Hsiang-Tai Lu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Delamination sensor
- Patent number 12,125,810
- Issue date Oct 22, 2024
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,855,066
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure and method of using
- Patent number 11,828,790
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination sensor
- Patent number 11,616,029
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,335,672
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure
- Patent number 11,002,788
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages
- Patent number 10,879,162
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,741,537
- Issue date Aug 11, 2020
- TAIWAN SEMICONDUCTOR MANUFACTURING COOMPANY LTD.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out packages
- Patent number 10,347,574
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit test structure
- Patent number 10,288,676
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of forming same
- Patent number 10,269,586
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection apparatus and process
- Patent number 9,941,239
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing a three-dimensional integrated circuit
- Patent number 9,689,914
- Issue date Jun 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang Chen
- G01 - MEASURING TESTING
Information Patent Grant
System and method of UV programming of non-volatile semiconductor m...
- Patent number 9,607,999
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Tai Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrostatic discharge protection apparatus and process
- Patent number 9,491,840
- Issue date Nov 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two step molding grinding for packaging applications
- Patent number 9,209,048
- Issue date Dec 8, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of UV programming of non-volatile semiconductor m...
- Patent number 9,190,148
- Issue date Nov 17, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Tai Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of shielding through silicon vias in a passive interposer
- Patent number 9,159,564
- Issue date Oct 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit having a resistance measuremen...
- Patent number 9,040,986
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of forming same
- Patent number 8,970,023
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer testing using dummy connections
- Patent number 8,664,540
- Issue date Mar 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Tai Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of shielding through silicon vias in a passive interposer
- Patent number 8,618,640
- Issue date Dec 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory process with high voltage LDMOS embedded
- Patent number 7,462,906
- Issue date Dec 9, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-voltage generation system
- Patent number 7,348,832
- Issue date Mar 25, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Tai Lu
- G11 - INFORMATION STORAGE
Information Patent Grant
Flash memory process with high voltage LDMOS embedded
- Patent number 7,282,410
- Issue date Oct 16, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory cell with a unique split programming channel and readi...
- Patent number 7,102,190
- Issue date Sep 5, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory cell having multi-program channels
- Patent number 6,958,939
- Issue date Oct 25, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ta Hsieh
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
DELAMINATION SENSOR
- Publication number 20240387411
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING PASSIVE COMPONENT AND METHOD OF MANU...
- Publication number 20240371797
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240363576
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240274541
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HSUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH BUILT-IN WIRING FOR TESTING AN EMBEDDED INTEGRATED...
- Publication number 20240266266
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240243163
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-YU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
- Publication number 20240170584
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HSUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TESTING PADS AND METHOD OF MANUFACTURI...
- Publication number 20240170349
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HSUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20240094282
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240088124
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...
- Publication number 20240047384
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230298970
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO WEN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION SENSOR
- Publication number 20230238340
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION SENSOR
- Publication number 20220375877
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220271024
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE AND METHOD OF USING
- Publication number 20210231730
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200357785
- Publication date Nov 12, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20200013707
- Publication date Jan 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE
- Publication number 20190257880
- Publication date Aug 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20190096791
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180204828
- Publication date Jul 19, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-TAI LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT TEST STRUCTURE
- Publication number 20170292991
- Publication date Oct 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- G01 - MEASURING TESTING
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION APPARATUS AND PROCESS
- Publication number 20170053890
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF UV PROGRAMMING OF NON-VOLATILE SEMICONDUCTOR M...
- Publication number 20160035737
- Publication date Feb 4, 2016
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Hsiang-Tai LU
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF TESTING A THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20150234004
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Fang CHEN
- G01 - MEASURING TESTING
Information Patent Application
TWO STEP MOLDING GRINDING FOR PACKAGING APPLICATIONS
- Publication number 20150187607
- Publication date Jul 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Methods of Forming Same
- Publication number 20150162220
- Publication date Jun 11, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION APPARATUS AND PROCESS
- Publication number 20150079735
- Publication date Mar 19, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Methods of Forming Same
- Publication number 20140217604
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SHIELDING THROUGH SILICON VIAS IN A PASSIVE INTERPOSER
- Publication number 20140087548
- Publication date Mar 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Tai LU
- H01 - BASIC ELECTRIC ELEMENTS

Hsiang-Tai Lu

Person

Patents Grantslast 30 patents

Delamination sensor

Semiconductor structure and manufacturing method thereof

Circuit test structure and method of using

Delamination sensor

Semiconductor structure and manufacturing method thereof

Circuit test structure

Integrated fan-out packages

Semiconductor structure and manufacturing method thereof

Integrated fan-out packages

Circuit test structure

Package structure and methods of forming same

Electrostatic discharge protection apparatus and process

Method of testing a three-dimensional integrated circuit

System and method of UV programming of non-volatile semiconductor m...

Electrostatic discharge protection apparatus and process

Two step molding grinding for packaging applications

System and method of UV programming of non-volatile semiconductor m...

Method of shielding through silicon vias in a passive interposer

Three dimensional integrated circuit having a resistance measuremen...

Package structure and methods of forming same

Interposer testing using dummy connections

Method of shielding through silicon vias in a passive interposer

Flash memory process with high voltage LDMOS embedded

Dual-voltage generation system

Flash memory process with high voltage LDMOS embedded

Flash memory cell with a unique split programming channel and readi...

Flash memory cell having multi-program channels

Patents Applicationslast 30 patents

DELAMINATION SENSOR

SEMICONDUCTOR STRUCTURE HAVING PASSIVE COMPONENT AND METHOD OF MANU...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

INTERPOSER WITH BUILT-IN WIRING FOR TESTING AN EMBEDDED INTEGRATED...

INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...

SEMICONDUCTOR STRUCTURE WITH TESTING PADS AND METHOD OF MANUFACTURI...

CIRCUIT TEST STRUCTURE AND METHOD OF USING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

DELAMINATION SENSOR

DELAMINATION SENSOR

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT TEST STRUCTURE AND METHOD OF USING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

CIRCUIT TEST STRUCTURE

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT TEST STRUCTURE

ELECTROSTATIC DISCHARGE PROTECTION APPARATUS AND PROCESS

SYSTEM AND METHOD OF UV PROGRAMMING OF NON-VOLATILE SEMICONDUCTOR M...

METHOD OF TESTING A THREE-DIMENSIONAL INTEGRATED CIRCUIT

TWO STEP MOLDING GRINDING FOR PACKAGING APPLICATIONS

Package Structure and Methods of Forming Same

ELECTROSTATIC DISCHARGE PROTECTION APPARATUS AND PROCESS

Package Structure and Methods of Forming Same

METHOD OF SHIELDING THROUGH SILICON VIAS IN A PASSIVE INTERPOSER