Iwona Turlik

Person

Raleigh, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic module having optical and electrical interconnects
- Patent number 5,923,796
- Issue date Jul 13, 1999
- MCNC
- Michael R. Feldman
- G02 - OPTICS
Information Patent Grant
Microelectronic module having optical and electrical interconnects
- Patent number 5,638,469
- Issue date Jun 10, 1997
- MCNC
- Michael R. Feldman
- G02 - OPTICS
Information Patent Grant
Recessed via apparatus for testing, burn-in, and/or programming of...
- Patent number 5,447,264
- Issue date Sep 5, 1995
- MCNC
- Nicholas G. Koopman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming differing volume solder bumps
- Patent number 5,381,946
- Issue date Jan 17, 1995
- MCNC
- Nicholas G. Koopman
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for testing, burn-in, and/or programming of integrated ci...
- Patent number 5,374,893
- Issue date Dec 20, 1994
- MCNC
- Nicholas G. Koopman
- G01 - MEASURING TESTING
Information Patent Grant
High performance integrated circuit chip package
- Patent number 5,325,265
- Issue date Jun 28, 1994
- MCNC
- Iwona Turlik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for testing, burn-in, and/or programming of integrated circu...
- Patent number 5,289,631
- Issue date Mar 1, 1994
- MCNC
- Nicholas G. Koopman
- G01 - MEASURING TESTING
Information Patent Grant
Microelectronic module having optical and electrical interconnects
- Patent number 5,237,434
- Issue date Aug 17, 1993
- MCNC
- Michael R. Feldman
- G02 - OPTICS
Information Patent Grant
Method of making high density semiconductor structure
- Patent number 5,168,078
- Issue date Dec 1, 1992
- MCNC
- Arnold Reisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-organic chemical vapor deposition for repairing broken lines...
- Patent number 5,145,714
- Issue date Sep 8, 1992
- MCNC
- Arnold Reisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density semiconductor structure and method of making the same
- Patent number 5,025,304
- Issue date Jun 18, 1991
- MCNC
- Arnold Reisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-to-metal bonding method and resulting structure
- Patent number 5,009,360
- Issue date Apr 23, 1991
- MCNC
- Arnold Reisman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Iwona Turlik

Person

Patents Grantslast 30 patents

Microelectronic module having optical and electrical interconnects

Microelectronic module having optical and electrical interconnects

Recessed via apparatus for testing, burn-in, and/or programming of...

Method of forming differing volume solder bumps

Apparatus for testing, burn-in, and/or programming of integrated ci...

High performance integrated circuit chip package

Method for testing, burn-in, and/or programming of integrated circu...

Microelectronic module having optical and electrical interconnects

Method of making high density semiconductor structure

Metal-organic chemical vapor deposition for repairing broken lines...

High density semiconductor structure and method of making the same

Metal-to-metal bonding method and resulting structure