an identifying mark on the resin surface of an...
- Patent number 6,680,220
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,680,524
- Issue date Jan 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,559,528
- Issue date May 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a plurality of stacked semiconductor ch...
- Patent number 6,509,638
- Issue date Jan 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,498,393
- Issue date Dec 24, 2002
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor devices having protruding contacts
- Patent number 6,107,120
- Issue date Aug 22, 2000
- Matsushita Electric Indsutrial Co., Ltd.
- Takashi Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having protruding contacts
- Patent number 5,952,718
- Issue date Sep 14, 1999
- Matsushita Electric Industrial Co., Ltd.
- Takashi Ohtsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,930,599
- Issue date Jul 27, 1999
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of chip on chip mounting preventing from crosstalk noise
- Patent number 5,821,625
- Issue date Oct 13, 1998
- Matsushita Electric Industrial Co., Ltd.
- Takayuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,805,865
- Issue date Sep 8, 1998
- Matsushita Electric Industrial Co., Ltd.
- Tadaaki Mimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having offsetchips
- Patent number 5,773,896
- Issue date Jun 30, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of chip on chip mounting preventing from crosstalk noise
- Patent number 5,767,009
- Issue date Jun 16, 1998
- Matsushita Electric Industrial Co., Ltd.
- Takayuki Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic component
- Patent number 5,526,563
- Issue date Jun 18, 1996
- Matsushita Electric Industrial Co., Ltd.
- Tomohiro Tamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20110233772
- Publication date Sep 29, 2011
- PANASONIC CORPORATION
- Hiroaki FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110147905
- Publication date Jun 23, 2011
- PANASONIC CORPORATION
- Masaki Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110074048
- Publication date Mar 31, 2011
- PANASONIC CORPORATION
- Toshihiko Shibita
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20100044881
- Publication date Feb 25, 2010
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE AND BONDING METHOD
- Publication number 20100048017
- Publication date Feb 25, 2010
- PANASONIC CORPORATION
- Masanori MINAMIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20090289357
- Publication date Nov 26, 2009
- Hiroaki FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090134505
- Publication date May 28, 2009
- PANASONIC CORPORATION
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD...
- Publication number 20090130801
- Publication date May 21, 2009
- PANASONIC CORPORATION
- Toshiyuki FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090039509
- Publication date Feb 12, 2009
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20080179711
- Publication date Jul 31, 2008
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor image sensor die and production method thereof, semic...
- Publication number 20080083964
- Publication date Apr 10, 2008
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080073786
- Publication date Mar 27, 2008
- Matsushita Electric Industrial Co., Ltd.
- Manabu Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection structure and method for fabricating the same
- Publication number 20070187834
- Publication date Aug 16, 2007
- Masanori Minamio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonded structure and bonding method
- Publication number 20070035035
- Publication date Feb 15, 2007
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20060252183
- Publication date Nov 9, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical device cavity structure, optical device, and method for man...
- Publication number 20060222285
- Publication date Oct 5, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20060208349
- Publication date Sep 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20060079023
- Publication date Apr 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin-encapsulated semiconductor device and lead frame, and method...
- Publication number 20050194676
- Publication date Sep 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20050133892
- Publication date Jun 23, 2005
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20040145040
- Publication date Jul 29, 2004
- Toshiyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040029314
- Publication date Feb 12, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20030194834
- Publication date Oct 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030089972
- Publication date May 15, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030085457
- Publication date May 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20030085458
- Publication date May 8, 2003
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20030038359
- Publication date Feb 27, 2003
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20030032216
- Publication date Feb 13, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Nakaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer, semiconductor device, and method for manufactu...
- Publication number 20030032263
- Publication date Feb 13, 2003
- Matsushita Electric Industrial Co., Ltd.
- Koichi Nagao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20020137254
- Publication date Sep 26, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masanori Minamio
- H01 - BASIC ELECTRIC ELEMENTS

Hiroaki Fujimoto

Person

Patents Grantslast 30 patents

Bonded structure and bonding method

Semiconductor device and method of manufacturing the same

Bonded structure and bonding method

Resin-encapsulated semiconductor device and lead frame, and method...

Connection structure and method for fabricating the same

Semiconductor device and method for the fabrication thereof includi...

Optical device cavity structure, optical device, and method for man...

Semiconductor device and method for the fabrication thereof grindin...

Semiconductor device and manufacturing method for the same

Semiconductor device

Semiconductor device and method for the fabrication thereof

Semiconductor device and manufacturing method thereof

Stacked semiconductor chips on a wiring board

Semiconductor wafer, semiconductor device, and method for manufactu...

Semiconductor device and method for producing the same, and method...

Stacked semiconductor chips attached to a wiring board

Semiconductor device

Method of embedding an identifying mark on the resin surface of an...

Semiconductor device and method for fabricating the same

Semiconductor device and method for the fabrication thereof

Semiconductor device having a plurality of stacked semiconductor ch...

Semiconductor device and method for the fabrication thereof

Method of making semiconductor devices having protruding contacts

Semiconductor devices having protruding contacts

Semiconductor device and method of manufacturing the same

Structure of chip on chip mounting preventing from crosstalk noise

Semiconductor device

Semiconductor device having offsetchips

Structure of chip on chip mounting preventing from crosstalk noise

Method for manufacturing an electronic component

Patents Applicationslast 30 patents

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

BONDED STRUCTURE AND BONDING METHOD

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor image sensor die and production method thereof, semic...

Semiconductor device and method of manufacturing the same

Connection structure and method for fabricating the same

Bonded structure and bonding method

Semiconductor device and method for the fabrication thereof

Optical device cavity structure, optical device, and method for man...

Semiconductor device and manufacturing method for the same

Semiconductor device and manufacturing method for the same

Resin-encapsulated semiconductor device and lead frame, and method...

Semiconductor device and method for the fabrication thereof

Semiconductor device and manufacturing method for the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for the fabrication thereof

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device and method for the fabrication thereof

Semiconductor device and manufacturing method thereof

Semiconductor wafer, semiconductor device, and method for manufactu...

Semiconductor device and method for fabricating the same