Isha Datye

Person

Hsinchu, TW

People

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226277
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250218899
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250210446
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...
- Publication number 20250201646
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...
- Publication number 20250189383
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192103
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...
- Publication number 20250149345
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
- Publication number 20250140641
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
- Publication number 20250140642
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...
- Publication number 20250140632
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Isha Datye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABR...
- Publication number 20250140640
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME AND INTEGRATED CIRCUIT
- Publication number 20230240081
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...

SEMICONDUCTOR STRUCTURE HAVING THERMAL SENSOR AND MANUFACTURING MET...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

SEMICONDUCTOR STRUCTURE WITH THERMAL DISSIPATION LAYER AND METHOD O...

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS

INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING

INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL VIAS AND HEAT SPREA...

SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION LAYER AND METHOD OF FABR...

MEMORY DEVICE AND METHOD OF FORMING THE SAME AND INTEGRATED CIRCUIT