Hiroaki Yoshino

Person

Akishima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discharge examination device, wire-bonding apparatus, and discharge...
- Patent number 10,607,959
- Issue date Mar 31, 2020
- Shinkawa Ltd.
- Kazumasa Sasakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding apparatus, and manufacturing method of semi...
- Patent number 8,540,135
- Issue date Sep 24, 2013
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 8,196,803
- Issue date Jun 12, 2012
- Shinkawa Ltd.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and wire bonding appar...
- Patent number 8,123,108
- Issue date Feb 28, 2012
- Shinkawa Ltd.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,910,472
- Issue date Mar 22, 2011
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method
- Patent number 7,621,436
- Issue date Nov 24, 2009
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...
- Publication number 20230163097
- Publication date May 25, 2023
- SHINKAWA LTD.
- Hiroaki YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...
- Publication number 20220328450
- Publication date Oct 13, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...
- Publication number 20220208721
- Publication date Jun 30, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...
- Publication number 20160358879
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- KAZUMASA SASAKURA
- G01 - MEASURING TESTING
Information Patent Application
BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVI...
- Publication number 20160358883
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- HIROAKI YOSHINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20120055976
- Publication date Mar 8, 2012
- SHINKAWA LTD.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND MANUFACTURING METHOD OF SEMI...
- Publication number 20110226838
- Publication date Sep 22, 2011
- SHINKAWA LTD.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20110180590
- Publication date Jul 28, 2011
- SHINKAWA LTD.
- Shinichi Akiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20100248470
- Publication date Sep 30, 2010
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and wire bonding method
- Publication number 20080197510
- Publication date Aug 21, 2008
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method
- Publication number 20070108256
- Publication date May 17, 2007
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Hiroaki Yoshino

Person

Patents Grantslast 30 patents

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Discharge examination device, wire-bonding apparatus, and discharge...

Bonding method, bonding apparatus, and manufacturing method of semi...

Method of manufacturing semiconductor device and wire bonding appar...

Method of manufacturing semiconductor device and wire bonding appar...

Method of manufacturing semiconductor device

Wire bonding method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

WIRE BONDING DEVICE, WIRE CUTTING METHOD AND NON-TRANSITORY COMPUTE...

WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...

WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEV...

DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE...

BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

BONDING METHOD, BONDING APPARATUS, AND MANUFACTURING METHOD OF SEMI...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

Method of manufacturing semiconductor device

Semiconductor device and wire bonding method

Wire bonding method