Jacques J. Bertrand

Person

Capitola, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Trenches to reduce lateral silicide growth in integrated circuit te...
- Patent number 7,023,059
- Issue date Apr 4, 2006
- Advanced Micro Devices, Inc.
- Darin A. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step process for nickel deposition
- Patent number 6,841,449
- Issue date Jan 11, 2005
- Advanced Micro Devices, Inc.
- Jacques J. Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Effect of substrate surface treatment on 193 NM resist processing
- Patent number 6,746,973
- Issue date Jun 8, 2004
- Advanced Micro Devices, Inc.
- Catherine B. Labelle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium barrier for nickel silicidation of a gate electrode
- Patent number 6,730,587
- Issue date May 4, 2004
- Advanced Micro Devices, Inc.
- Jacques J. Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step process for nickel deposition
- Patent number 6,689,687
- Issue date Feb 10, 2004
- Advanced Micro Devices, Inc.
- Jacques J. J. Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step process for nickel deposition
- Patent number 6,632,740
- Issue date Oct 14, 2003
- Advanced Micro Devices, Inc.
- Jacques J. Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked double sidewall spacer oxide over nitride
- Patent number 6,627,504
- Issue date Sep 30, 2003
- Advanced Micro Devices, Inc.
- Jacques J. Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming nickel silicide using a one-step rapid thermal an...
- Patent number 6,605,513
- Issue date Aug 12, 2003
- Advanced Micro Devices, Inc.
- Eric N. Paton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming fully silicided gates
- Patent number 6,562,718
- Issue date May 13, 2003
- Advanced Micro Devices, Inc.
- Qi Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt barrier for nickel silicidation of a gate electrode
- Patent number 6,541,866
- Issue date Apr 1, 2003
- Advanced Micro Devices, Inc.
- Jacques J. Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel silicide process using starved silicon diffusion barrier
- Patent number 6,525,391
- Issue date Feb 25, 2003
- Advanced Micro Devices, Inc.
- Jacques Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel silicide process using UDOX to prevent silicide shorting
- Patent number 6,507,123
- Issue date Jan 14, 2003
- Advanced Micro Devices, Inc.
- Christy Mei-Chu Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer silicide formation using a titanium barrier to reduce su...
- Patent number 6,495,460
- Issue date Dec 17, 2002
- Advanced Micro Devices, Inc.
- Jacques Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer nickel deposition using a cobalt barrier to reduce surfa...
- Patent number 6,468,900
- Issue date Oct 22, 2002
- Advanced Micro Devices, Inc.
- Jacques Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten silicide barrier for nickel silicidation of a gate electrode
- Patent number 6,432,817
- Issue date Aug 13, 2002
- Advanced Micro Devices, Inc.
- Jacques J. Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nickel silicide stripping after nickel silicide formation
- Patent number 6,362,095
- Issue date Mar 26, 2002
- Advanced Micro Devices, Inc.
- Christy Mei-Chu Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Salsa clean process
- Patent number 6,340,395
- Issue date Jan 22, 2002
- Advanced Micro Devices, Inc.
- Jacques Bertrand
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Minimizing metal corrosion during post metal solvent clean
- Patent number 6,274,504
- Issue date Aug 14, 2001
- Advanced Micro Devices, Inc.
- Anne E. Sanderfer
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Low-k photoresist removal process
- Patent number 6,235,453
- Issue date May 22, 2001
- Advanced Micro Devices, Inc.
- Lu You
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photoresist stripping without degrading low dielectric constant mat...
- Patent number 6,030,901
- Issue date Feb 29, 2000
- Advanced Micro Devices, Inc.
- Dawn Hopper
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING NICKEL SILICIDE USING A ONE-STEP RAPID THERMAL AN...
- Publication number 20020068408
- Publication date Jun 6, 2002
- Advanced Micro Devices, Inc.
- Eric N. Paton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual layer silicide formation using an aluminum barrier to reduce s...
- Publication number 20020068444
- Publication date Jun 6, 2002
- Jacques Bertrand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Minimizing metal corrosion during post metal solvent clean
- Publication number 20010027017
- Publication date Oct 4, 2001
- Anne E. Sanderfer
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
MINIMIZING METAL CORROSION DURING POST METAL SOLVENT CLEAN
- Publication number 20010001736
- Publication date May 24, 2001
- ANNE E. SANDERFER
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Jacques J. Bertrand

Person

Patents Grantslast 30 patents

Trenches to reduce lateral silicide growth in integrated circuit te...

Two-step process for nickel deposition

Effect of substrate surface treatment on 193 NM resist processing

Titanium barrier for nickel silicidation of a gate electrode

Two-step process for nickel deposition

Two-step process for nickel deposition

Stacked double sidewall spacer oxide over nitride

Method of forming nickel silicide using a one-step rapid thermal an...

Process for forming fully silicided gates

Cobalt barrier for nickel silicidation of a gate electrode

Nickel silicide process using starved silicon diffusion barrier

Nickel silicide process using UDOX to prevent silicide shorting

Dual layer silicide formation using a titanium barrier to reduce su...

Dual layer nickel deposition using a cobalt barrier to reduce surfa...

Tungsten silicide barrier for nickel silicidation of a gate electrode

Nickel silicide stripping after nickel silicide formation

Salsa clean process

Minimizing metal corrosion during post metal solvent clean

Low-k photoresist removal process

Photoresist stripping without degrading low dielectric constant mat...

Patents Applicationslast 30 patents

METHOD OF FORMING NICKEL SILICIDE USING A ONE-STEP RAPID THERMAL AN...

Dual layer silicide formation using an aluminum barrier to reduce s...

Minimizing metal corrosion during post metal solvent clean

MINIMIZING METAL CORROSION DURING POST METAL SOLVENT CLEAN