Jack Chang Chien

Person

Kaoshiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Two-sided substrate lead connection for minimizing kerf width on a...
- Patent number 8,637,972
- Issue date Jan 28, 2014
- SanDisk Technologies Inc.
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between transfer molded IC packages a...
- Patent number 8,482,139
- Issue date Jul 9, 2013
- SanDisk Technologies Inc.
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods of promoting adhesion between transfer molded IC packages a...
- Patent number 8,232,145
- Issue date Jul 31, 2012
- SanDisk Technologies Inc.
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor die having a redistribution layer
- Patent number 8,212,360
- Issue date Jul 3, 2012
- SanDisk Technologies Inc.
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Padless substrate for surface mounted components
- Patent number 7,967,184
- Issue date Jun 28, 2011
- SanDisk Corporation
- Chih-Chin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having through holes for molding back side of...
- Patent number 7,952,179
- Issue date May 31, 2011
- SanDisk Corporation
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package having through holes...
- Patent number 7,939,382
- Issue date May 10, 2011
- SanDisk Corporation
- Chin-Tien Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die having a redistribution layer
- Patent number 7,939,944
- Issue date May 10, 2011
- SanDisk Corporation
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor die having a redistribution l...
- Patent number 7,772,047
- Issue date Aug 10, 2010
- SanDisk Corporation
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die having a distribution layer
- Patent number 7,763,980
- Issue date Jul 27, 2010
- SanDisk Corporation
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of promoting adhesion between transfer molded IC packages a...
- Patent number 7,615,861
- Issue date Nov 10, 2009
- SanDisk Corporation
- Che-Jung Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of minimizing kerf width on a semiconductor substrate panel
- Patent number 7,611,927
- Issue date Nov 3, 2009
- SanDisk Corporation
- Chih-Chin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
- Publication number 20110210446
- Publication date Sep 1, 2011
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
- Publication number 20100289147
- Publication date Nov 18, 2010
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...
- Publication number 20100052155
- Publication date Mar 4, 2010
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...
- Publication number 20100055847
- Publication date Mar 4, 2010
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING
- Publication number 20090085231
- Publication date Apr 2, 2009
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES FOR MOLDING BACK SIDE OF...
- Publication number 20090001552
- Publication date Jan 1, 2009
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER
- Publication number 20090001610
- Publication date Jan 1, 2009
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DIE HAVING A REDISTRIBUTION L...
- Publication number 20090004781
- Publication date Jan 1, 2009
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES...
- Publication number 20090004785
- Publication date Jan 1, 2009
- Chin-Tien Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-SIDED SUBSTRATE LEAD CONNECTION FOR MINIMIZING KERF WIDTH ON A...
- Publication number 20080303166
- Publication date Dec 11, 2008
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL
- Publication number 20080305577
- Publication date Dec 11, 2008
- Chih-Chin Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
- Publication number 20070262434
- Publication date Nov 15, 2007
- SANDISK CORPORATION
- Chin-Tien Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of promoting adhesion between transfer molded ic packages a...
- Publication number 20070210444
- Publication date Sep 13, 2007
- Che-Jung Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Interconnected IC packages with vertical SMT pads
- Publication number 20070158799
- Publication date Jul 12, 2007
- Chin-Tien Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Padless substrate for surface mounted components
- Publication number 20070108257
- Publication date May 17, 2007
- Chih-Chin Liao
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor die package including construction for preventing del...
- Publication number 20070096285
- Publication date May 3, 2007
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Jack Chang Chien

Person

Patents Grantslast 30 patents

Two-sided substrate lead connection for minimizing kerf width on a...

Methods of promoting adhesion between transfer molded IC packages a...

Methods of promoting adhesion between transfer molded IC packages a...

Semiconductor die having a redistribution layer

Padless substrate for surface mounted components

Semiconductor package having through holes for molding back side of...

Method of fabricating a semiconductor package having through holes...

Semiconductor die having a redistribution layer

Method of fabricating a semiconductor die having a redistribution l...

Semiconductor die having a distribution layer

Methods of promoting adhesion between transfer molded IC packages a...

Method of minimizing kerf width on a semiconductor substrate panel

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER

SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER

METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...

METHODS OF PROMOTING ADHESION BETWEEN TRANSFER MOLDED IC PACKAGES A...

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES FOR MOLDING BACK SIDE OF...

SEMICONDUCTOR DIE HAVING A REDISTRIBUTION LAYER

METHOD OF FABRICATING A SEMICONDUCTOR DIE HAVING A REDISTRIBUTION L...

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE HAVING THROUGH HOLES...

TWO-SIDED SUBSTRATE LEAD CONNECTION FOR MINIMIZING KERF WIDTH ON A...

METHOD OF MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

Methods of promoting adhesion between transfer molded ic packages a...

Interconnected IC packages with vertical SMT pads

Padless substrate for surface mounted components

Semiconductor die package including construction for preventing del...