Hyeongno Kim

Person

Paju-Si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
EMI shielded semiconductor package
- Patent number 7,576,415
- Issue date Aug 18, 2009
- Advanced Semiconductor Engineering, Inc.
- Sang Jin Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 7,566,962
- Issue date Jul 28, 2009
- Advanced Semiconductor Engineering Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and lead frame for making leadless semiconductor packages
- Patent number 7,169,651
- Issue date Jan 30, 2007
- Advanced Semiconductor Engineering, Inc.
- HyungJun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and lead frame for making leadless semiconductor packages
- Patent number 7,087,461
- Issue date Aug 8, 2006
- Advanced Semiconductor Engineering, Inc.
- HyungJun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation method used in leadless packaging process
- Patent number 6,489,218
- Issue date Dec 3, 2002
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE MAGAZINE
- Publication number 20110259840
- Publication date Oct 27, 2011
- Advanced Semiconductor Engineering, Inc.
- Jeeyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20090127682
- Publication date May 21, 2009
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDED SEMICONDUCTOR PACKAGE
- Publication number 20080308912
- Publication date Dec 18, 2008
- Advanced Semiconductor Engineering, Inc.
- Sang Jin Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and method of manufacturing the same
- Publication number 20080237820
- Publication date Oct 2, 2008
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and manufacturing method thereof
- Publication number 20080237821
- Publication date Oct 2, 2008
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure and manufacturing method thereof
- Publication number 20080197468
- Publication date Aug 21, 2008
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package structure and method for manufacturing the same
- Publication number 20080150110
- Publication date Jun 26, 2008
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process and lead frame for making leadless semiconductor packages
- Publication number 20060035414
- Publication date Feb 16, 2006
- HyungJun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION METHOD USED IN LEADLESS PACKAGING PROCESS
- Publication number 20020197826
- Publication date Dec 26, 2002
- Advanced Semiconductor Engineering, Inc.
- Hyeongno Kim
- H01 - BASIC ELECTRIC ELEMENTS

Hyeongno Kim

Person

Patents Grantslast 30 patents

EMI shielded semiconductor package

Semiconductor package structure and method for manufacturing the same

Process and lead frame for making leadless semiconductor packages

Process and lead frame for making leadless semiconductor packages

Singulation method used in leadless packaging process

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE MAGAZINE

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

EMI SHIELDED SEMICONDUCTOR PACKAGE

Package structure and method of manufacturing the same

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Semiconductor package structure and method for manufacturing the same

Process and lead frame for making leadless semiconductor packages

SINGULATION METHOD USED IN LEADLESS PACKAGING PROCESS