Hsu Chiang

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,450,553
- Issue date Sep 20, 2022
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices
- Patent number 11,062,984
- Issue date Jul 13, 2021
- Micron Technology, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including redistribution layers
- Patent number 10,818,536
- Issue date Oct 27, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 10,811,420
- Issue date Oct 20, 2020
- NANYA TECHNOLOGY CORPORATION
- Szu-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package structures including redistribution layers
- Patent number 10,566,229
- Issue date Feb 18, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,121,734
- Issue date Nov 6, 2018
- Micron Technology, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a semiconductor package structure including...
- Patent number 9,916,999
- Issue date Mar 13, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with TSV-less interposer
- Patent number 9,748,184
- Issue date Aug 29, 2017
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and fabrication method thereof
- Patent number 9,520,333
- Issue date Dec 13, 2016
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method therefor
- Patent number 9,496,358
- Issue date Nov 15, 2016
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory unit, memory unit array and method of manufacturing the same
- Patent number 9,070,740
- Issue date Jun 30, 2015
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 9,070,782
- Issue date Jun 30, 2015
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 9,035,366
- Issue date May 19, 2015
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20220384246
- Publication date Dec 1, 2022
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220051931
- Publication date Feb 17, 2022
- NANYA TECHNOLOGY CORPORATION
- Ying-Cheng CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200168613
- Publication date May 28, 2020
- NANYA TECHNOLOGY CORPORATION
- SZU-HAN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20200168497
- Publication date May 28, 2020
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200152639
- Publication date May 14, 2020
- NANYA TECHNOLOGY CORPORATION
- Jui-Wen HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190074246
- Publication date Mar 7, 2019
- Micron Technology, Inc.
- Tzung-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR WITH ENHANCED CAPACITANCE
- Publication number 20180190761
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Hsu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20180190531
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170207154
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Tzung-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH TSV-LESS INTERPOSER
- Publication number 20170110419
- Publication date Apr 20, 2017
- Inotera Memories, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECOVERABLE DEVICE FOR MEMORY BASE PRODUCT
- Publication number 20170012028
- Publication date Jan 12, 2017
- Inotera Memories, Inc.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20160372395
- Publication date Dec 22, 2016
- Inotera Memories, Inc.
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160358847
- Publication date Dec 8, 2016
- Inotera Memories, Inc.
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20150349072
- Publication date Dec 3, 2015
- INOTERA MEMORIES, INC.
- TZUNG-HAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150348871
- Publication date Dec 3, 2015
- INOTERA MEMORIES, INC.
- Hsu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING
- Publication number 20150243597
- Publication date Aug 27, 2015
- INOTERA MEMORIES, INC.
- Hsu Chiang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON VIA
- Publication number 20150076666
- Publication date Mar 19, 2015
- INOTERA MEMORIES, INC.
- HSU CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY UNIT, MEMORY UNIT ARRAY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140291729
- Publication date Oct 2, 2014
- TZUNG-HAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20140291738
- Publication date Oct 2, 2014
- INOTERA MEMORIES, INC.
- TZUNG-HAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140252550
- Publication date Sep 11, 2014
- INOTERA MEMORIES, INC.
- HSU CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20140117442
- Publication date May 1, 2014
- INOTERA MEMORIES, INC.
- Tzung-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor structure and method of forming the same

Methods for forming semiconductor devices

Microelectronic devices including redistribution layers

Semiconductor structure and method for forming the same

Microelectronic package structures including redistribution layers

Semiconductor device

Methods of fabricating a semiconductor package structure including...

Wafer level package with TSV-less interposer

Wafer level package and fabrication method thereof

Semiconductor device and fabrication method therefor

Memory unit, memory unit array and method of manufacturing the same

Semiconductor structure

Semiconductor device and manufacturing method therefor

Patents Applicationslast 30 patents

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

MIM CAPACITOR WITH ENHANCED CAPACITANCE

SEMICONDUCTOR PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGE WITH TSV-LESS INTERPOSER

RECOVERABLE DEVICE FOR MEMORY BASE PRODUCT

WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE CAPABLE OF SUPPRESSING WARPING

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON VIA

MEMORY UNIT, MEMORY UNIT ARRAY AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

STACK CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE