Hsiang-Ming Feng

Person

Zhongli City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,894,308
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,854,550
- Issue date Dec 1, 2020
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating semiconductor device packages and related methods
- Patent number 9,054,118
- Issue date Jun 9, 2015
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrates having pillars and related methods
- Patent number 8,866,311
- Issue date Oct 21, 2014
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating semiconductor device packages
- Patent number 8,779,581
- Issue date Jul 15, 2014
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrates having layered circuit segments, a...
- Patent number 8,686,568
- Issue date Apr 1, 2014
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with protective layer and related met...
- Patent number 8,592,962
- Issue date Nov 26, 2013
- Advanced Semiconductor Engineering, Inc.
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240213168
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210091006
- Publication date Mar 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096814
- Publication date Mar 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS
- Publication number 20140308778
- Publication date Oct 16, 2014
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATES HAVING PILLARS AND RELATED METHODS
- Publication number 20140084475
- Publication date Mar 27, 2014
- Advanced Semiconductor Engineering, Inc.
- Tien-Szu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATES HAVING LAYERED CIRCUIT SEGMENTS AN...
- Publication number 20140084480
- Publication date Mar 27, 2014
- Advanced Semiconductor Engineering, Inc.
- Sheng-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS
- Publication number 20120112338
- Publication date May 10, 2012
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER AND RELATED MET...
- Publication number 20120104584
- Publication date May 3, 2012
- Kuang-Hsiung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Hsiang-Ming Feng

Person

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Semiconductor package and method of manufacturing the same

Heat dissipating semiconductor device packages and related methods

Semiconductor package substrates having pillars and related methods

Heat dissipating semiconductor device packages

Semiconductor package substrates having layered circuit segments, a...

Semiconductor device packages with protective layer and related met...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

HEAT DISSIPATING SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS

SEMICONDUCTOR PACKAGE SUBSTRATES HAVING PILLARS AND RELATED METHODS

SEMICONDUCTOR PACKAGE SUBSTRATES HAVING LAYERED CIRCUIT SEGMENTS AN...

HEAT DISSIPATING SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER AND RELATED MET...