Hong Shen

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect with electromagnetic interference (“EMI”) shield an...
- Patent number 12,040,284
- Issue date Jul 16, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Region shielding within a package of a microelectronic device
- Patent number 12,021,041
- Issue date Jun 25, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale filter packaging using semiconductor wafers...
- Patent number 11,335,669
- Issue date May 17, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 11,205,600
- Issue date Dec 21, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing 3D wafer assembly with known-good-dies
- Patent number 11,114,408
- Issue date Sep 7, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging using a recyclable carrier substrate
- Patent number 11,101,160
- Issue date Aug 24, 2021
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reliable packages
- Patent number 11,056,390
- Issue date Jul 6, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging using a recyclable carrier substrate
- Patent number 10,629,468
- Issue date Apr 21, 2020
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HD color imaging using monochromatic CMOS image sensors integrated...
- Patent number 10,623,710
- Issue date Apr 14, 2020
- Invensas Corporation
- Hong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnection substrates for interconnection between circuit modu...
- Patent number 10,586,759
- Issue date Mar 10, 2020
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for reliable packages
- Patent number 10,535,564
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,531,574
- Issue date Jan 7, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,522,457
- Issue date Dec 31, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing 3D wafer assembly with known-good-dies
- Patent number 10,515,926
- Issue date Dec 24, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,490,520
- Issue date Nov 26, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer level chip scale filter packaging using semiconductor wafers...
- Patent number 10,483,248
- Issue date Nov 19, 2019
- Skyworks Solutions, Inc.
- Jiro Yota
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 10,446,456
- Issue date Oct 15, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making electrical components in handle wafers of integrated circuit...
- Patent number 10,431,648
- Issue date Oct 1, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing cross contamination in integrated circuit manuf...
- Patent number 10,340,186
- Issue date Jul 2, 2019
- Skyworks Solutions, Inc.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 10,256,177
- Issue date Apr 9, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making electrical components in handle wafers of integrated circuit...
- Patent number 10,204,977
- Issue date Feb 12, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 10,177,086
- Issue date Jan 8, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
HD color imaging using monochromatic CMOS image sensors integrated...
- Patent number 10,178,363
- Issue date Jan 8, 2019
- Invensas Corporation
- Hong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multichip modules and methods of fabrication
- Patent number 10,163,833
- Issue date Dec 25, 2018
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interconnection substrates for interconnection between circuit modu...
- Patent number 10,014,243
- Issue date Jul 3, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components with features wrapping around protrusion...
- Patent number 9,947,618
- Issue date Apr 17, 2018
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies formed using metal silicide, and methods...
- Patent number 9,905,523
- Issue date Feb 27, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3D-INTERCONNECT WITH ELECTROMAGNETIC INTERFERENCE ("EMI") SHIELD AN...
- Publication number 20240339418
- Publication date Oct 10, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE
- Publication number 20240312928
- Publication date Sep 19, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES
- Publication number 20230245950
- Publication date Aug 3, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMOELECTRIC COOLING FOR DIE PACKAGES
- Publication number 20230197559
- Publication date Jun 22, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-Interconnect with Electromagnetic Interference ("EMI") Shield an...
- Publication number 20230154862
- Publication date May 18, 2023
- Invensas Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICE PACKAGES
- Publication number 20230130259
- Publication date Apr 27, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING SEMICONDUCTOR RESISTOR AND TANTAL...
- Publication number 20220393653
- Publication date Dec 8, 2022
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE
- Publication number 20220139846
- Publication date May 5, 2022
- Invensas Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING USING A RECYCLABLE CARRIER SUBSTRATE
- Publication number 20200243369
- Publication date Jul 30, 2020
- SKYWORKS SOLUTIONS, INC.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR RELIABLE PACKAGES
- Publication number 20200126861
- Publication date Apr 23, 2020
- Invensas Corporation
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...
- Publication number 20200093008
- Publication date Mar 19, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIES
- Publication number 20200091110
- Publication date Mar 19, 2020
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE FILTER PACKAGING USING SEMICONDUCTOR WAFERS...
- Publication number 20200083202
- Publication date Mar 12, 2020
- SKYWORKS SOLUTIONS, INC.
- Jiro Yota
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...
- Publication number 20200043817
- Publication date Feb 6, 2020
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF COPPER PLATING THROUGH WAFER VIA
- Publication number 20190333835
- Publication date Oct 31, 2019
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING CROSS CONTAMINATION DURING MANUFACTURE OF COPPER...
- Publication number 20190333815
- Publication date Oct 31, 2019
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GAAS INTEGRATED CIRCUITS WITH ALTERNATIVE B...
- Publication number 20190333816
- Publication date Oct 31, 2019
- SKYWORKS SOLUTIONS, INC.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
- Publication number 20190198435
- Publication date Jun 27, 2019
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...
- Publication number 20190172903
- Publication date Jun 6, 2019
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20190157199
- Publication date May 23, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HD COLOR IMAGING USING MONOCHROMATIC CMOS IMAGE SENSORS INTEGRATED...
- Publication number 20190098271
- Publication date Mar 28, 2019
- Invensas Corporation
- Hong Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTICHIP MODULES AND METHODS OF FABRICATION
- Publication number 20190088607
- Publication date Mar 21, 2019
- Invensas Corporation
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Interconnection Substrates for Interconnection Between Circuit Modu...
- Publication number 20180337118
- Publication date Nov 22, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE FILTER PACKAGING USING SEMICONDUCTOR WAFERS...
- Publication number 20180277527
- Publication date Sep 27, 2018
- SKYWORKS SOLUTIONS, INC.
- Jiro Yota
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...
- Publication number 20180233447
- Publication date Aug 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...
- Publication number 20180130717
- Publication date May 10, 2018
- Invensas Corporation
- Hong SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...
- Publication number 20180124927
- Publication date May 3, 2018
- Invensas Corporation
- Liang WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Providing 3D Wafer Assembly With Known-Good-Dies
- Publication number 20180096973
- Publication date Apr 5, 2018
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...
- Publication number 20180076278
- Publication date Mar 15, 2018
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING
- Publication number 20170317019
- Publication date Nov 2, 2017
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

3D-interconnect with electromagnetic interference (“EMI”) shield an...

Region shielding within a package of a microelectronic device

Wafer level chip scale filter packaging using semiconductor wafers...

Integrated interposer solutions for 2D and 3D IC packaging

Integrated circuits protected by substrates with cavities, and meth...

System and method for providing 3D wafer assembly with known-good-dies

Device packaging using a recyclable carrier substrate

Structures and methods for reliable packages

Contact structures with porous networks for solder connections, and...

Device packaging using a recyclable carrier substrate

HD color imaging using monochromatic CMOS image sensors integrated...

Interconnection substrates for interconnection between circuit modu...

Structures and methods for reliable packages

Contact structures with porous networks for solder connections, and...

Microelectronic components with features wrapping around protrusion...

System and method for providing 3D wafer assembly with known-good-dies

Multichip modules and methods of fabrication

Wafer level chip scale filter packaging using semiconductor wafers...

Integrated circuits protected by substrates with cavities, and meth...

Making electrical components in handle wafers of integrated circuit...

Method for reducing cross contamination in integrated circuit manuf...

Integrated interposer solutions for 2D and 3D IC packaging

Making electrical components in handle wafers of integrated circuit...

Microelectronic components with features wrapping around protrusion...

HD color imaging using monochromatic CMOS image sensors integrated...

Multichip modules and methods of fabrication

Interconnection substrates for interconnection between circuit modu...

Microelectronic components with features wrapping around protrusion...

Microelectronic assemblies formed using metal silicide, and methods...

Patents Applicationslast 30 patents

3D-INTERCONNECT WITH ELECTROMAGNETIC INTERFERENCE ("EMI") SHIELD AN...

REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE

HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES

THERMOELECTRIC COOLING FOR DIE PACKAGES

3D-Interconnect with Electromagnetic Interference ("EMI") Shield an...

RADIO FREQUENCY DEVICE PACKAGES

POWER AMPLIFIER MODULES INCLUDING SEMICONDUCTOR RESISTOR AND TANTAL...

REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE

DEVICE PACKAGING USING A RECYCLABLE CARRIER SUBSTRATE

STRUCTURES AND METHODS FOR RELIABLE PACKAGES

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...

SYSTEM AND METHOD FOR PROVIDING 3D WAFER ASSEMBLY WITH KNOWN-GOOD-DIES

WAFER LEVEL CHIP SCALE FILTER PACKAGING USING SEMICONDUCTOR WAFERS...

INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...

METHODS OF COPPER PLATING THROUGH WAFER VIA

METHOD OF REDUCING CROSS CONTAMINATION DURING MANUFACTURE OF COPPER...

METHOD OF MANUFACTURING GAAS INTEGRATED CIRCUITS WITH ALTERNATIVE B...

INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING

MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

HD COLOR IMAGING USING MONOCHROMATIC CMOS IMAGE SENSORS INTEGRATED...

MULTICHIP MODULES AND METHODS OF FABRICATION

Interconnection Substrates for Interconnection Between Circuit Modu...

WAFER LEVEL CHIP SCALE FILTER PACKAGING USING SEMICONDUCTOR WAFERS...

MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSION...

INTEGRATED CIRCUITS PROTECTED BY SUBSTRATES WITH CAVITIES, AND METH...

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...

System and Method for Providing 3D Wafer Assembly With Known-Good-Dies

MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT...

INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING