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Huei-Shyong CHO

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Device package
    • Patent number 12,119,312
    • Issue date Oct 15, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Cheng-Nan Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Electronic devices
    • Patent number 11,997,783
    • Issue date May 28, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Po-An Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Device package
    • Patent number 11,705,412
    • Issue date Jul 18, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Cheng-Nan Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package and method of manufacturing the same
    • Patent number 11,670,846
    • Issue date Jun 6, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring structure and method for manufacturing the same
    • Patent number 11,329,007
    • Issue date May 10, 2022
    • Advanced Semiconductor Engineering, Inc.
    • Wen Hung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package and method of manufacturing the same
    • Patent number 11,108,131
    • Issue date Aug 31, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Device package
    • Patent number 11,037,891
    • Issue date Jun 15, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Cheng-Nan Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device package and method of manufacturing the same
    • Patent number 11,018,422
    • Issue date May 25, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package device
    • Patent number 10,847,481
    • Issue date Nov 24, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wiring structure and method for manufacturing the same
    • Patent number 10,790,241
    • Issue date Sep 29, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Wen Hung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package device
    • Patent number 10,546,825
    • Issue date Jan 28, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package device
    • Patent number 10,530,038
    • Issue date Jan 7, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Antenna package device
    • Patent number 10,199,336
    • Issue date Feb 5, 2019
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En Hsu
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    ANTENNA PACKAGE STRUCTURE
    • Publication number 20240347921
    • Publication date Oct 17, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA PACKAGE STRUCTURE
    • Publication number 20240347909
    • Publication date Oct 17, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240275061
    • Publication date Aug 15, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240275060
    • Publication date Aug 15, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230389173
    • Publication date Nov 30, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Po-An LIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE PACKAGE
    • Publication number 20230361060
    • Publication date Nov 9, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Cheng-Nan LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230327333
    • Publication date Oct 12, 2023
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE PACKAGE
    • Publication number 20210305181
    • Publication date Sep 30, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Cheng-Nan LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20210280968
    • Publication date Sep 9, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20210050649
    • Publication date Feb 18, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20200403305
    • Publication date Dec 24, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20200381369
    • Publication date Dec 3, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Wen Hung HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20200279815
    • Publication date Sep 3, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Wen Hung HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20200279804
    • Publication date Sep 3, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Wen Hung HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20200153081
    • Publication date May 14, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE PACKAGE
    • Publication number 20200098709
    • Publication date Mar 26, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Cheng-Nan LIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20190280367
    • Publication date Sep 12, 2019
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20190164916
    • Publication date May 30, 2019
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE DEVICE
    • Publication number 20180342471
    • Publication date Nov 29, 2018
    • Advanced Semiconductor Engineering, Inc.
    • Shao-En HSU
    • H01 - BASIC ELECTRIC ELEMENTS