Ian Kent

Person

Calne, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 11,309,255
- Issue date Apr 19, 2022
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level chip scale package structure
- Patent number 11,114,359
- Issue date Sep 7, 2021
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very thin embedded trace substrate-system in package (SIP)
- Patent number 10,636,742
- Issue date Apr 28, 2020
- Dialog Semiconductor (US) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon strip fan out system in package
- Patent number 10,418,342
- Issue date Sep 17, 2019
- Dialog Semiconductor (UK) Limited
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief solutions on WLCSP large/bulk copper plane design
- Patent number 10,083,926
- Issue date Sep 25, 2018
- Dialog Semiconductor (UK) Limited
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on chip attach (passive IPD and PMIC) flip chip BGA using new...
- Patent number 9,929,130
- Issue date Mar 27, 2018
- Dialog Semiconductor GmbH
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20200227356
- Publication date Jul 16, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Package Structure
- Publication number 20200091026
- Publication date Mar 19, 2020
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Thin Embedded Trace Substrate-System in Package (SIP)
- Publication number 20190096815
- Publication date Mar 28, 2019
- Dialog Semiconductor (UK) Limited
- Jesus Mennen Belonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...
- Publication number 20180025965
- Publication date Jan 25, 2018
- Dialog Semiconductor (UK) Limited
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...
- Publication number 20170040309
- Publication date Feb 9, 2017
- DIALOG SEMICONDUCTOR GMBH
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Heat Slug to Enhance Substrate Thermal Conductivity
- Publication number 20140355215
- Publication date Dec 4, 2014
- Baltazar Canete
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...
- Publication number 20140246773
- Publication date Sep 4, 2014
- DIALOG SEMICONDUCTOR GMBH
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Very thin embedded trace substrate-system in package (SIP)

Wafer level chip scale package structure

Very thin embedded trace substrate-system in package (SIP)

Silicon strip fan out system in package

Stress relief solutions on WLCSP large/bulk copper plane design

Chip on chip attach (passive IPD and PMIC) flip chip BGA using new...

Patents Applicationslast 30 patents

Very Thin Embedded Trace Substrate-System in Package (SIP)

Wafer Level Chip Scale Package Structure

Very Thin Embedded Trace Substrate-System in Package (SIP)

WFCQFN (Very-Very Thin Flip Chip Quad Flat No Lead) with Embedded C...

Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...

Embedded Heat Slug to Enhance Substrate Thermal Conductivity

Chip on Chip Attach (Passive IPD and PMIC) Flip Chip BGA Using New...