Hironori Ono

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing chip-size package-type semiconductor device
- Patent number 5,759,873
- Issue date Jun 2, 1998
- NEC Corporation
- Keiichiro Kata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Rack Structure, Power Storage System, and Method of Assembling Rack...
- Publication number 20150333303
- Publication date Nov 19, 2015
- NEC Engineering, Ltd.
- Kuniatsu Hachiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Battery Shelf Assembly, Power Storage System, and Assemblying Metho...
- Publication number 20150303419
- Publication date Oct 22, 2015
- NEC Corporation
- Kuniatsu Hachiya
- H01 - BASIC ELECTRIC ELEMENTS