Huili Fu

Person

Shenzhen, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulation of a substrate electrically connected to a plurality...
- Patent number 11,276,645
- Issue date Mar 15, 2022
- Huawei Technologies Co., Ltd.
- Nan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antenna unit and antenna
- Patent number 11,189,927
- Issue date Nov 30, 2021
- Huawei Technologies Co., Ltd.
- Liangsheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 10,903,135
- Issue date Jan 26, 2021
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and manufacturing method
- Patent number 10,784,181
- Issue date Sep 22, 2020
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antenna unit and antenna
- Patent number 10,727,595
- Issue date Jul 28, 2020
- Huawei Technologies Co., Ltd.
- Liangsheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patch antenna unit and antenna
- Patent number 10,693,233
- Issue date Jun 23, 2020
- Huawei Technologies Co., Ltd.
- Liangsheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die and manufacture method thereof
- Patent number 10,607,913
- Issue date Mar 31, 2020
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip
- Patent number 10,475,741
- Issue date Nov 12, 2019
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conical inductor, printed circuit board, and optical module
- Patent number 9,681,549
- Issue date Jun 13, 2017
- Huawei Technologies Co., Ltd.
- Tewei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stacked package structure and electronic device
- Patent number 9,349,708
- Issue date May 24, 2016
- Huawei Technologies Co., Ltd.
- Huili Fu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE VIA STRUCTURES FOR FAR-END CROSSTALK CANCELLATION
- Publication number 20230290723
- Publication date Sep 14, 2023
- T-Head (Shanghai) Semiconductor Co., Ltd.
- YANBIN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND PACKAGING METHOD
- Publication number 20200381361
- Publication date Dec 3, 2020
- Huawei Technologies Co., Ltd
- Nan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patch Antenna Unit and Antenna
- Publication number 20200280132
- Publication date Sep 3, 2020
- Huawei Technologies Co., Ltd
- Liangsheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA-IN-PACKAGE STRUCTURE AND TERMINAL
- Publication number 20200161766
- Publication date May 21, 2020
- Huawei Technologies Co., Ltd
- Liangsheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20200135615
- Publication date Apr 30, 2020
- Huawei Technologies Co., Ltd
- HuiLi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure And Packaging Method
- Publication number 20190273044
- Publication date Sep 5, 2019
- Huawei Technologies Co., Ltd
- HuiLi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patch Antenna Unit and Antenna
- Publication number 20180337456
- Publication date Nov 22, 2018
- Huawei Technologies Co., Ltd
- Liangsheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD
- Publication number 20180308789
- Publication date Oct 25, 2018
- Huawei Technologies Co., Ltd
- Nan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Packaging System
- Publication number 20180247880
- Publication date Aug 30, 2018
- Huawei Technologies Co., Ltd
- HuiLi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20180204825
- Publication date Jul 19, 2018
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure and Manufacturing Method Thereof
- Publication number 20180190569
- Publication date Jul 5, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Manufacturing Method
- Publication number 20180190566
- Publication date Jul 5, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrate and Fabrication Method Thereof, and Integrated Ci...
- Publication number 20180114760
- Publication date Apr 26, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE AND MANUFACTURE METHOD THEREOF
- Publication number 20180068922
- Publication date Mar 8, 2018
- Huawei Technologies Co., Ltd
- HuiLi FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP
- Publication number 20180025973
- Publication date Jan 25, 2018
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONICAL INDUCTOR, PRINTED CIRCUIT BOARD, AND OPTICAL MODULE
- Publication number 20160381803
- Publication date Dec 29, 2016
- Huawei Technologies Co., Ltd
- Tewei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20160035689
- Publication date Feb 4, 2016
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACKED PACKAGE STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20150357307
- Publication date Dec 10, 2015
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20130221537
- Publication date Aug 29, 2013
- Huawei Technologies Co., Ltd
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Chip integration module, chip package structure, and chip integrati...

Encapsulation of a substrate electrically connected to a plurality...

Patch antenna unit and antenna

Chip package structure and manufacturing method thereof

Apparatus and manufacturing method

Patch antenna unit and antenna

Patch antenna unit and antenna

Integrated circuit die and manufacture method thereof

Chip

Conical inductor, printed circuit board, and optical module

Chip stacked package structure and electronic device

Patents Applicationslast 30 patents

CONDUCTIVE VIA STRUCTURES FOR FAR-END CROSSTALK CANCELLATION

CHIP AND PACKAGING METHOD

Patch Antenna Unit and Antenna

ANTENNA-IN-PACKAGE STRUCTURE AND TERMINAL

CHIP PACKAGE STRUCTURE

Chip Package Structure And Packaging Method

Patch Antenna Unit and Antenna

PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND PACKAGING METHOD

Chip Packaging System

CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...

Chip Package Structure and Manufacturing Method Thereof

Apparatus and Manufacturing Method

Package Substrate and Fabrication Method Thereof, and Integrated Ci...

INTEGRATED CIRCUIT DIE AND MANUFACTURE METHOD THEREOF

CHIP

CONICAL INDUCTOR, PRINTED CIRCUIT BOARD, AND OPTICAL MODULE

CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...

CHIP STACKED PACKAGE STRUCTURE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS