Huo Yun Duan

Person

Chengdu City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 12,283,559
- Issue date Apr 22, 2025
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 11,515,275
- Issue date Nov 29, 2022
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH STEPPED CONDUCTIVE TERMINALS
- Publication number 20250112133
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE
- Publication number 20250069999
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
IC PACKAGE WITH IMMERSION TIN ON FLANK
- Publication number 20250046621
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240258215
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mei Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-LOW THICKNESS SEMICONDUCTOR PACKAGE
- Publication number 20240203838
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
- Publication number 20230086535
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
- Publication number 20210313291
- Publication date Oct 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Huo Yun Duan

Person

Patents Grantslast 30 patents

Copper wire bond on gold bump on semiconductor die bond pad

Copper wire bond on gold bump on semiconductor die bond pad

Patents Applicationslast 30 patents

PACKAGES WITH STEPPED CONDUCTIVE TERMINALS

DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE

IC PACKAGE WITH IMMERSION TIN ON FLANK

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

CAPILLARY FOR STITCH BOND

ULTRA-LOW THICKNESS SEMICONDUCTOR PACKAGE

COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD

COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD