Ivan Eliashevich

Person

Maplewood, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser lift-off of sapphire from a nitride flip-chip
- Patent number 7,842,547
- Issue date Nov 30, 2010
- Lumination LLC
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized contact design for thermosonic bonding of flip-chip devices
- Patent number 7,667,236
- Issue date Feb 23, 2010
- Lumination LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support with recessed electrically conductive chip attachment mater...
- Patent number 7,635,869
- Issue date Dec 22, 2009
- Lumination LLC
- Boris Kolodin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip light emitting diode devices having thinned or removed su...
- Patent number 7,456,035
- Issue date Nov 25, 2008
- Lumination LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip light emitting diode with indium-tin-oxide based reflecti...
- Patent number 7,358,539
- Issue date Apr 15, 2008
- Lumination LLC
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with series-connected monolithically integrated mesas
- Patent number 7,285,801
- Issue date Oct 23, 2007
- Lumination, LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GaN LED with solderable backside metal
- Patent number 7,190,005
- Issue date Mar 13, 2007
- Gelcore, LLC
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip light emitting diode device without sub-mount
- Patent number 7,179,670
- Issue date Feb 20, 2007
- Gelcore, LLC
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures for gallium nitride-based devices
- Patent number 7,115,896
- Issue date Oct 3, 2006
- Emcore Corporation
- Shiping Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser separation of encapsulated submount
- Patent number 7,087,463
- Issue date Aug 8, 2006
- Gelcore, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral conduction Schottky diode with plural mesas
- Patent number 7,084,475
- Issue date Aug 1, 2006
- Velox Semiconductor Corporation
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser separated die with tapered sidewalls for improved light extra...
- Patent number 7,078,319
- Issue date Jul 18, 2006
- GelCore LLC
- Ivan Eliashevich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip light emitting diode with micromesas and a conductive mesh
- Patent number 7,064,356
- Issue date Jun 20, 2006
- Gelcore, LLC
- Emil P. Stefanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having improved light extraction
- Patent number 7,023,022
- Issue date Apr 4, 2006
- Emcore Corporation
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Led packages having improved light extraction
- Patent number 7,015,516
- Issue date Mar 21, 2006
- GelCore LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED power package
- Patent number 6,964,877
- Issue date Nov 15, 2005
- Gelcore, LLC
- Chen-Lun Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimized contact design for flip-chip LED
- Patent number 6,958,498
- Issue date Oct 25, 2005
- Emcore Corporation
- Bryan Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device separation using a patterned laser projection
- Patent number 6,902,990
- Issue date Jun 7, 2005
- Emcore Corporation
- Mark Gottfried
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer protection and cleaning for device separation u...
- Patent number 6,849,524
- Issue date Feb 1, 2005
- Emcore Corporation
- Bryan S. Shelton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
GaN LED with solderable backside metal
- Patent number 6,787,435
- Issue date Sep 7, 2004
- GelCore LLC
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device with improved light extraction
- Patent number 6,746,889
- Issue date Jun 8, 2004
- Emcore Corporation
- Ivan Eliashevich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED devices
- Patent number 6,661,167
- Issue date Dec 9, 2003
- GelCore LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact to n-GaN with Au termination
- Patent number 6,653,215
- Issue date Nov 25, 2003
- Emcore Corporation
- Michael G. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diodes with loop and strip electrodes and with wide...
- Patent number 6,642,548
- Issue date Nov 4, 2003
- Emcore Corporation
- Michael G. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device separation using a patterned laser projection
- Patent number 6,413,839
- Issue date Jul 2, 2002
- Emcore Corporation
- Michael G. Brown
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION
- Publication number 20100181584
- Publication date Jul 22, 2010
- Xiang Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROBUST DIE BONDING PROCESS FOR LED DIES
- Publication number 20090155958
- Publication date Jun 18, 2009
- Boris Kolodin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Super thin LED package for the backlighting applications and fabric...
- Publication number 20080145960
- Publication date Jun 19, 2008
- GELCORE, LLC
- Boris Kolodin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Lift-Off of Sapphire From a Nitride Flip-Chip
- Publication number 20080113460
- Publication date May 15, 2008
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support for flip-chip bonding a light emitting chip
- Publication number 20080067537
- Publication date Mar 20, 2008
- GELCORE LLC
- Boris Kolodin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Mount Light Emitting Chip Package
- Publication number 20080035947
- Publication date Feb 14, 2008
- Stanton Earl Weaver Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super bright LED power package
- Publication number 20070236956
- Publication date Oct 11, 2007
- GELCORE, LLC
- Boris Kolodin
- G02 - OPTICS
Information Patent Application
Optimized contact design for thermosonic bonding of flip-chip devices
- Publication number 20070145379
- Publication date Jun 28, 2007
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip light emitting diode device without sub-mount
- Publication number 20070114557
- Publication date May 24, 2007
- GELCORE, LLC
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral current GaN flip chip LED with shaped transparent substrate
- Publication number 20070096120
- Publication date May 3, 2007
- GELCORE LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser separation of encapsulated submount
- Publication number 20070004088
- Publication date Jan 4, 2007
- GELCORE, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gallium nitride-based devices and manufacturing process
- Publication number 20060154455
- Publication date Jul 13, 2006
- Emcore Corporation
- Shiping Guo
- C30 - CRYSTAL GROWTH
Information Patent Application
Laser separation of encapsulated submount
- Publication number 20060030125
- Publication date Feb 9, 2006
- GELCORE, LLC
- Michael Sackrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick laser-scribed GaN-on-sapphire optoelectronic devices
- Publication number 20050263854
- Publication date Dec 1, 2005
- Bryan S. Shelton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP LIGHT EMITTING DIODE WITH MICROMESAS AND A CONDUCTIVE MESH
- Publication number 20050230700
- Publication date Oct 20, 2005
- GELCORE, LLC
- Emil P. Stefanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED with series-connected monolithically integrated mesas
- Publication number 20050225973
- Publication date Oct 13, 2005
- GELCORE, LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip light emitting diode device without sub-mount
- Publication number 20050194605
- Publication date Sep 8, 2005
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral conduction schottky diode with plural mesas
- Publication number 20050179104
- Publication date Aug 18, 2005
- Emcore Corporation
- Bryan S. Shelton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip light emitting diode devices having thinned or removed su...
- Publication number 20050023550
- Publication date Feb 3, 2005
- GELCORE, LLC
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device separation using a patterned laser projection
- Publication number 20050003634
- Publication date Jan 6, 2005
- Michael G. Brown
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrode structures for p-type nitride semiconductores and methods...
- Publication number 20040248335
- Publication date Dec 9, 2004
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GaN LED with solderable backside metal
- Publication number 20040232439
- Publication date Nov 25, 2004
- GELCORE LLC
- Shawn R. Gibb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip light emitting diode
- Publication number 20040211972
- Publication date Oct 28, 2004
- GELCORE, LLC
- Shawn X. Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP LIGHT EMITTING DIODE WITH INDIUM-TIN-OXIDE BASED REFLECTI...
- Publication number 20040201110
- Publication date Oct 14, 2004
- Emcore Corporation
- Hari S. Venugopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED power package
- Publication number 20040203189
- Publication date Oct 14, 2004
- GELCORE LLC
- Chen-Lun Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED power package
- Publication number 20040188696
- Publication date Sep 30, 2004
- GELCORE, LLC
- Chen-Lun Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gallium nitride-based devices and manufacturing process
- Publication number 20040119063
- Publication date Jun 24, 2004
- Emcore Corporation
- Shiping Guo
- C30 - CRYSTAL GROWTH
Information Patent Application
Laser separated die with tapered sidewalls for improved light extra...
- Publication number 20040118825
- Publication date Jun 24, 2004
- Ivan Eliashevich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light extraction efficiency of gan based leds
- Publication number 20040113168
- Publication date Jun 17, 2004
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Led packages having improved light extraction
- Publication number 20040070004
- Publication date Apr 15, 2004
- Ivan Eliashevich
- H01 - BASIC ELECTRIC ELEMENTS

Ivan Eliashevich

Person

Patents Grantslast 30 patents

Laser lift-off of sapphire from a nitride flip-chip

Optimized contact design for thermosonic bonding of flip-chip devices

Support with recessed electrically conductive chip attachment mater...

Flip chip light emitting diode devices having thinned or removed su...

Flip-chip light emitting diode with indium-tin-oxide based reflecti...

LED with series-connected monolithically integrated mesas

GaN LED with solderable backside metal

Flip-chip light emitting diode device without sub-mount

Semiconductor structures for gallium nitride-based devices

Laser separation of encapsulated submount

Lateral conduction Schottky diode with plural mesas

Laser separated die with tapered sidewalls for improved light extra...

Flip chip light emitting diode with micromesas and a conductive mesh

Microelectronic package having improved light extraction

Led packages having improved light extraction

LED power package

Optimized contact design for flip-chip LED

Semiconductor device separation using a patterned laser projection

Semiconductor wafer protection and cleaning for device separation u...

GaN LED with solderable backside metal

Optoelectronic device with improved light extraction

LED devices

Contact to n-GaN with Au termination

Light-emitting diodes with loop and strip electrodes and with wide...

Semiconductor device separation using a patterned laser projection

Patents Applicationslast 30 patents

LASER LIFT-OFF WITH IMPROVED LIGHT EXTRACTION

ROBUST DIE BONDING PROCESS FOR LED DIES

Super thin LED package for the backlighting applications and fabric...

Laser Lift-Off of Sapphire From a Nitride Flip-Chip

Support for flip-chip bonding a light emitting chip

Surface Mount Light Emitting Chip Package

Super bright LED power package

Optimized contact design for thermosonic bonding of flip-chip devices

Flip-chip light emitting diode device without sub-mount

Lateral current GaN flip chip LED with shaped transparent substrate

Laser separation of encapsulated submount

Gallium nitride-based devices and manufacturing process

Laser separation of encapsulated submount

Thick laser-scribed GaN-on-sapphire optoelectronic devices

FLIP CHIP LIGHT EMITTING DIODE WITH MICROMESAS AND A CONDUCTIVE MESH

LED with series-connected monolithically integrated mesas

Flip-chip light emitting diode device without sub-mount

Lateral conduction schottky diode with plural mesas

Flip chip light emitting diode devices having thinned or removed su...

Semiconductor device separation using a patterned laser projection

Electrode structures for p-type nitride semiconductores and methods...

GaN LED with solderable backside metal

Flip-chip light emitting diode

FLIP-CHIP LIGHT EMITTING DIODE WITH INDIUM-TIN-OXIDE BASED REFLECTI...

LED power package

LED power package

Gallium nitride-based devices and manufacturing process

Laser separated die with tapered sidewalls for improved light extra...

Light extraction efficiency of gan based leds

Led packages having improved light extraction