Hiroyuki Tenmei

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,937,390
- Issue date Jan 20, 2015
- PS4 Luxco S.A.R.L.
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liquid cooling module
- Patent number 8,704,352
- Issue date Apr 22, 2014
- Nae Hisano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer of circuit board and joining structure of wafer or circuit board
- Patent number 8,334,465
- Issue date Dec 18, 2012
- Elpida Memory, Inc.
- Masakazu Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a three-dimensional semiconductor device a...
- Patent number 7,754,581
- Issue date Jul 13, 2010
- Elpida Memory, Inc.
- Hiroaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of semiconductor and laminated structure fabricated...
- Patent number 7,618,847
- Issue date Nov 17, 2009
- Elpida Memory, Inc.
- Hiroyuki Tenmei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,378,333
- Issue date May 27, 2008
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having projected electrodes and structure for...
- Patent number 7,084,498
- Issue date Aug 1, 2006
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 7,057,283
- Issue date Jun 6, 2006
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 7,002,250
- Issue date Feb 21, 2006
- Renesas Technology Corp.
- Hiroshi Hozoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for producing same
- Patent number 6,998,713
- Issue date Feb 14, 2006
- Hitachi, Ltd.
- Yasumori Narizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 6,946,723
- Issue date Sep 20, 2005
- Renesas Technology Corp.
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same and semi...
- Patent number 6,930,388
- Issue date Aug 16, 2005
- Renesas Technology Corp.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus including insulating layer having a protrus...
- Patent number 6,822,317
- Issue date Nov 23, 2004
- Renesas Technology Corporation
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module including semiconductor devices and a wiring subs...
- Patent number 6,791,178
- Issue date Sep 14, 2004
- Hitachi, Ltd.
- Yoshihide Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wafer level chip size package utilizing a m...
- Patent number 6,780,748
- Issue date Aug 24, 2004
- Hitachi, Ltd.
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device
- Patent number 6,770,547
- Issue date Aug 3, 2004
- Renesas Technology Corporation
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and its production method, semiconductor device and it...
- Patent number 6,756,688
- Issue date Jun 29, 2004
- Hitachi, Ltd.
- Yasumori Narizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,624,504
- Issue date Sep 23, 2003
- Hitachi, Ltd.
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method of making the device
- Patent number 6,610,934
- Issue date Aug 26, 2003
- Hitachi, Ltd.
- Yoshihide Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and its production method, semiconductor device and it...
- Patent number 6,515,372
- Issue date Feb 4, 2003
- Hitachi, Ltd.
- Yasumori Narizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Circuit Board, Semiconductor Device Using the Same and...
- Publication number 20160148865
- Publication date May 26, 2016
- Hitachi, Ltd
- Kazuaki NAOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20140183730
- Publication date Jul 3, 2014
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD
- Publication number 20130140067
- Publication date Jun 6, 2013
- Elpida Memory, Inc.
- Masakazu Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE
- Publication number 20100171213
- Publication date Jul 8, 2010
- Elpida Memory, Inc.
- Nae HISANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20090134498
- Publication date May 28, 2009
- Elpida Memory, Inc.
- Hiroaki IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer of circuit board and joining structure of wafer or circuit board
- Publication number 20090109641
- Publication date Apr 30, 2009
- Elpida Memory, Inc.
- Masakazu Ishino
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...
- Publication number 20090072414
- Publication date Mar 19, 2009
- Hiroyuki TENMEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE A...
- Publication number 20080164575
- Publication date Jul 10, 2008
- Elpida Memory, Inc.
- Hiroaki Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080136024
- Publication date Jun 12, 2008
- Elpida Memory, Inc.
- Yasuhiro NAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method for producing same
- Publication number 20060091553
- Publication date May 4, 2006
- Hitachi, Ltd
- Yasunori Narizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050245061
- Publication date Nov 3, 2005
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method for producing same
- Publication number 20040201105
- Publication date Oct 14, 2004
- Hitachi, Ltd
- Yasunori Narizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20040195687
- Publication date Oct 7, 2004
- Kosuke Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method and semiconductor device
- Publication number 20030109079
- Publication date Jun 12, 2003
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and its production method, semiconductor device and it...
- Publication number 20030104183
- Publication date Jun 5, 2003
- Yasunori Narizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and structure for mounting the same
- Publication number 20030071331
- Publication date Apr 17, 2003
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20020180015
- Publication date Dec 5, 2002
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module and method of making the device
- Publication number 20020180027
- Publication date Dec 5, 2002
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20020079575
- Publication date Jun 27, 2002
- Hiroshi Hozoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same and semi...
- Publication number 20020063332
- Publication date May 30, 2002
- Yoshihide Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020025655
- Publication date Feb 28, 2002
- Toshiya Satoh
- H01 - BASIC ELECTRIC ELEMENTS

Hiroyuki Tenmei

Person

Patents Grantslast 30 patents

Semiconductor device having a liquid cooling module

Semiconductor device having a liquid cooling module

Wafer of circuit board and joining structure of wafer or circuit board

Method for manufacturing a three-dimensional semiconductor device a...

Bonding method of semiconductor and laminated structure fabricated...

Semiconductor device and manufacturing method thereof

Semiconductor device having projected electrodes and structure for...

Semiconductor device and method for producing the same

Semiconductor module

Wiring board and method for producing same

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing the same and semi...

Semiconductor apparatus including insulating layer having a protrus...

Multi-chip module including semiconductor devices and a wiring subs...

Method of fabricating a wafer level chip size package utilizing a m...

Method for producing a semiconductor device

Wiring board and its production method, semiconductor device and it...

Semiconductor device and method for manufacturing the same

Semiconductor module and method of making the device

Wiring board and its production method, semiconductor device and it...

Patents Applicationslast 30 patents

Electronic Circuit Board, Semiconductor Device Using the Same and...

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

WAFER OR CIRCUIT BOARD AND JOINING STRUCTURE OF WAFER OR CIRCUIT BOARD

SEMICONDUCTOR DEVICE HAVING A LIQUID COOLING MODULE

SEMICONDUCTOR APPARATUS

Wafer of circuit board and joining structure of wafer or circuit board

BONDING METHOD OF SEMICONDUCTOR AND LAMINATED STRUCTURE FABRICATED...

METHOD FOR MANUFACTURING A THREE-DIMENSIONAL SEMICONDUCTOR DEVICE A...

SEMICONDUCTOR DEVICE

Wiring board and method for producing same

Semiconductor device and manufacturing method thereof

Wiring board and method for producing same

Semiconductor device and method for producing the same

Semiconductor device manufacturing method and semiconductor device

Wiring board and its production method, semiconductor device and it...

Semiconductor device and structure for mounting the same

Semiconductor module

Semiconductor module and method of making the device

Semiconductor module

Semiconductor device and method for manufacturing the same and semi...

Semiconductor device and manufacturing method thereof