Huei-Shyong CHO

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,206,165
- Issue date Jan 21, 2025
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package
- Patent number 12,119,312
- Issue date Oct 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices
- Patent number 11,997,783
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Po-An Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device package
- Patent number 11,705,412
- Issue date Jul 18, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,670,846
- Issue date Jun 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for manufacturing the same
- Patent number 11,329,007
- Issue date May 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,108,131
- Issue date Aug 31, 2021
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device package
- Patent number 11,037,891
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,018,422
- Issue date May 25, 2021
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 10,847,481
- Issue date Nov 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method for manufacturing the same
- Patent number 10,790,241
- Issue date Sep 29, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 10,546,825
- Issue date Jan 28, 2020
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 10,530,038
- Issue date Jan 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package device
- Patent number 10,199,336
- Issue date Feb 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Shao-En Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA MODULE
- Publication number 20250087887
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20250038136
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE
- Publication number 20240347921
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE STRUCTURE
- Publication number 20240347909
- Publication date Oct 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240275061
- Publication date Aug 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240275060
- Publication date Aug 15, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230389173
- Publication date Nov 30, 2023
- Advanced Semiconductor Engineering, Inc.
- Po-An LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PACKAGE
- Publication number 20230361060
- Publication date Nov 9, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230327333
- Publication date Oct 12, 2023
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20210305181
- Publication date Sep 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210280968
- Publication date Sep 9, 2021
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210050649
- Publication date Feb 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200403305
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381369
- Publication date Dec 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200279815
- Publication date Sep 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200279804
- Publication date Sep 3, 2020
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20200153081
- Publication date May 14, 2020
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20200098709
- Publication date Mar 26, 2020
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20190280367
- Publication date Sep 12, 2019
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20190164916
- Publication date May 30, 2019
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20180342471
- Publication date Nov 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Shao-En HSU
- H01 - BASIC ELECTRIC ELEMENTS

Huei-Shyong CHO

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

Device package

Electronic devices

Device package

Semiconductor device package and method of manufacturing the same

Wiring structure and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Device package

Semiconductor device package and method of manufacturing the same

Semiconductor package device

Wiring structure and method for manufacturing the same

Semiconductor package device

Semiconductor package device

Antenna package device

Patents Applicationslast 30 patents

ANTENNA MODULE

DEVICE PACKAGE

ANTENNA PACKAGE STRUCTURE

ANTENNA PACKAGE STRUCTURE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE

DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGE DEVICE