Homayoun Talieh

Person

Santa Clara County, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Transcription and analysis of meeting recordings
- Patent number 11,315,569
- Issue date Apr 26, 2022
- Memoria, Inc.
- Homayoun Talieh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming contact layers on substrates
- Patent number 7,704,880
- Issue date Apr 27, 2010
- Novellus Systems, Inc.
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for electrochemical mechanical polishing
- Patent number 7,648,622
- Issue date Jan 19, 2010
- Novellus Systems, Inc.
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electropolishing system and process
- Patent number 7,578,923
- Issue date Aug 25, 2009
- Novellus Systems, Inc.
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrochemical processing of conductive surface
- Patent number 7,572,354
- Issue date Aug 11, 2009
- Novellus Systems, Inc.
- Cyprian Emeka Uzoh
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making rolling electrical contact to wafer front surface
- Patent number 7,491,308
- Issue date Feb 17, 2009
- Novellus Systems, Inc.
- Homayoun Talieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for processing surface of workpiece with small electrodes...
- Patent number 7,476,304
- Issue date Jan 13, 2009
- Novellus Systems, Inc.
- Jalal Ashjaee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for electropolishing and electrochemical mechanical polishing
- Patent number 7,427,337
- Issue date Sep 23, 2008
- Novellus Systems, Inc.
- Bulent M. Basol
- B24 - GRINDING POLISHING
Information Patent Grant
Electrochemical mechanical processing apparatus
- Patent number 7,425,250
- Issue date Sep 16, 2008
- Novellus Systems, Inc.
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming contact layers on substrates
- Patent number 7,416,975
- Issue date Aug 26, 2008
- Novellus Systems, Inc.
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad designs and structures for a versatile materials processing app...
- Patent number 7,378,004
- Issue date May 27, 2008
- Novellus Systems, Inc.
- Cyprian Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for electroprocessing a workpiece surface
- Patent number 7,341,649
- Issue date Mar 11, 2008
- Novellus Systems, Inc.
- Homayoun Talieh
- B24 - GRINDING POLISHING
Information Patent Grant
Device providing electrical contact to the surface of a semiconduct...
- Patent number 7,329,335
- Issue date Feb 12, 2008
- Novellus Systems, Inc.
- Homayoun Talieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device providing electrical contact to the surface of a semiconduct...
- Patent number 7,311,811
- Issue date Dec 25, 2007
- Novellus Systems, Inc.
- Homayoun Talieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for plating and polishing semiconductor substrate
- Patent number 7,309,406
- Issue date Dec 18, 2007
- Novellus Systems, Inc.
- Homayoun Talieh
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for forming an electrical contact with a semic...
- Patent number 7,309,407
- Issue date Dec 18, 2007
- Novellus Systems, Inc.
- Homayoun Talieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Providing electrical contact to the surface of a semiconductor work...
- Patent number 7,309,413
- Issue date Dec 18, 2007
- Novellus Systems, Inc.
- Homayoun Talieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device providing electrical contact to the surface of a semiconduct...
- Patent number 7,282,124
- Issue date Oct 16, 2007
- Novellus Systems, Inc.
- Homayoun Talieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient wafer processing technology
- Patent number 7,257,893
- Issue date Aug 21, 2007
- Novellus Systems, Inc.
- Hung-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for optically enhanced metal planarization
- Patent number 7,250,104
- Issue date Jul 31, 2007
- Novellus Systems, Inc.
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for electroprocessing conductive layers
- Patent number 7,247,558
- Issue date Jul 24, 2007
- Novellus Systems, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system to provide electrical contacts for electrotreatin...
- Patent number 7,244,347
- Issue date Jul 17, 2007
- Novellus Systems, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system to provide electrical contacts for electrotreatin...
- Patent number 7,211,186
- Issue date May 1, 2007
- Novellus Systems, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system to provide electrical contacts for electrotreatin...
- Patent number 7,211,174
- Issue date May 1, 2007
- Novellus Systems, Inc.
- Bulent M Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to deposit layers with uniform properties
- Patent number 7,204,924
- Issue date Apr 17, 2007
- Novellus Systems, Inc.
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit interconnect fabrication systems
- Patent number 7,204,743
- Issue date Apr 17, 2007
- Novellus Systems, Inc.
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate polishing apparatus
- Patent number 7,198,551
- Issue date Apr 3, 2007
- Applied Materials, Inc.
- Homayoun Talieh
- B24 - GRINDING POLISHING
Information Patent Grant
Fabrication of semiconductor interconnect structures
- Patent number 7,172,497
- Issue date Feb 6, 2007
- ASM Nutool, Inc.
- Bulent M. Basol
- B24 - GRINDING POLISHING
Information Patent Grant
Chip interconnect and packaging deposition methods and structures
- Patent number 7,147,766
- Issue date Dec 12, 2006
- ASM NuTool, Inc.
- Cyprian Emeka Uzoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure to improve reliability of copper interconnects
- Patent number 7,129,165
- Issue date Oct 31, 2006
- ASM Nutool, Inc.
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ROLL-TO-ROLL MANUFACTURING OF FLEXIBLE THIN FILM PHOTOVOLTAIC MODULES
- Publication number 20110239450
- Publication date Oct 6, 2011
- Bulent M. Basol
- B32 - LAYERED PRODUCTS
Information Patent Application
DRUM DESIGN FOR WEB PROCESSING
- Publication number 20100147677
- Publication date Jun 17, 2010
- Mustafa Pinarbasi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electropolishing system and process
- Publication number 20080099344
- Publication date May 1, 2008
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURES
- Publication number 20070128851
- Publication date Jun 7, 2007
- Novellus Systems, Inc.
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of forming contact layers on substrates
- Publication number 20070066054
- Publication date Mar 22, 2007
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Efficient wafer processing technology
- Publication number 20070050974
- Publication date Mar 8, 2007
- Hung-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated system for processing semiconductor wafers
- Publication number 20070004316
- Publication date Jan 4, 2007
- Jalal Ashjaee
- G05 - CONTROLLING REGULATING
Information Patent Application
Apparatus with conductive pad for electroprocessing
- Publication number 20060219573
- Publication date Oct 5, 2006
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of wafer processing with edge seed layer removal
- Publication number 20060137994
- Publication date Jun 29, 2006
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for electroprocessing conductive layers
- Publication number 20060121725
- Publication date Jun 8, 2006
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process to minimize and/or eliminate conductive material coating ov...
- Publication number 20060118425
- Publication date Jun 8, 2006
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Chip interconnect and packaging deposition methods and structures
- Publication number 20060070885
- Publication date Apr 6, 2006
- Cyprian Emeka Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Advanced chemical mechanical polishing system with smart endpoint d...
- Publication number 20060063469
- Publication date Mar 23, 2006
- Homayoun Talieh
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for forming an electrical contact with a semic...
- Publication number 20060042934
- Publication date Mar 2, 2006
- Homayoun Talieh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Integrated system for processing semiconductor wafers
- Publication number 20060035569
- Publication date Feb 16, 2006
- Jalal Ashjaee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi step electrodeposition process for reducing defects and minim...
- Publication number 20060011485
- Publication date Jan 19, 2006
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for processing a substrate with minimal edge e...
- Publication number 20060006060
- Publication date Jan 12, 2006
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
System and method for electrochemical mechanical polishing
- Publication number 20060006073
- Publication date Jan 12, 2006
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making rolling electrical contact to wafer front surface
- Publication number 20050269212
- Publication date Dec 8, 2005
- Homayoun Talieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Planar metal electroprocessing
- Publication number 20050227483
- Publication date Oct 13, 2005
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for electrochemical mechanical polishing
- Publication number 20050173260
- Publication date Aug 11, 2005
- Bulent M. Basol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for electroless surface conditioning
- Publication number 20050170080
- Publication date Aug 4, 2005
- Bulent M. Basol
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus for avoiding particle accumulation in electrochemical pro...
- Publication number 20050145484
- Publication date Jul 7, 2005
- NUTOOL, INC., a Delaware Corporation
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroetching process and system
- Publication number 20050145489
- Publication date Jul 7, 2005
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for electropolishing and electrochemical mechanical polishing
- Publication number 20050133379
- Publication date Jun 23, 2005
- Bulent M. Basol
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroetching methods and systems using chemical and mechanical in...
- Publication number 20050133380
- Publication date Jun 23, 2005
- Bulent M. Basol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adjustable gap chemical mechanical polishing method and apparatus
- Publication number 20050118932
- Publication date Jun 2, 2005
- Homayoun Talieh
- B24 - GRINDING POLISHING
Information Patent Application
Edge and bevel cleaning process and system
- Publication number 20050079713
- Publication date Apr 14, 2005
- Jalal Ashjaee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anode assembly for plating and planarizing a conductive layer
- Publication number 20050040049
- Publication date Feb 24, 2005
- Rimma Volodarsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system to provide electroplanarization of a workpiece wi...
- Publication number 20050042873
- Publication date Feb 24, 2005
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Homayoun Talieh

Person

Patents Grantslast 30 patents

Transcription and analysis of meeting recordings

Method of forming contact layers on substrates

System and method for electrochemical mechanical polishing

Electropolishing system and process

Electrochemical processing of conductive surface

Method of making rolling electrical contact to wafer front surface

Apparatus for processing surface of workpiece with small electrodes...

System for electropolishing and electrochemical mechanical polishing

Electrochemical mechanical processing apparatus

Method of forming contact layers on substrates

Pad designs and structures for a versatile materials processing app...

Apparatus for electroprocessing a workpiece surface

Device providing electrical contact to the surface of a semiconduct...

Device providing electrical contact to the surface of a semiconduct...

Method and apparatus for plating and polishing semiconductor substrate

Method and apparatus for forming an electrical contact with a semic...

Providing electrical contact to the surface of a semiconductor work...

Device providing electrical contact to the surface of a semiconduct...

Efficient wafer processing technology

Method and system for optically enhanced metal planarization

Method and system for electroprocessing conductive layers

Method and system to provide electrical contacts for electrotreatin...

Method and system to provide electrical contacts for electrotreatin...

Method and system to provide electrical contacts for electrotreatin...

Method and apparatus to deposit layers with uniform properties

Integrated circuit interconnect fabrication systems

Substrate polishing apparatus

Fabrication of semiconductor interconnect structures

Chip interconnect and packaging deposition methods and structures

Method and structure to improve reliability of copper interconnects

Patents Applicationslast 30 patents

ROLL-TO-ROLL MANUFACTURING OF FLEXIBLE THIN FILM PHOTOVOLTAIC MODULES

DRUM DESIGN FOR WEB PROCESSING

Electropolishing system and process

FABRICATION OF SEMICONDUCTOR INTERCONNECT STRUCTURES

Method of forming contact layers on substrates

Efficient wafer processing technology

Integrated system for processing semiconductor wafers

Apparatus with conductive pad for electroprocessing

Method of wafer processing with edge seed layer removal

Method and system for electroprocessing conductive layers

Process to minimize and/or eliminate conductive material coating ov...

Chip interconnect and packaging deposition methods and structures

Advanced chemical mechanical polishing system with smart endpoint d...

Method and apparatus for forming an electrical contact with a semic...

Integrated system for processing semiconductor wafers

Multi step electrodeposition process for reducing defects and minim...

Method and apparatus for processing a substrate with minimal edge e...

System and method for electrochemical mechanical polishing

Method of making rolling electrical contact to wafer front surface

Planar metal electroprocessing

System for electrochemical mechanical polishing

System and method for electroless surface conditioning

Apparatus for avoiding particle accumulation in electrochemical pro...

Electroetching process and system

System for electropolishing and electrochemical mechanical polishing

Electroetching methods and systems using chemical and mechanical in...

Adjustable gap chemical mechanical polishing method and apparatus

Edge and bevel cleaning process and system

Anode assembly for plating and planarizing a conductive layer

Method and system to provide electroplanarization of a workpiece wi...