Huei-Siang WONG

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 12,094,772
- Issue date Sep 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,776,887
- Issue date Oct 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,600,590
- Issue date Mar 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,437,292
- Issue date Sep 6, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component including a conductive pillar and method of ma...
- Patent number 10,818,627
- Issue date Oct 27, 2020
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359362
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220230915
- Publication date Jul 21, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20210305441
- Publication date Sep 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210210536
- Publication date Jul 8, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210111083
- Publication date Apr 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210017018
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20200303334
- Publication date Sep 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190067230
- Publication date Feb 28, 2019
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS

Huei-Siang WONG

Person

Patents Grantslast 30 patents

Electronic device package and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device and semiconductor package

Semiconductor package device and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Electronic component including a conductive pillar and method of ma...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME