Jae Sik Lee

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density fan out package structure
- Patent number 10,157,823
- Issue date Dec 18, 2018
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package on package structure and method of forming th...
- Patent number 10,049,977
- Issue date Aug 14, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate block for PoP package
- Patent number 9,881,859
- Issue date Jan 30, 2018
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package configurations and methods of making the same
- Patent number 9,799,628
- Issue date Oct 24, 2017
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer crack stop seal ring structure in wafer level package
- Patent number 9,679,855
- Issue date Jun 13, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising flexible connector between integrated...
- Patent number 9,633,950
- Issue date Apr 25, 2017
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for a package-on-package structure
- Patent number 9,613,942
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with conductive vias
- Patent number 9,596,768
- Issue date Mar 14, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising silicon bridge in an encapsula...
- Patent number 9,595,496
- Issue date Mar 14, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high density die to die connection and m...
- Patent number 9,595,494
- Issue date Mar 14, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene re-distribution layer (RDL) in fan out split die application
- Patent number 9,583,462
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution improvement using pseudo-ESR control of an embed...
- Patent number 9,472,425
- Issue date Oct 18, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising via with side barrier layer traversing...
- Patent number 9,466,554
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity bridge connection for die split architecture
- Patent number 9,443,824
- Issue date Sep 13, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising high density interconnects in inorgani...
- Patent number 9,418,877
- Issue date Aug 16, 2016
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) structure including multiple dies
- Patent number 9,401,350
- Issue date Jul 26, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising bridge in litho-etchable layer
- Patent number 9,368,450
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package interconnections and method of making the same
- Patent number 9,355,963
- Issue date May 31, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern between pattern for low profile substrate
- Patent number 9,269,610
- Issue date Feb 23, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising high density interconnects and redistr...
- Patent number 9,230,936
- Issue date Jan 5, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for reverse link transmission in an access ter...
- Patent number 8,266,490
- Issue date Sep 11, 2012
- Via Telecom, Inc.
- Su-Lin Low
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Quality of service control of reverse traffic channel for a mobile...
- Patent number 8,228,817
- Issue date Jul 24, 2012
- Via Telecom, Inc.
- Jae Sun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT WAFER-LEVEL PACKAGES WITH IMPROVED TOPOLOGY
- Publication number 20170243845
- Publication date Aug 24, 2017
- QUALCOMM Incorporated
- Jae Sik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE
- Publication number 20160379959
- Publication date Dec 29, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20160358899
- Publication date Dec 8, 2016
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND M...
- Publication number 20160329284
- Publication date Nov 10, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE CONFIGURATIONS AND METHODS OF MAKING THE SAME
- Publication number 20160293574
- Publication date Oct 6, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE
- Publication number 20160293572
- Publication date Oct 6, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION IMPROVEMENT USING PSEUDO-ESR CONTROL OF AN EMBED...
- Publication number 20160276173
- Publication date Sep 22, 2016
- QUALCOMM Incorporated
- Young Kyu SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE (POP) STRUCTURE
- Publication number 20160225748
- Publication date Aug 4, 2016
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE RE-DISTRIBUTION LAYER (RDL) IN FAN OUT SPLIT DIE APPLICATION
- Publication number 20160218082
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Jae Sik LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEA...
- Publication number 20160141234
- Publication date May 19, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN AN ENCAPSULA...
- Publication number 20160133571
- Publication date May 12, 2016
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY FAN OUT PACKAGE STRUCTURE
- Publication number 20160126173
- Publication date May 5, 2016
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME
- Publication number 20160093571
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Dong Wook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING P...
- Publication number 20160091532
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Young Kyu Song
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING TH...
- Publication number 20160035664
- Publication date Feb 4, 2016
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BLOCK FOR PoP PACKAGE
- Publication number 20150325509
- Publication date Nov 12, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...
- Publication number 20150318262
- Publication date Nov 5, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN BETWEEN PATTERN FOR LOW PROFILE SUBSTRATE
- Publication number 20150294933
- Publication date Oct 15, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS AND REDISTR...
- Publication number 20150255416
- Publication date Sep 10, 2015
- QUALCOMM Incorporated
- Dong Wook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH CONDUCTIVE VIAS
- Publication number 20150257282
- Publication date Sep 10, 2015
- QUALCOMM Incorporated
- Hong Bok We
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED DEVICE COMPRISING VIA WITH SIDE BARRIER LAYER TRAVERSING...
- Publication number 20150228556
- Publication date Aug 13, 2015
- QUALCOMM Incorporated
- Jae Sik Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-ENABLED PACKAGE-ON-PACKAGE
- Publication number 20140252561
- Publication date Sep 11, 2014
- QUALCOMM Incorporated
- Durodami Joscelyn Lisk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUALITY OF SERVICE CONTROL OF REVERSE TRAFFIC CHANNEL FOR A MOBILE...
- Publication number 20110242998
- Publication date Oct 6, 2011
- VIA TELECOM, INC.
- Jae Sun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHOD FOR REVERSE LINK TRANSMISSION IN AN ACCESS TER...
- Publication number 20100262881
- Publication date Oct 14, 2010
- VIA TELECOM, INC.
- Su-Lin Low
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Jae Sik Lee

Person

Patents Grantslast 30 patents

High density fan out package structure

Semiconductor package on package structure and method of forming th...

Substrate block for PoP package

Stacked package configurations and methods of making the same

Polymer crack stop seal ring structure in wafer level package

Integrated device comprising flexible connector between integrated...

Interposer for a package-on-package structure

Substrate with conductive vias

Integrated device package comprising silicon bridge in an encapsula...

Semiconductor package with high density die to die connection and m...

Damascene re-distribution layer (RDL) in fan out split die application

Power distribution improvement using pseudo-ESR control of an embed...

Integrated device comprising via with side barrier layer traversing...

Cavity bridge connection for die split architecture

Integrated device comprising high density interconnects in inorgani...

Package-on-package (POP) structure including multiple dies

Integrated device package comprising bridge in litho-etchable layer

Semiconductor package interconnections and method of making the same

Pattern between pattern for low profile substrate

Integrated device comprising high density interconnects and redistr...

Apparatus and method for reverse link transmission in an access ter...

Quality of service control of reverse traffic channel for a mobile...

Patents Applicationslast 30 patents

FAN-OUT WAFER-LEVEL PACKAGES WITH IMPROVED TOPOLOGY

CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE

INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE WITH HIGH DENSITY DIE TO DIE CONNECTION AND M...

STACKED PACKAGE CONFIGURATIONS AND METHODS OF MAKING THE SAME

CAVITY BRIDGE CONNECTION FOR DIE SPLIT ARCHITECTURE

POWER DISTRIBUTION IMPROVEMENT USING PSEUDO-ESR CONTROL OF AN EMBED...

PACKAGE-ON-PACKAGE (POP) STRUCTURE

DAMASCENE RE-DISTRIBUTION LAYER (RDL) IN FAN OUT SPLIT DIE APPLICATION

INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN PHOTO IMAGEA...

INTEGRATED DEVICE PACKAGE COMPRISING SILICON BRIDGE IN AN ENCAPSULA...

HIGH DENSITY FAN OUT PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INTERCONNECTIONS AND METHOD OF MAKING THE SAME

FLEXIBLE FILM ELECTRICAL-TEST SUBSTRATES WITH CONDUCTIVE COUPLING P...

SEMICONDUCTOR PACKAGE ON PACKAGE STRUCTURE AND METHOD OF FORMING TH...

SUBSTRATE BLOCK FOR PoP PACKAGE

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS IN INORGANI...

PATTERN BETWEEN PATTERN FOR LOW PROFILE SUBSTRATE

INTEGRATED DEVICE COMPRISING HIGH DENSITY INTERCONNECTS AND REDISTR...

SUBSTRATE WITH CONDUCTIVE VIAS

INTEGRATED DEVICE COMPRISING VIA WITH SIDE BARRIER LAYER TRAVERSING...

VIA-ENABLED PACKAGE-ON-PACKAGE

QUALITY OF SERVICE CONTROL OF REVERSE TRAFFIC CHANNEL FOR A MOBILE...

APPARATUS AND METHOD FOR REVERSE LINK TRANSMISSION IN AN ACCESS TER...