Hsiao-Li Chang

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Communication device and head-mounted display device
- Patent number 12,368,230
- Issue date Jul 22, 2025
- Pegatron Corporation
- Po-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,334,431
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with counter-doped nanostructures
- Patent number 12,300,718
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain structure with enhanced dopant diffusion for semicondu...
- Patent number 12,288,815
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiao-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory access module for performing a plurality of sensing operatio...
- Patent number 12,277,966
- Issue date Apr 15, 2025
- Silicon Motion, Inc.
- Tsung-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,272,597
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a thermal conductive layer a...
- Patent number 12,249,555
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing method and related video processor
- Patent number 12,243,246
- Issue date Mar 4, 2025
- NOVATEK Microelectronics Corp.
- Yi-Hung Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal interconnect structure for thermal management of electrical...
- Patent number 12,165,945
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structures and methods of forming the...
- Patent number 12,154,850
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having dielectric-on-dielectric structure a...
- Patent number 12,094,815
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with low capacitance and high thermal conduc...
- Patent number 12,080,650
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dispersion layers for double sided interconnect
- Patent number 12,074,084
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with interconnect structure having a...
- Patent number 12,068,193
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with adjusted fin profile and methods for manufacturing dev...
- Patent number 12,062,581
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metallization layer with low capacitanc...
- Patent number 12,062,572
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV light source and apparatus for EUV lithography
- Patent number 12,028,959
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Shin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Barrier and air-gap scheme for high performance interconnects
- Patent number 12,002,749
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement and refill method for droplet generator
- Patent number 11,997,778
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of lithography process and transferring a reticle
- Patent number 11,982,944
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Lun Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor devices including channel regions having non-uniform...
- Patent number 11,961,911
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for AI model integrity and secrecy protection
- Patent number 11,928,247
- Issue date Mar 12, 2024
- Cvitek Co. Ltd.
- Tsung-Hsien Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Source/drain structure for semiconductor device
- Patent number 11,923,439
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,243
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory access module for performing a plurality of sensing operatio...
- Patent number 11,869,584
- Issue date Jan 9, 2024
- Silicon Motion, Inc.
- Tsung-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Video processor for handling irregular input
- Patent number 11,871,146
- Issue date Jan 9, 2024
- NOVATEK Microelectronics Corp.
- Chih Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor interconnection structure and methods of forming the...
- Patent number 11,854,963
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having low-k carbon-c...
- Patent number 11,848,198
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of lithography process using reticle container with discharg...
- Patent number 11,703,763
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Lun Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20250234576
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Chun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20250226282
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ACCESS MODULE FOR PERFORMING A PLURALITY OF SENSING OPERATIO...
- Publication number 20250210106
- Publication date Jun 26, 2025
- SILICON MOTION, INC.
- Tsung-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250210571
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210413
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...
- Publication number 20250167042
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...
- Publication number 20250149436
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gary LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250140698
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...
- Publication number 20250140605
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20250140697
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELE...
- Publication number 20250125215
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118594
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR FIELD EFFECT TRANSISTORS
- Publication number 20250118548
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118598
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...
- Publication number 20250118595
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250112088
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250087532
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION SYSTEM WITH MULTIWAVELENGTH LIGHT SOURCE AND METHOD
- Publication number 20250085215
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yu CHEN
- G01 - MEASURING TESTING
Information Patent Application
THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...
- Publication number 20250046673
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240413010
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHO...
- Publication number 20240413075
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240413074
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING COUNTER-DOPED STRUCTURES
- Publication number 20240405075
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240407116
- Publication date Dec 5, 2024
- WISTRON NEWEB CORPORATION
- YU-FU KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20240395700
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...
- Publication number 20240387364
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20240387250
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS

Hsiao-Li Chang

Person

Patents Grantslast 30 patents

Communication device and head-mounted display device

Semiconductor interconnection structures and methods of forming the...

Semiconductor devices with counter-doped nanostructures

Source/drain structure with enhanced dopant diffusion for semicondu...

Memory access module for performing a plurality of sensing operatio...

Semiconductor interconnection structures and methods of forming the...

Semiconductor device package including a thermal conductive layer a...

Image processing method and related video processor

Thermal interconnect structure for thermal management of electrical...

Semiconductor interconnection structures and methods of forming the...

Interconnect structure and methods of forming the same

Semiconductor structure having dielectric-on-dielectric structure a...

Interconnect structure with low capacitance and high thermal conduc...

Heat dispersion layers for double sided interconnect

Semiconductor device structure with interconnect structure having a...

Devices with adjusted fin profile and methods for manufacturing dev...

Semiconductor device having metallization layer with low capacitanc...

EUV light source and apparatus for EUV lithography

Barrier and air-gap scheme for high performance interconnects

Replacement and refill method for droplet generator

Method of lithography process and transferring a reticle

Semiconductor devices including channel regions having non-uniform...

Methods and devices for AI model integrity and secrecy protection

Source/drain structure for semiconductor device

Semiconductor structure having air gaps and method for manufacturin...

Memory access module for performing a plurality of sensing operatio...

Video processor for handling irregular input

Semiconductor interconnection structure and methods of forming the...

Method for manufacturing semiconductor device having low-k carbon-c...

Method of lithography process using reticle container with discharg...

Patents Applicationslast 30 patents

SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

MEMORY ACCESS MODULE FOR PERFORMING A PLURALITY OF SENSING OPERATIO...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE, AND METHOD...

INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...

HEAT DISSIPATION BY NANO PIPES

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARAS...

INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER

INTERCONNECTION STRUCTURE

INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELE...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION FOR FIELD EFFECT TRANSISTORS

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUC...

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

INSPECTION SYSTEM WITH MULTIWAVELENGTH LIGHT SOURCE AND METHOD

THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE HAVING HEAT DISSIPATION CAPABILITY AND METHO...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICES HAVING COUNTER-DOPED STRUCTURES

ELECTRONIC DEVICE

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

SEMICONDUCTOR INTERCONNECTION STRUCTURES AND METHODS OF FORMING THE...

SELF-ALIGNED INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THE...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME