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Ingo Wennemuth
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Muenchen, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor component comprising an interposer substrate
Patent number
8,624,372
Issue date
Jan 7, 2014
Infineon Technologies AG
Wolfgang Hetzel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component with semiconductor chips, electronic assembly...
Patent number
8,350,364
Issue date
Jan 8, 2013
Qimonda AG
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit and method for producing the same
Patent number
8,143,714
Issue date
Mar 27, 2012
Qimonda AG
Minka Gospodinova-Daltcheva
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device comprising a housing and a semiconductor chip...
Patent number
7,781,900
Issue date
Aug 24, 2010
Infineon Technologies AG
Manuel Carmona
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Placement system for populating a substrate with electronic components
Patent number
7,500,305
Issue date
Mar 10, 2009
Qimonda AG
Jürgen Högerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with a rewiring level and method for producing...
Patent number
7,345,363
Issue date
Mar 18, 2008
Infineon Technologies AG
Minka Gospodinova-Daltcheva
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component with semiconductor chips, electronic assembly...
Patent number
7,342,320
Issue date
Mar 11, 2008
Infineon Technologies AG
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component with multilayered rewiring plate and method fo...
Patent number
7,294,910
Issue date
Nov 13, 2007
Infineon Technologies AG
Jochen Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-supporting connecting element for a semiconductor chip
Patent number
7,253,514
Issue date
Aug 7, 2007
Infineon Technologies, AG
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a stack arrangement of a memory module
Patent number
7,198,979
Issue date
Apr 3, 2007
Infineon Technologies AG
Jochen Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for populating a substrate with electronic components
Patent number
7,069,647
Issue date
Jul 4, 2006
Infineon Technologies AG
Jürgen Högerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
FBGA arrangement
Patent number
7,023,097
Issue date
Apr 4, 2006
Infineon Technologies AG
Jochen Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Covering element for subassemblies
Patent number
6,903,932
Issue date
Jun 7, 2005
Infineon Technologies AG
Ingo Wennemuth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating an electronic component
Patent number
6,872,594
Issue date
Mar 29, 2005
Infineon Technologies AG
Uta Gebauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component with stacked electronic elements
Patent number
6,768,191
Issue date
Jul 27, 2004
Infineon Technologies AG
Ingo Wennemuth
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic device having stacked modules and method for producing it
Patent number
6,703,651
Issue date
Mar 9, 2004
Infineon Technologies AG
Andreas Wörz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component with stacked semiconductor chips and method of...
Patent number
6,686,648
Issue date
Feb 3, 2004
Infineon Technologies AG
Uta Gebauer
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
Publication number
20080230910
Publication date
Sep 25, 2008
Minka Gospodinova-Daltcheva
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor Device Comprising a Housing and a Semiconductor Chip...
Publication number
20080111231
Publication date
May 15, 2008
Manuel Carmona
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Component with Semiconductor Chips, Electronic Assembly...
Publication number
20080048299
Publication date
Feb 28, 2008
Infineon Technologies AG
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated device having a plurality of chip arrangements and metho...
Publication number
20070210433
Publication date
Sep 13, 2007
Rajesh Subraya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor component comprising an interposer substrate and meth...
Publication number
20070040261
Publication date
Feb 22, 2007
Wolfgang Hetzel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device with a rewiring level and method for producing...
Publication number
20060244120
Publication date
Nov 2, 2006
Minka Gospodinova-Daltcheva
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Placement system for populating a substrate with electronic components
Publication number
20060123624
Publication date
Jun 15, 2006
Infineon Technologies AG
Jurgen Hogerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component comprising a multilayer wiring frame and metho...
Publication number
20060043539
Publication date
Mar 2, 2006
Jochen Thomas
B82 - NANO-TECHNOLOGY
Information
Patent Application
Connecting elements on semiconductor chips for semiconductor compon...
Publication number
20050156308
Publication date
Jul 21, 2005
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FBGA arrangement
Publication number
20050098870
Publication date
May 12, 2005
Jochen Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing a stack arrangement of a memory module
Publication number
20040126910
Publication date
Jul 1, 2004
Jochen Thomas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and placement system for populating a substrate with electro...
Publication number
20040111875
Publication date
Jun 17, 2004
Jurgen Hogerl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of fabricating an electronic component
Publication number
20040063245
Publication date
Apr 1, 2004
Infineon Technologies AG
Uta Gebauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component with stacked electronic elements and method fo...
Publication number
20030030143
Publication date
Feb 13, 2003
Ingo Wennemuth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Covering element for subassemblies
Publication number
20030026077
Publication date
Feb 6, 2003
Ingo Wennemuth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component with semiconductor chips, electronic assembly...
Publication number
20020158345
Publication date
Oct 31, 2002
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic component with stacked semiconductor chips and method of...
Publication number
20020094607
Publication date
Jul 18, 2002
Uta Gebauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic device having stacked modules and method for producing it
Publication number
20020034069
Publication date
Mar 21, 2002
Andreas Worz
H01 - BASIC ELECTRIC ELEMENTS