Home-Been Cheng

Person

Keelung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming patterns for semiconductor device
- Patent number 9,875,927
- Issue date Jan 23, 2018
- United Microelectronics Corp.
- Tzu-Hao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming patterns for semiconductor device
- Patent number 9,536,751
- Issue date Jan 3, 2017
- United Microelectronics Corp.
- Tzu-Hao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 9,502,530
- Issue date Nov 22, 2016
- United Microelectronics Corp.
- Yu-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via structure
- Patent number 9,312,208
- Issue date Apr 12, 2016
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 9,214,395
- Issue date Dec 15, 2015
- United Microelectronics Corp.
- Yu-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via structure and method of fabricating the same
- Patent number 8,900,996
- Issue date Dec 2, 2014
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via and method of forming the same
- Patent number 8,841,755
- Issue date Sep 23, 2014
- United Microelectronics Corp.
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and process thereof
- Patent number 8,829,575
- Issue date Sep 9, 2014
- United Microelectronics Corp.
- Chung-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling etching process for forming epitaxial structure
- Patent number 8,753,902
- Issue date Jun 17, 2014
- United Microelectronics Corp.
- Chia-Jong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 8,691,688
- Issue date Apr 8, 2014
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via and method of forming the same
- Patent number 8,518,823
- Issue date Aug 27, 2013
- United Microelectronics Corp.
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING PATTERNS FOR SEMICONDUCTOR DEVICE
- Publication number 20170069529
- Publication date Mar 9, 2017
- UNITED MICROELECTRONICS CORP.
- Tzu-Hao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNS FOR SEMICONDUCTOR DEVICE
- Publication number 20160351410
- Publication date Dec 1, 2016
- UNITED MICROELECTRONICS CORP.
- Tzu-Hao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20160064521
- Publication date Mar 3, 2016
- UNITED MICROELECTRONICS CORP.
- Yu-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through silicon via structure
- Publication number 20150041961
- Publication date Feb 12, 2015
- UNITED MICROELECTRONICS CORP.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20140273368
- Publication date Sep 18, 2014
- UNITED MICROELECTRONICS CORP.
- Yu-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF
- Publication number 20140175527
- Publication date Jun 26, 2014
- UNITED MICROELECTRONICS CORP.
- Chung-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through silicon via structure and method of fabricating the same
- Publication number 20130341799
- Publication date Dec 26, 2013
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20130337645
- Publication date Dec 19, 2013
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via and Method of Forming the Same
- Publication number 20130299949
- Publication date Nov 14, 2013
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through silicon via structure and method of fabricating the same
- Publication number 20130270712
- Publication date Oct 17, 2013
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SAWING METHOD AND WAFER STRUCTURE BENEFICIAL FOR PERFORMING T...
- Publication number 20130256843
- Publication date Oct 3, 2013
- UNITED MICROELECTRONICS CORPORATION
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA AND METHOD OF FORMING THE SAME
- Publication number 20130161796
- Publication date Jun 27, 2013
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Home-Been Cheng

Person

Patents Grantslast 30 patents

Method for forming patterns for semiconductor device

Method for forming patterns for semiconductor device

Method of manufacturing semiconductor devices

Through silicon via structure

Method of manufacturing semiconductor devices

Through silicon via structure and method of fabricating the same

Through silicon via and method of forming the same

Semiconductor structure and process thereof

Method of controlling etching process for forming epitaxial structure

Method of manufacturing semiconductor structure

Through silicon via and method of forming the same

Patents Applicationslast 30 patents

METHOD FOR FORMING PATTERNS FOR SEMICONDUCTOR DEVICE

METHOD FOR FORMING PATTERNS FOR SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

Through silicon via structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF

Through silicon via structure and method of fabricating the same

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Through Silicon Via and Method of Forming the Same

Through silicon via structure and method of fabricating the same

WAFER SAWING METHOD AND WAFER STRUCTURE BENEFICIAL FOR PERFORMING T...

THROUGH SILICON VIA AND METHOD OF FORMING THE SAME