Number | Name | Date | Kind |
---|---|---|---|
1128515 | Rietzel | Feb 1915 | |
4209893 | Dyce et al. | Jul 1980 | |
4774760 | Seaman et al. | Oct 1988 | |
4950623 | Dishon | Aug 1990 | |
4975079 | Beaman et al. | Dec 1990 | |
5006792 | Malhi et al. | Apr 1991 | |
5007163 | Pope et al. | Apr 1991 | |
5065227 | Frankeny et al. | Nov 1991 | |
5071359 | Arnio et al. | Dec 1991 | |
5073117 | Malhi et al. | Dec 1991 | |
5118386 | Kataoka et al. | Jun 1992 | |
5161729 | Dunaway et al. | Nov 1992 | |
5213676 | Reele et al. | May 1993 | |
5234149 | Katz et al. | Aug 1993 | |
5237269 | Aimi et al. | Aug 1993 | |
5245751 | Locke et al. | Sep 1993 | |
5289631 | Koopman et al. | Mar 1994 | |
5323947 | Juskey et al. | Jun 1994 |
Number | Date | Country |
---|---|---|
55-111127 | Aug 1980 | JPX |
2247565 | Mar 1992 | GBX |
Entry |
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Solder Rework Technique, R. J. Herdzik and P. A. Totta, IBM Technical Bulletin, vol. 21, No. 12, May 1979. |
Solder Volume Optimization, R. J. Herdzik and P. A. Totta, IBM Technical Bulletin, vol. 21, No. 12, May 1979. |
Decal Solder Transfer, R. J. Herdzik and P. A. Totta, IBM Technical Bulletin, vol. 22, No. 12, Aug. 1979. |
Method to Change Solder Composition of Chip, R. J. Herdzik and P. A. Totta, IBM Technical Bulletin, vol. 22, No. 3, Aug. 1979. |