HYUNSOO CHUNG

Person

HWASEONG-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package, and a package on package type semiconductor...
- Patent number 12,166,013
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,159,858
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,154,889
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,948
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,009,328
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,923,292
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Jinkuk Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive bump on conductive post inclu...
- Patent number 11,705,418
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,574,819
- Issue date Feb 7, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stack structure and method of manufactur...
- Patent number 11,488,937
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,430,772
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,362,054
- Issue date Jun 14, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat redistribution layers
- Patent number 11,296,004
- Issue date Apr 5, 2022
- Samsung Electronics Co, Ltd.
- Taewon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,024,575
- Issue date Jun 1, 2021
- Samsung Electronics Co., Ltd.
- Jinkuk Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,937,667
- Issue date Mar 2, 2021
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,699,915
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,211,070
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,960,112
- Issue date May 1, 2018
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with redistribution pads
- Patent number 9,859,204
- Issue date Jan 2, 2018
- Samsung Electronics Co., Ltd.
- Myeong Soon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods of fab...
- Patent number 9,853,012
- Issue date Dec 26, 2017
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package, semiconductor package...
- Patent number 9,508,704
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 9,362,172
- Issue date Jun 7, 2016
- Samsung Electronics Co., Ltd.
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-electrodes and methods for fab...
- Patent number 9,355,961
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods of fab...
- Patent number 9,287,140
- Issue date Mar 15, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods for fa...
- Patent number 9,245,771
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having conductive via structures and methods...
- Patent number 9,171,753
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,165,916
- Issue date Oct 20, 2015
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having conductive through via electrodes in...
- Patent number 9,153,489
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 8,941,216
- Issue date Jan 27, 2015
- Samsung Electronics Co., Ltd.
- Kyu-Ha Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-vias and methods for fabricati...
- Patent number 8,927,426
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including protected barrier layers
- Patent number 8,564,139
- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062286
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062237
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Kwangsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054913
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054915
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046749
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH BACKSIDE POWER DELIVERY NETWORK LAYER
- Publication number 20250029914
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022843
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250022787
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250015048
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250006625
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240395719
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240332200
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- YOUNG LYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234325
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- JOONGHYUN BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222230
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240203939
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153856
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120319
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240088108
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
- Publication number 20240063167
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK SEMICONDUCTOR PACKAGE
- Publication number 20240063155
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240040805
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240032311
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240030187
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD
- Publication number 20240006356
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- INHYO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...
- Publication number 20230154910
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230144602
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- YOUNGLYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THROUGH-SILICON VIA AND METHOD OF F...
- Publication number 20230126686
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- INHYO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SUB-PACKAGE
- Publication number 20230111207
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS

HYUNSOO CHUNG

Person

Patents Grantslast 30 patents

Semiconductor package, and a package on package type semiconductor...

Semiconductor package and method of fabricating the same

Semiconductor package

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor device and method of fabricating the same

Semiconductor package with conductive bump on conductive post inclu...

Semiconductor device and method for manufacturing the same

Semiconductor package with stack structure and method of manufactur...

Semiconductor package

Semiconductor package and method of manufacturing the same

Semiconductor package including heat redistribution layers

Semiconductor device and method of fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor devices with redistribution pads

Semiconductor packages having through electrodes and methods of fab...

Method of fabricating semiconductor package, semiconductor package...

Semiconductor devices having through-vias and methods for fabricati...

Semiconductor devices having through-electrodes and methods for fab...

Semiconductor packages having through electrodes and methods of fab...

Semiconductor packages having through electrodes and methods for fa...

Semiconductor devices having conductive via structures and methods...

Semiconductor package and method of fabricating the same

Microelectronic devices having conductive through via electrodes in...

Semiconductor devices having through-vias and methods for fabricati...

Semiconductor devices having through-vias and methods for fabricati...

Semiconductor devices including protected barrier layers

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH BACKSIDE POWER DELIVERY NETWORK LAYER

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...

STACK SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING THROUGH-SILICON VIA AND METHOD OF F...

SEMICONDUCTOR PACKAGE INCLUDING SUB-PACKAGE