Holger Hoefer

Person

Sonnenbuehl, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a micromechanical device having a damper struc...
- Patent number 11,505,455
- Issue date Nov 22, 2022
- Robert Bosch GmbH
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and/or sound detection device and manufacturing method for a...
- Patent number 10,684,185
- Issue date Jun 16, 2020
- Robert Bosch GmbH
- Daniel Haug
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing thin MEMS chips on SOI substrate and micromech...
- Patent number 10,584,029
- Issue date Mar 10, 2020
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Damping device for a micromechanical sensor device
- Patent number 9,222,955
- Issue date Dec 29, 2015
- Robert Bosch GmbH
- Holger Hoefer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint inspection
- Patent number 8,810,252
- Issue date Aug 19, 2014
- Robert Bosch GmbH
- Eric Ochs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor system
- Patent number 8,671,752
- Issue date Mar 18, 2014
- Robert Bosch GmbH
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for sealing an opening
- Patent number 8,304,845
- Issue date Nov 6, 2012
- Robert Bosch GmbH
- Udo Bischof
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microstructured sensor
- Patent number 7,564,033
- Issue date Jul 21, 2009
- Robert Bosch GmbH
- Frank Reichenbach
- G01 - MEASURING TESTING
Information Patent Grant
Ceramic substrate and method of manufacturing same
- Patent number 6,974,515
- Issue date Dec 13, 2005
- Robert Bosch GmbH
- Anja Neubert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing substrates
- Patent number 6,620,735
- Issue date Sep 16, 2003
- Robert Bosch GmbH
- Stefan Pinter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR ADJUSTING AN INERTIAL SENSOR COMPONENT BY MEANS OF A CAL...
- Publication number 20240167845
- Publication date May 23, 2024
- ROBERT BOSCH GmbH
- Michael Struchholz
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A DAMPER STRUC...
- Publication number 20210179422
- Publication date Jun 17, 2021
- ROBERT BOSCH GmbH
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING THIN MEMS CHIPS ON SOI SUBSTRATE AND MICROMECH...
- Publication number 20190039885
- Publication date Feb 7, 2019
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR AND/OR SOUND DETECTION DEVICE AND MANUFACTURING METHOD FOR A...
- Publication number 20180372573
- Publication date Dec 27, 2018
- ROBERT BOSCH GmbH
- Daniel Haug
- G01 - MEASURING TESTING
Information Patent Application
DAMPING DEVICE FOR A MICROMECHANICAL SENSOR DEVICE
- Publication number 20130199295
- Publication date Aug 8, 2013
- ROBERT BOSCH GmbH
- Holger HOEFER
- G01 - MEASURING TESTING
Information Patent Application
SOLDER JOINT INSPECTION
- Publication number 20120025863
- Publication date Feb 2, 2012
- Eric Ochs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sensor system
- Publication number 20110203369
- Publication date Aug 25, 2011
- Holger Hoefer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICES AND METHOD FOR MANUFACTURING A DEVICE
- Publication number 20110049505
- Publication date Mar 3, 2011
- Johannes Grabowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Sealing an Opening
- Publication number 20090174148
- Publication date Jul 9, 2009
- Udo Bischof
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL STRUCTURE HAVING A SUBSTRATE AND A THERMOELEMENT, T...
- Publication number 20090168836
- Publication date Jul 2, 2009
- Holger Hoefer
- G01 - MEASURING TESTING
Information Patent Application
Microstructured Infrared Sensor
- Publication number 20080061237
- Publication date Mar 13, 2008
- Jochen Franz
- G01 - MEASURING TESTING
Information Patent Application
Microstructured Sensor
- Publication number 20080053254
- Publication date Mar 6, 2008
- Frank Reichenbach
- G01 - MEASURING TESTING
Information Patent Application
Method for reducing the adhesive properties of MEMS and anti-adhesi...
- Publication number 20050118742
- Publication date Jun 2, 2005
- Frank Henning
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ceramic substrate and method of manufacturing same
- Publication number 20050074638
- Publication date Apr 7, 2005
- Anja Neubert
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for processing substrates
- Publication number 20020061653
- Publication date May 23, 2002
- Stefan Pinter
- H01 - BASIC ELECTRIC ELEMENTS

Holger Hoefer

Person

Patents Grantslast 30 patents

Method for producing a micromechanical device having a damper struc...

Sensor and/or sound detection device and manufacturing method for a...

Method for producing thin MEMS chips on SOI substrate and micromech...

Damping device for a micromechanical sensor device

Solder joint inspection

Sensor system

Method for sealing an opening

Microstructured sensor

Ceramic substrate and method of manufacturing same

Method for processing substrates

Patents Applicationslast 30 patents

METHOD FOR ADJUSTING AN INERTIAL SENSOR COMPONENT BY MEANS OF A CAL...

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING A DAMPER STRUC...

METHOD FOR PRODUCING THIN MEMS CHIPS ON SOI SUBSTRATE AND MICROMECH...

SENSOR AND/OR SOUND DETECTION DEVICE AND MANUFACTURING METHOD FOR A...

DAMPING DEVICE FOR A MICROMECHANICAL SENSOR DEVICE

SOLDER JOINT INSPECTION

Sensor system

DEVICES AND METHOD FOR MANUFACTURING A DEVICE

Method for Sealing an Opening

MICROMECHANICAL STRUCTURE HAVING A SUBSTRATE AND A THERMOELEMENT, T...

Microstructured Infrared Sensor

Microstructured Sensor

Method for reducing the adhesive properties of MEMS and anti-adhesi...

Ceramic substrate and method of manufacturing same

Method for processing substrates