Hisashi Masumura

Person

Nishigo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing head and polishing apparatus
- Patent number 9,266,216
- Issue date Feb 23, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 8,636,561
- Issue date Jan 28, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, polishing apparatus and method for demounting workp...
- Patent number 8,323,075
- Issue date Dec 4, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece holder for polishing, workpiece polishing apparatus and p...
- Patent number 8,268,114
- Issue date Sep 18, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 8,092,281
- Issue date Jan 10, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus having the same
- Patent number 8,021,210
- Issue date Sep 20, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head, polishing apparatus and polishing method for semico...
- Patent number 7,740,521
- Issue date Jun 22, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Method and pad for polishing wafer
- Patent number 7,695,347
- Issue date Apr 13, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer manufacturing method, polishing apparatus, and wafer
- Patent number 7,582,221
- Issue date Sep 1, 2009
- Shin-Etsu Handotai Co., Ltd.
- Shigeyoshi Netsu
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece holder for polishing, polishing apparatus and polishing m...
- Patent number 6,769,966
- Issue date Aug 3, 2004
- Shin-Etsu Handotai Co., Ltd.
- Kouichi Okamura
- B24 - GRINDING POLISHING
Information Patent Grant
Process for manufacturing semiconductor wafer and semiconductor wafer
- Patent number 6,729,941
- Issue date May 4, 2004
- Shin-Etsu Handotai & Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method, wafer cleaning method and wafer protective...
- Patent number 6,558,233
- Issue date May 6, 2003
- Shin-Etsu Handotai Co., Ltd.
- Takashi Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holder for polishing, apparatus for polishing workpiece a...
- Patent number 6,422,922
- Issue date Jul 23, 2002
- Shin-Etsu Handotai Co., Ltd.
- Kouichi Okamura
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for polishing work
- Patent number 6,399,498
- Issue date Jun 4, 2002
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece holder for polishing, method for producing the same, meth...
- Patent number 6,386,957
- Issue date May 14, 2002
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Polishing method and polishing device
- Patent number 6,332,830
- Issue date Dec 25, 2001
- Shin-Etsu Handotai Co., Ltd.
- Kouichi Okamura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, polishing method, and polishing machine for mirror-p...
- Patent number 6,306,021
- Issue date Oct 23, 2001
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic workpiece transport apparatus for double-side polishing m...
- Patent number 6,135,854
- Issue date Oct 24, 2000
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method for semiconductor wafer and polishing pad used the...
- Patent number 6,120,353
- Issue date Sep 19, 2000
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier for double-side polishing
- Patent number 6,042,688
- Issue date Mar 28, 2000
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing semiconductor wafers
- Patent number 5,951,374
- Issue date Sep 14, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,942,445
- Issue date Aug 24, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- C30 - CRYSTAL GROWTH
Information Patent Grant
Apparatus and method for double-sided polishing semiconductor wafers
- Patent number 5,914,053
- Issue date Jun 22, 1999
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing agent used for polishing semiconductor wafers and polishi...
- Patent number 5,891,353
- Issue date Apr 6, 1999
- Shin-Etsu Handotai Co, Ltd.
- Hisashi Masumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing agent used for polishing semiconductor wafers and polishi...
- Patent number 5,866,226
- Issue date Feb 2, 1999
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor mirror wafers
- Patent number 5,827,779
- Issue date Oct 27, 1998
- Shin-Etsu Handotai Co. Ltd.
- Hisashi Masumura
- C30 - CRYSTAL GROWTH
Information Patent Grant
Polishing pad used for polishing silicon wafers and polishing metho...
- Patent number 5,827,395
- Issue date Oct 27, 1998
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor mirror wafers
- Patent number 5,821,167
- Issue date Oct 13, 1998
- Shin-Etsu Handotai Co., Ltd.
- Teruaki Fukami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,800,725
- Issue date Sep 1, 1998
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of and apparatus for determining residual damage to wafer edges
- Patent number 5,790,252
- Issue date Aug 4, 1998
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPITAXIAL WAFER CLEANING METHOD
- Publication number 20230411143
- Publication date Dec 21, 2023
- Shin-Etsu Handotai Co., Ltd.
- Norimichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20150017890
- Publication date Jan 15, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20140113531
- Publication date Apr 24, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING APPARATUS, AND METHOD FOR POLISHING WORKP...
- Publication number 20140101925
- Publication date Apr 17, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR-PHASE GROWTH SEMICONDUCTOR SUBSTRATE SUPPORT SUSCEPTOR, EPITA...
- Publication number 20120309175
- Publication date Dec 6, 2012
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- C30 - CRYSTAL GROWTH
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20110136414
- Publication date Jun 9, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20110070813
- Publication date Mar 24, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME
- Publication number 20100291838
- Publication date Nov 18, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD, POLISHING APPARATUS AND METHOD FOR DEMOUNTING WORKP...
- Publication number 20100233945
- Publication date Sep 16, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD AND POLISHING APPARATUS
- Publication number 20100210192
- Publication date Aug 19, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
Polishing head and polishing apparatus
- Publication number 20090291623
- Publication date Nov 26, 2009
- Shin-Etsu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER
- Publication number 20090057840
- Publication date Mar 5, 2009
- Shin-Etsu Handotai Co., Ltd.
- Shigeyoshi Netsu
- B24 - GRINDING POLISHING
Information Patent Application
Polishing Head, Polishing Apparatus and Polishing Method for Semico...
- Publication number 20080254720
- Publication date Oct 16, 2008
- Shin-Etsu Handotai Co., Ltd.
- Hiromasa Hashimoto
- B24 - GRINDING POLISHING
Information Patent Application
Method and pad for polishing wafer
- Publication number 20050014455
- Publication date Jan 20, 2005
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
Grinding work holding disk, work grinding device and grinding method
- Publication number 20040238121
- Publication date Dec 2, 2004
- Hisashi Masumura
- B24 - GRINDING POLISHING
Information Patent Application
Process for manufacturing semiconductor wafer and semiconductor wafer
- Publication number 20040224519
- Publication date Nov 11, 2004
- SHIN-ETSU HANDOTAI CO., LTD.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Wafer manufacturing method, polishing apparatus , and wafer
- Publication number 20030022495
- Publication date Jan 30, 2003
- Shigeyoshi Netsu
- B24 - GRINDING POLISHING
Information Patent Application
Workpiece holder for polishing, polishing apparatus and polishing m...
- Publication number 20020160697
- Publication date Oct 31, 2002
- Kouichi Okamura
- B24 - GRINDING POLISHING
Information Patent Application
Method for producing semiconductor wafer and semiconductor wafer
- Publication number 20020137313
- Publication date Sep 26, 2002
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad, polishing method, and polishing machine for mirror-p...
- Publication number 20020031990
- Publication date Mar 14, 2002
- Shin-Estu Handotai Co., Ltd.
- Hisashi Masumura
- B24 - GRINDING POLISHING

Hisashi Masumura

Person

Patents Grantslast 30 patents

Polishing head and polishing apparatus

Polishing head and polishing apparatus

Polishing head, polishing apparatus and method for demounting workp...

Workpiece holder for polishing, workpiece polishing apparatus and p...

Polishing head and polishing apparatus

Polishing head and polishing apparatus having the same

Polishing head, polishing apparatus and polishing method for semico...

Method and pad for polishing wafer

Wafer manufacturing method, polishing apparatus, and wafer

Workpiece holder for polishing, polishing apparatus and polishing m...

Process for manufacturing semiconductor wafer and semiconductor wafer

Wafer polishing method, wafer cleaning method and wafer protective...

Workpiece holder for polishing, apparatus for polishing workpiece a...

Method and apparatus for polishing work

Workpiece holder for polishing, method for producing the same, meth...

Polishing method and polishing device

Polishing pad, polishing method, and polishing machine for mirror-p...

Automatic workpiece transport apparatus for double-side polishing m...

Polishing method for semiconductor wafer and polishing pad used the...

Carrier for double-side polishing

Method of polishing semiconductor wafers

Method of manufacturing semiconductor wafers

Apparatus and method for double-sided polishing semiconductor wafers

Polishing agent used for polishing semiconductor wafers and polishi...

Polishing agent used for polishing semiconductor wafers and polishi...

Method of manufacturing semiconductor mirror wafers

Polishing pad used for polishing silicon wafers and polishing metho...

Method of manufacturing semiconductor mirror wafers

Method of manufacturing semiconductor wafers

Method of and apparatus for determining residual damage to wafer edges

Patents Applicationslast 30 patents

EPITAXIAL WAFER CLEANING METHOD

POLISHING HEAD AND POLISHING APPARATUS

POLISHING HEAD AND POLISHING APPARATUS

POLISHING HEAD, POLISHING APPARATUS, AND METHOD FOR POLISHING WORKP...

VAPOR-PHASE GROWTH SEMICONDUCTOR SUBSTRATE SUPPORT SUSCEPTOR, EPITA...

POLISHING HEAD AND POLISHING APPARATUS

METHOD FOR MANUFACTURING POLISHING HEAD AND POLISHING APPARATUS

POLISHING HEAD AND POLISHING APPARATUS HAVING THE SAME

POLISHING HEAD, POLISHING APPARATUS AND METHOD FOR DEMOUNTING WORKP...

POLISHING HEAD AND POLISHING APPARATUS

Polishing head and polishing apparatus

WAFER MANUFACTURING METHOD, POLISHING APPARATUS, AND WAFER

Polishing Head, Polishing Apparatus and Polishing Method for Semico...

Method and pad for polishing wafer

Grinding work holding disk, work grinding device and grinding method

Process for manufacturing semiconductor wafer and semiconductor wafer

Wafer manufacturing method, polishing apparatus , and wafer

Workpiece holder for polishing, polishing apparatus and polishing m...

Method for producing semiconductor wafer and semiconductor wafer

Polishing pad, polishing method, and polishing machine for mirror-p...