Hsiao Chuan CHANG

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting package and LED bulb
- Patent number 9,618,191
- Issue date Apr 11, 2017
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Chuan Chang
- F21 - LIGHTING
Information Patent Grant
Semiconductor package
- Patent number 8,421,242
- Issue date Apr 16, 2013
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,368,216
- Issue date Feb 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a buffer structure and method o...
- Patent number 8,274,149
- Issue date Sep 25, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a jumper chip and method of fab...
- Patent number 8,222,726
- Issue date Jul 17, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 8,222,733
- Issue date Jul 17, 2012
- Advanced Semiconductor Engineering, Inc.
- Ming-Hsiang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced quad flat no lead chip package having a protective layer t...
- Patent number 8,115,285
- Issue date Feb 14, 2012
- Advanced Semiconductor Engineering, Inc.
- Chien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and semiconductor package
- Patent number 8,110,931
- Issue date Feb 7, 2012
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for packaging a semiconductor package
- Patent number 8,076,786
- Issue date Dec 13, 2011
- Advanced Semiconductor Engineering, Inc.
- Chang Ying Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 8,072,064
- Issue date Dec 6, 2011
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for processing and bonding a wire
- Patent number 8,053,906
- Issue date Nov 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method for enhancing the bond of a bonding w...
- Patent number 8,018,075
- Issue date Sep 13, 2011
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding strength measuring device
- Patent number 7,980,757
- Issue date Jul 19, 2011
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- G01 - MEASURING TESTING
Information Patent Grant
Tenon-and-mortise packaging structure
- Patent number 7,964,949
- Issue date Jun 21, 2011
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING PACKAGE AND LED BULB
- Publication number 20140254181
- Publication date Sep 11, 2014
- Advanced Semiconductor Engineering, Inc.
- Hsiao-Chuan Chang
- F21 - LIGHTING
Information Patent Application
ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...
- Publication number 20120119342
- Publication date May 17, 2012
- MEDIATEK INC.
- Pao-Huei Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method For Making The Same
- Publication number 20120091575
- Publication date Apr 19, 2012
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method For Making The Same
- Publication number 20120049360
- Publication date Mar 1, 2012
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20110309516
- Publication date Dec 22, 2011
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20110298139
- Publication date Dec 8, 2011
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20110278739
- Publication date Nov 17, 2011
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20110233749
- Publication date Sep 29, 2011
- Hsiao-Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20110233764
- Publication date Sep 29, 2011
- Hsiao-Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20110227212
- Publication date Sep 22, 2011
- Advanced Semiconductor Engineering, Inc.
- Ming-Hsiang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110156243
- Publication date Jun 30, 2011
- Hsiao-Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST KIT FOR TESTING A CHIP SUBASSEMBLY AND A TESTING METHOD BY USI...
- Publication number 20110156739
- Publication date Jun 30, 2011
- Hsiao-Chuan CHANG
- G01 - MEASURING TESTING
Information Patent Application
WAFER AND SEMICONDUCTOR PACKAGE
- Publication number 20100007004
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING W...
- Publication number 20100007010
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE
- Publication number 20100007009
- Publication date Jan 14, 2010
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Hsiao Chuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE
- Publication number 20100007011
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Chang Ying HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A PROTECTIVE LAYER T...
- Publication number 20090230526
- Publication date Sep 17, 2009
- Chien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRENGTH MEASURING DEVICE
- Publication number 20090175312
- Publication date Jul 9, 2009
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- G01 - MEASURING TESTING
Information Patent Application
Tenon-and-mortise packaging structure
- Publication number 20090096077
- Publication date Apr 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and manufacturing method thereof
- Publication number 20090051048
- Publication date Feb 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS

Hsiao Chuan CHANG

Person

Patents Grantslast 30 patents

Light emitting package and LED bulb

Semiconductor package

Semiconductor package

Semiconductor device package having a buffer structure and method o...

Semiconductor device package having a jumper chip and method of fab...

Semiconductor device package

Advanced quad flat no lead chip package having a protective layer t...

Wafer and semiconductor package

Semiconductor package and method for packaging a semiconductor package

Semiconductor package and method for making the same

Semiconductor package and method for processing and bonding a wire

Semiconductor package, method for enhancing the bond of a bonding w...

Bonding strength measuring device

Tenon-and-mortise packaging structure

Patents Applicationslast 30 patents

LIGHT EMITTING PACKAGE AND LED BULB

ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING M...

Semiconductor Package And Method For Making The Same

Semiconductor Package And Method For Making The Same

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

Semiconductor Package

Semiconductor Package

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

TEST KIT FOR TESTING A CHIP SUBASSEMBLY AND A TESTING METHOD BY USI...

WAFER AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE, METHOD FOR ENHANCING THE BOND OF A BONDING W...

SEMICONDUCTOR PACKAGE AND METHOD FOR PROCESSING AND BONDING A WIRE

SEMICONDUCTOR PACKAGE AND METHOD FOR PACKAGING A SEMICONDUCTOR PACKAGE

ADVANCED QUAD FLAT NO LEAD CHIP PACKAGE HAVING A PROTECTIVE LAYER T...

BONDING STRENGTH MEASURING DEVICE

Tenon-and-mortise packaging structure

Package structure and manufacturing method thereof